Oswald Skeete

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 11,508,776
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages and related methods
- Patent number 11,462,580
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect sensing devices and related methods
- Patent number 11,079,282
- Issue date Aug 3, 2021
- Semiconductor Components Industries, LLC
- Irfan Rahim
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package with chamfered corners and related methods
- Patent number 10,608,042
- Issue date Mar 31, 2020
- Semiconductor Components Industries, L.L.C.
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chamfered corners and related methods
- Patent number 10,340,306
- Issue date Jul 2, 2019
- Semiconductor Components Industries, LLC
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor semiconductor packages and related methods
- Patent number 10,290,672
- Issue date May 14, 2019
- Semiconductor Components Industries, L.L.C.
- Larry Kinsman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit packages including high density bump-less build...
- Patent number 9,941,245
- Issue date Apr 10, 2018
- Intel Corporation
- Oswald Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging systems with flip chip ball grid arrays
- Patent number 9,368,535
- Issue date Jun 14, 2016
- Semiconductor Components Industries, LLC
- Oswald Skeete
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package and method of manufacturing same
- Patent number 8,035,216
- Issue date Oct 11, 2011
- Intel Corporation
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing stress in a flip chip assembly
- Patent number 7,727,805
- Issue date Jun 1, 2010
- Intel Corporation
- Oswald Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for attaching an integrated heat spreader
- Patent number 7,304,381
- Issue date Dec 4, 2007
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20220415943
- Publication date Dec 29, 2022
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT SENSING DEVICES AND RELATED METHODS
- Publication number 20210325252
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Irfan RAHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20200411573
- Publication date Dec 31, 2020
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND RELATED METHODS
- Publication number 20200185451
- Publication date Jun 11, 2020
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT SENSING DEVICES AND RELATED METHODS
- Publication number 20200166410
- Publication date May 28, 2020
- Semiconductor Components Industries, LLC
- Irfan RAHIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND RELATED METHODS
- Publication number 20190273111
- Publication date Sep 5, 2019
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20190229144
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING EMBEDDED THERMOELECTRIC...
- Publication number 20180226515
- Publication date Aug 9, 2018
- Semiconductor Components Industries, LLC
- Oswald L. SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20170345864
- Publication date Nov 30, 2017
- Semiconductor Components Industries, LLC
- Larry KINSMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE PROTECTIVE CAP FOR AN IMAGE SENSOR
- Publication number 20160282175
- Publication date Sep 29, 2016
- Semiconductor Components Industries, LLC
- Oswald Leroy SKEETE
- G01 - MEASURING TESTING
Information Patent Application
IMAGING SYSTEMS WITH FLIP CHIP BALL GRID ARRAYS
- Publication number 20150249105
- Publication date Sep 3, 2015
- Semiconductor Components Industries, LLC
- Oswald Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD...
- Publication number 20110101491
- Publication date May 5, 2011
- OSWALD SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20090212416
- Publication date Aug 27, 2009
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing stress in a flip chip assembly
- Publication number 20080305581
- Publication date Dec 11, 2008
- Oswald Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX OVERSPRAY REDUCTION APPARATUS, SYSTEMS, AND METHODS
- Publication number 20080156895
- Publication date Jul 3, 2008
- James P. Mellody
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER
- Publication number 20060267182
- Publication date Nov 30, 2006
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and method for attaching an integrated heat spreader
- Publication number 20040238947
- Publication date Dec 2, 2004
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS

Oswald Skeete

Person

Patents Grantslast 30 patents

Image sensor semiconductor packages and related methods

Image sensor packages and related methods

Flexible interconnect sensing devices and related methods

Semiconductor package with chamfered corners and related methods

Semiconductor package with chamfered corners and related methods

Image sensor semiconductor packages and related methods

Integrated circuit packages including high density bump-less build...

Imaging systems with flip chip ball grid arrays

Integrated circuit package and method of manufacturing same

Reducing stress in a flip chip assembly

Package and method for attaching an integrated heat spreader

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGES AND RELATED METHODS

FLEXIBLE INTERCONNECT SENSING DEVICES AND RELATED METHODS

IMAGE SENSOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND RELATED METHODS

FLEXIBLE INTERCONNECT SENSING DEVICES AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH CHAMFERED CORNERS AND RELATED METHODS

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING EMBEDDED THERMOELECTRIC...

IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

REMOVABLE PROTECTIVE CAP FOR AN IMAGE SENSOR

IMAGING SYSTEMS WITH FLIP CHIP BALL GRID ARRAYS

INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING SAME

Reducing stress in a flip chip assembly

FLUX OVERSPRAY REDUCTION APPARATUS, SYSTEMS, AND METHODS

PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER

Package and method for attaching an integrated heat spreader