Nobuyuki Kurashima

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,575,030
- Issue date Nov 5, 2013
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 8,174,125
- Issue date May 8, 2012
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP treating liquid and manufacturing method of semiconductor...
- Patent number 7,951,717
- Issue date May 31, 2011
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry for metallic film, polishing method and method of manufa...
- Patent number 7,842,191
- Issue date Nov 30, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aqueous dispersion for CMP, polishing method and method for manufac...
- Patent number 7,833,431
- Issue date Nov 16, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,825,028
- Issue date Nov 2, 2010
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP treating liquid and manufacturing method of semiconductor...
- Patent number 7,655,559
- Issue date Feb 2, 2010
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 7,521,350
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device and polishing method
- Patent number 7,494,931
- Issue date Feb 24, 2009
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device including a discontinuous film and method for...
- Patent number 7,307,344
- Issue date Dec 11, 2007
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry and method of manufacturing semiconductor device
- Patent number 7,198,729
- Issue date Apr 3, 2007
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing a dummy wire
- Patent number 7,042,099
- Issue date May 9, 2006
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing slurry for use in CMP of SiC series compound, polishing m...
- Patent number 6,995,090
- Issue date Feb 7, 2006
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method and apparatus
- Patent number 6,945,854
- Issue date Sep 20, 2005
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing aqueous dispersion and chemical mecha...
- Patent number 6,935,928
- Issue date Aug 30, 2005
- JSR Corporation
- Kazuhito Uchikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for chemical mechanical polishing and method of manufacturin...
- Patent number 6,924,227
- Issue date Aug 2, 2005
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Post-CMP treating liquid and method for manufacturing semiconductor...
- Patent number 6,858,539
- Issue date Feb 22, 2005
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry and method of manufacturing semiconductor device
- Patent number 6,790,769
- Issue date Sep 14, 2004
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,737,363
- Issue date May 18, 2004
- Kabushiki Kaisha Toshiba
- Hideshi Miyajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120034846
- Publication date Feb 9, 2012
- Gaku MINAMIHABA
- B24 - GRINDING POLISHING
Information Patent Application
CLEANING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20110192420
- Publication date Aug 11, 2011
- Nobuyuki KURASHIMA
- B08 - CLEANING
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20110195888
- Publication date Aug 11, 2011
- Nobuyuki KURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP slurry for metallic film, polishing method and method of manufa...
- Publication number 20110062374
- Publication date Mar 17, 2011
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20100093585
- Publication date Apr 15, 2010
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20090184415
- Publication date Jul 23, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20090176372
- Publication date Jul 9, 2009
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090068840
- Publication date Mar 12, 2009
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manunfacturing semiconductor device
- Publication number 20090061626
- Publication date Mar 5, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20080216415
- Publication date Sep 11, 2008
- Nobuyuki KURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a discontinuous film and method for...
- Publication number 20080124927
- Publication date May 29, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING COMPOSITION, CLEANING METHOD, AND MANUFACTURING METHOD OF...
- Publication number 20080045016
- Publication date Feb 21, 2008
- JSR Corporation
- Michiaki Andou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for touch-up CMP and method of manufacturing semiconductor d...
- Publication number 20070232068
- Publication date Oct 4, 2007
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20070190770
- Publication date Aug 16, 2007
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AQUEOUS DISPERSION FOR CMP, POLISHING METHOD AND METHOD FOR MANUFAC...
- Publication number 20070128873
- Publication date Jun 7, 2007
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for fabricating semiconductor device and polishing method
- Publication number 20070072427
- Publication date Mar 29, 2007
- Dai Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Aqueous dispersion for chemical mechanical polishing, kit for prepa...
- Publication number 20070049180
- Publication date Mar 1, 2007
- JSR Corporation
- Hirotaka Shida
- B24 - GRINDING POLISHING
Information Patent Application
CMP slurry for metallic film, polishing method and method of manufa...
- Publication number 20060243702
- Publication date Nov 2, 2006
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Manufacturing method of a semiconductor device
- Publication number 20060151888
- Publication date Jul 13, 2006
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20060131751
- Publication date Jun 22, 2006
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060012047
- Publication date Jan 19, 2006
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050218008
- Publication date Oct 6, 2005
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-CMP treating liquid and method for manufacturing semiconductor...
- Publication number 20050118819
- Publication date Jun 2, 2005
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor device fabrication method and apparatus
- Publication number 20050113001
- Publication date May 26, 2005
- Nobuyuki Kurashima
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing aqueous dispersion and chemical mecha...
- Publication number 20050037693
- Publication date Feb 17, 2005
- JSR Corporation
- Kazuhito Uchikura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP slurry and method of manufacturing semiconductor device
- Publication number 20050003666
- Publication date Jan 6, 2005
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20040119164
- Publication date Jun 24, 2004
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-CMP treating liquid and method for manufacturing semiconductor...
- Publication number 20040082180
- Publication date Apr 29, 2004
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing apparatus, polishing method and method of manufacturing s...
- Publication number 20040002292
- Publication date Jan 1, 2004
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
Polishing slurry for use in CMPof SiC series compound, polishing me...
- Publication number 20030124850
- Publication date Jul 3, 2003
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Nobuyuki Kurashima

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Manufacturing method of a semiconductor device

Post-CMP treating liquid and manufacturing method of semiconductor...

CMP slurry for metallic film, polishing method and method of manufa...

Aqueous dispersion for CMP, polishing method and method for manufac...

Method of manufacturing semiconductor device

Post-CMP treating liquid and manufacturing method of semiconductor...

Manufacturing method of a semiconductor device

Method for fabricating semiconductor device and polishing method

Semiconductor device including a discontinuous film and method for...

CMP slurry and method of manufacturing semiconductor device

Semiconductor device containing a dummy wire

Polishing slurry for use in CMP of SiC series compound, polishing m...

Semiconductor device fabrication method and apparatus

Chemical mechanical polishing aqueous dispersion and chemical mecha...

Slurry for chemical mechanical polishing and method of manufacturin...

Post-CMP treating liquid and method for manufacturing semiconductor...

CMP slurry and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

CLEANING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

CMP slurry for metallic film, polishing method and method of manufa...

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...

POLISHING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method of manunfacturing semiconductor device

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

Semiconductor device including a discontinuous film and method for...

CLEANING COMPOSITION, CLEANING METHOD, AND MANUFACTURING METHOD OF...

Slurry for touch-up CMP and method of manufacturing semiconductor d...

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

AQUEOUS DISPERSION FOR CMP, POLISHING METHOD AND METHOD FOR MANUFAC...

Method for fabricating semiconductor device and polishing method

Aqueous dispersion for chemical mechanical polishing, kit for prepa...

CMP slurry for metallic film, polishing method and method of manufa...

Manufacturing method of a semiconductor device

Semiconductor device and method for manufacturing the same

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Post-CMP treating liquid and method for manufacturing semiconductor...

Semiconductor device fabrication method and apparatus

Chemical mechanical polishing aqueous dispersion and chemical mecha...

CMP slurry and method of manufacturing semiconductor device

Semiconductor device and its manufacturing method

Post-CMP treating liquid and method for manufacturing semiconductor...

Polishing apparatus, polishing method and method of manufacturing s...

Polishing slurry for use in CMPof SiC series compound, polishing me...