Osamu YAMAGATA

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor stacked module structure, stack...
- Patent number 9,196,507
- Issue date Nov 24, 2015
- J-Devices Corporation
- Hiroshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor stacked module structure, stack...
- Patent number 9,147,671
- Issue date Sep 29, 2015
- J-Devices Corporation
- Hiroshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,872,350
- Issue date Oct 28, 2014
- J-Devices Corporation
- Shigenori Sawachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,960,494
- Issue date Nov 1, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,836,012
- Issue date Dec 28, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,552,637
- Issue date Sep 3, 1996
- Kabushiki Kaisha Toshiba
- Osamu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACK...
- Publication number 20150332937
- Publication date Nov 19, 2015
- Hiroshi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACK...
- Publication number 20150243632
- Publication date Aug 27, 2015
- Hiroshi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130200523
- Publication date Aug 8, 2013
- Shigenori SAWACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY...
- Publication number 20130026650
- Publication date Jan 31, 2013
- Osamu Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100213599
- Publication date Aug 26, 2010
- Kabushiki Kaisha Toshiba
- Kazuhiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050051810
- Publication date Mar 10, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20020140095
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS

Osamu YAMAGATA

Person

Patents Grantslast 30 patents

Semiconductor device, semiconductor stacked module structure, stack...

Semiconductor device, semiconductor stacked module structure, stack...

Semiconductor device and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACK...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACK...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same