Numair AHMED

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligned core balls for interconnect joint stability
- Patent number 11,735,551
- Issue date Aug 22, 2023
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...
- Publication number 20250219002
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...
- Publication number 20250218911
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES
- Publication number 20250210469
- Publication date Jun 26, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312853
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312888
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT
- Publication number 20230317642
- Publication date Oct 5, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MAGNETIC INDUCTOR AND METHOD
- Publication number 20230162902
- Publication date May 25, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR DEVICE AND METHOD
- Publication number 20230092492
- Publication date Mar 23, 2023
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...
- Publication number 20220199503
- Publication date Jun 23, 2022
- Intel Corporation
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...
- Publication number 20220165695
- Publication date May 26, 2022
- Intel Corporation
- Numair AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY
- Publication number 20200312803
- Publication date Oct 1, 2020
- Intel Corporation
- Jimin YAO
- H01 - BASIC ELECTRIC ELEMENTS

Numair AHMED

Person

Patents Grantslast 30 patents

Magnetic inductor device and method

Aligned core balls for interconnect joint stability

Patents Applicationslast 30 patents

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

ELECTROLYTIC INDIUM-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMBEDDED...

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

MIXED DEPTH CAVITY FOR EMBEDDED BRIDGE STRUCTURES

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

MEMS DIES EMBEDDED IN GLASS CORES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT

STACKED MAGNETIC INDUCTOR AND METHOD

MAGNETIC INDUCTOR DEVICE AND METHOD

NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF MET...

POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...

ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY