Osamu Kasahara

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device and substrate processi...
- Patent number 9,096,928
- Issue date Aug 4, 2015
- Hitachi Kokusai Electric Inc.
- Ryota Sasajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device and substrate processi...
- Patent number 9,023,429
- Issue date May 5, 2015
- Hitachi Kokusai Electric Inc.
- Yuichiro Takeshima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device and method of processi...
- Patent number 8,575,042
- Issue date Nov 5, 2013
- Hitachi Kokusai Electric Inc.
- Yosuke Ota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device manufacturing method and substrate processing...
- Patent number 8,293,646
- Issue date Oct 23, 2012
- Hitachi Kokusai Electric Inc.
- Takashi Ozaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of semiconductor device, and substrate process...
- Patent number 7,494,941
- Issue date Feb 24, 2009
- Hitachi Kokusai Electric Inc.
- Osamu Kasahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for use in manufacturing a semiconductor device
- Patent number 7,033,937
- Issue date Apr 25, 2006
- Hitachi Kokusai Electric, Inc.
- Kazuyuki Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 6,894,334
- Issue date May 17, 2005
- Hitachi, Ltd.
- Jun Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for use in manufacturing a semiconductor device
- Patent number 6,576,063
- Issue date Jun 10, 2003
- Hitachi Kokusai Electric, Inc.
- Kazuyuki Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP...
- Patent number 6,548,847
- Issue date Apr 15, 2003
- Hitachi, Ltd.
- Jun Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 6,342,412
- Issue date Jan 29, 2002
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 6,169,324
- Issue date Jan 2, 2001
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 6,127,255
- Issue date Oct 3, 2000
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit, method of fabricating the same an...
- Patent number 5,917,211
- Issue date Jun 29, 1999
- Hitachi, Ltd.
- Jun Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming teos oxide and silicon nitride passivation layer...
- Patent number 5,811,316
- Issue date Sep 22, 1998
- Hitachi Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 5,780,882
- Issue date Jul 14, 1998
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing a BIMIS
- Patent number 5,773,340
- Issue date Jun 30, 1998
- Hitachi, Ltd.
- Takahiro Kumauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device process for fabricating the...
- Patent number 5,739,589
- Issue date Apr 14, 1998
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit, method of fabricating the same an...
- Patent number 5,734,188
- Issue date Mar 31, 1998
- Hitachi, Ltd.
- Jun Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming multilayer wiring
- Patent number 5,670,421
- Issue date Sep 23, 1997
- Hitachi, Ltd.
- Eisuke Nishitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 5,557,147
- Issue date Sep 17, 1996
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for forming multilayer wiring
- Patent number 5,498,768
- Issue date Mar 12, 1996
- Hitachi, Ltd.
- Eisuke Nishitani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor integrated circuit device having an improved vertical...
- Patent number 5,468,989
- Issue date Nov 21, 1995
- Hitachi, Ltd.
- Hirotaka Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 5,331,191
- Issue date Jul 19, 1994
- Hitachi, Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit, method of fabricating the same an...
- Patent number 5,264,712
- Issue date Nov 23, 1993
- Hitachi, Ltd.
- Jun Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device, process for fabricating th...
- Patent number 5,202,275
- Issue date Apr 13, 1993
- Hitachi Ltd.
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 5,060,045
- Issue date Oct 22, 1991
- Hitachi, Ltd.
- Nobuo Owada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer silicon oxide silicon nitride...
- Patent number 4,907,046
- Issue date Mar 6, 1990
- Hitachi Ltd.
- Yuzuru Ohji
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Target for sputtering
- Patent number 4,610,774
- Issue date Sep 9, 1986
- Hitachi, Ltd.
- Masao Sakata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Planar magnetron sputtering with modified field configuration
- Patent number 4,606,802
- Issue date Aug 19, 1986
- Hitachi, Ltd.
- Shigeru Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20140087567
- Publication date Mar 27, 2014
- Hitachi Kokusai Electric Inc.
- Kazuyuki TOYODA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INJECTION MEMBER FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA...
- Publication number 20130276983
- Publication date Oct 24, 2013
- Hitachi Kokusai Electric Inc.
- Yong Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...
- Publication number 20130078823
- Publication date Mar 28, 2013
- Hitachi Kokusai Electric Inc.
- Yuichiro Takeshima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF PROCESSI...
- Publication number 20120220137
- Publication date Aug 30, 2012
- Hitachi Kokusai Electric Inc.
- Yosuke Ota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...
- Publication number 20120064733
- Publication date Mar 15, 2012
- Hitachi Kokusai Electric Inc.
- Ryota SASAJIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20110212625
- Publication date Sep 1, 2011
- Hitachi Kokusai Electric Inc.
- Kazuyuki TOYODA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE PROCESSING...
- Publication number 20110207302
- Publication date Aug 25, 2011
- Hitachi Kokusai Electric Inc.
- Jie WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and substrate processing...
- Publication number 20090117752
- Publication date May 7, 2009
- Hitachi Kokusai Electric Inc.
- Takashi Ozaki
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for manufacturing semiconductor device and substrate process...
- Publication number 20070032045
- Publication date Feb 8, 2007
- Hitachi Kokusai Electric Inc.
- Osamu Kasahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor integrated circuit device, process for fabricating th...
- Publication number 20030189255
- Publication date Oct 9, 2003
- Jun Sugiura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Apparatus and method for use in manufacturing a semiconductor device
- Publication number 20030124876
- Publication date Jul 3, 2003
- Kazuyuki Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing semiconductor device, method for processin...
- Publication number 20020192984
- Publication date Dec 19, 2002
- HITACHI KOKUSAI ELECTRIC INC.
- Shin Hiyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor integrated circuit device, process for fabricating th...
- Publication number 20020017669
- Publication date Feb 14, 2002
- Jun Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for use in manufacturing a semiconductor device
- Publication number 20010029112
- Publication date Oct 11, 2001
- Hitachi Kokusai Electric Inc.
- Kazuyuki Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Osamu Kasahara

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device and substrate processi...

Method of manufacturing semiconductor device and substrate processi...

Method of manufacturing semiconductor device and method of processi...

Semiconductor device manufacturing method and substrate processing...

Manufacturing method of semiconductor device, and substrate process...

Apparatus and method for use in manufacturing a semiconductor device

Semiconductor integrated circuit device, process for fabricating th...

Apparatus and method for use in manufacturing a semiconductor device

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP...

Semiconductor integrated circuit device, process for fabricating th...

Semiconductor integrated circuit device, process for fabricating th...

Semiconductor integrated circuit device, process for fabricating th...

Semiconductor integrated circuit, method of fabricating the same an...

Method of forming teos oxide and silicon nitride passivation layer...

Semiconductor integrated circuit device, process for fabricating th...

Method of manufacturing a BIMIS

Semiconductor integrated circuit device process for fabricating the...

Semiconductor integrated circuit, method of fabricating the same an...

Process for forming multilayer wiring

Semiconductor integrated circuit device, process for fabricating th...

Process for forming multilayer wiring

Semiconductor integrated circuit device having an improved vertical...

Semiconductor integrated circuit device, process for fabricating th...

Semiconductor integrated circuit, method of fabricating the same an...

Semiconductor integrated circuit device, process for fabricating th...

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device with multilayer silicon oxide silicon nitride...

Target for sputtering

Planar magnetron sputtering with modified field configuration

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

INJECTION MEMBER FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PLASMA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF PROCESSI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SUBSTRATE PROCESSING...

Semiconductor device manufacturing method and substrate processing...

Method for manufacturing semiconductor device and substrate process...

Semiconductor integrated circuit device, process for fabricating th...

Apparatus and method for use in manufacturing a semiconductor device

Method for manufacturing semiconductor device, method for processin...

Semiconductor integrated circuit device, process for fabricating th...

Apparatus and method for use in manufacturing a semiconductor device