Pai-Hsiang Kao

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Saratoga, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Metal pads for electrical probe testing on wafer with bump intercon...
- Patent number 6,327,158
- Issue date Dec 4, 2001
- National Semiconductor Corporation
- Nikhil Vishwanath Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opaque metallization to cover flip chip die surface for light sensi...
- Patent number 6,249,044
- Issue date Jun 19, 2001
- National Semiconductor Corp.
- Pai-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having a bottom surface protective coating
- Patent number 6,175,162
- Issue date Jan 16, 2001
- National Semiconductor Corporation
- Pai-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount die: wafer level chip-scale package and process for m...
- Patent number 6,075,290
- Issue date Jun 13, 2000
- National Semiconductor Corporation
- William Jeffrey Schaefer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer having a bottom surface protective coating
- Patent number 6,023,094
- Issue date Feb 8, 2000
- National Semiconductor Corporation
- Pai-Hsiang Kao
- H01 - BASIC ELECTRIC ELEMENTS