Panayotis C. Andricacos

Person

Croton-on-Hudson, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a high Q factor integrated circuit inductor
- Patent number 7,829,427
- Issue date Nov 9, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void-free damascene copper deposition process and means of monitori...
- Patent number 7,678,258
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating a high Q factor integrated circuit inductor
- Patent number 7,638,406
- Issue date Dec 29, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming noble metal contacts
- Patent number 7,581,314
- Issue date Sep 1, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical RF switch
- Patent number 7,212,091
- Issue date May 1, 2007
- International Business Machines Coproration
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal contacts for micro-electromechanical switches
- Patent number 7,202,764
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping of copper wiring
- Patent number 7,190,079
- Issue date Mar 13, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with electroplated metal gate
- Patent number 7,112,851
- Issue date Sep 26, 2006
- International Business Machines Corporation
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High Q factor integrated circuit inductor
- Patent number 7,068,138
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep filled vias
- Patent number 7,060,624
- Issue date Jun 13, 2006
- International Business Machines Corporation
- Panayotis Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping of copper wiring
- Patent number 7,008,871
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for interconnect and method
- Patent number 6,992,389
- Issue date Jan 31, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plating copper conductors and devices formed
- Patent number 6,979,393
- Issue date Dec 27, 2005
- International Business Machines Corporation
- Kenneth P. Rodbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electroplating on resistive substrates
- Patent number 6,974,531
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Field effect transistor with electroplated metal gate
- Patent number 6,967,131
- Issue date Nov 22, 2005
- International Business Machines Corp.
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated interconnection structures on integrated circuit chips
- Patent number 6,946,716
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure comprising an interlayer of palladium and/or platinum and...
- Patent number 6,911,229
- Issue date Jun 28, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical RF switch
- Patent number 6,876,282
- Issue date Apr 5, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated plating and planarization apparatus having a variable-di...
- Patent number 6,776,885
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Laertis Economikos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making electroplated interconnection structures on integr...
- Patent number 6,709,562
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS RF switch with low actuation voltage
- Patent number 6,639,488
- Issue date Oct 28, 2003
- IBM Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electromigration-resistant structures by doping
- Patent number 6,589,874
- Issue date Jul 8, 2003
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects on semiconductor substrates and st...
- Patent number 6,570,255
- Issue date May 27, 2003
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical bath composition in a manufacturing...
- Patent number 6,471,845
- Issue date Oct 29, 2002
- International Business Machines Corporation
- John O. Dukovic
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming interconnects on semiconductor substrates and st...
- Patent number 6,429,523
- Issue date Aug 6, 2002
- International Business Machines Corp.
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing copper onto a barrier layer
- Patent number 6,416,812
- Issue date Jul 9, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus to monitor and add plating solution to plating baths and...
- Patent number 6,406,608
- Issue date Jun 18, 2002
- International Business Machines Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper seed layer repair technique using electroless touch-up
- Patent number 6,395,164
- Issue date May 28, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING
- Publication number 20100051474
- Publication date Mar 4, 2010
- Panayotis C. Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR
- Publication number 20100047990
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...
- Publication number 20080237053
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Counter-electrode for electrodeposition and electroetching of resis...
- Publication number 20060283709
- Publication date Dec 21, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and composition for electro-chemical-mechanical polishing
- Publication number 20060163083
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Panayotis C. Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for direct plating on resistive liners
- Publication number 20060163055
- Publication date Jul 27, 2006
- International Business Machines Corporation
- Philippe M. Vereecken
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Noble metal contacts for micro-electromechanical switches
- Publication number 20060164194
- Publication date Jul 27, 2006
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Q factor integrated circuit inductor
- Publication number 20060105534
- Publication date May 18, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field effect transistor with electroplated metal gate
- Publication number 20060081885
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective capping of copper wiring
- Publication number 20060076685
- Publication date Apr 13, 2006
- International Business Machines
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20060017169
- Publication date Jan 26, 2006
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Tungsten encapsulated copper interconnections using electroplating
- Publication number 20050269708
- Publication date Dec 8, 2005
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR INTERCONNECT AND METHOD
- Publication number 20050245070
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating apparatus and plating method
- Publication number 20050241946
- Publication date Nov 3, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20050199502
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High Q factor integrated circuit inductor
- Publication number 20050167780
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-electro-mechanical RF switch
- Publication number 20050156695
- Publication date Jul 21, 2005
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field effect transistor with electroplated metal gate
- Publication number 20050095852
- Publication date May 5, 2005
- International Business Machines
- Katherine L. Saenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep filled vias
- Publication number 20050037608
- Publication date Feb 17, 2005
- IBM
- Panayotis Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL CONTACTS FOR MICRO-ELECTROMECHANICAL SWITCHES
- Publication number 20050007217
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-free damascene copper deposition process and means of monitori...
- Publication number 20050006242
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure comprising an interlayer of palladium and/or platinum and...
- Publication number 20050006777
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective capping of copper wiring
- Publication number 20050001325
- Publication date Jan 6, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20040229456
- Publication date Nov 18, 2004
- International Business Machines
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure comprising a barrier layer of a tungsten alloy comprising...
- Publication number 20040108136
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED PLATING AND PLANARIZATION APPARATUS HAVING A VARIABLE-DI...
- Publication number 20040094403
- Publication date May 20, 2004
- International Business Machines Corporation
- Laertis Economikos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for forming uniformly thick anodized films on...
- Publication number 20040077140
- Publication date Apr 22, 2004
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electroplating on resistive substrates
- Publication number 20040069648
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Panayotis C. Andricacos

Person

Patents Grantslast 30 patents

Method of fabricating a high Q factor integrated circuit inductor

Void-free damascene copper deposition process and means of monitori...

Method of fabricating a high Q factor integrated circuit inductor

Method of forming noble metal contacts

Plating apparatus and plating method

Electroplated copper interconnection structure, process for making...

Micro-electro-mechanical RF switch

Noble metal contacts for micro-electromechanical switches

Selective capping of copper wiring

Field effect transistor with electroplated metal gate

High Q factor integrated circuit inductor

Deep filled vias

Selective capping of copper wiring

Barrier for interconnect and method

Method for plating copper conductors and devices formed

Method for electroplating on resistive substrates

Field effect transistor with electroplated metal gate

Electroplated interconnection structures on integrated circuit chips

Structure comprising an interlayer of palladium and/or platinum and...

Micro-electro-mechanical RF switch

Integrated plating and planarization apparatus having a variable-di...

Method of making electroplated interconnection structures on integr...

MEMS RF switch with low actuation voltage

Method for forming electromigration-resistant structures by doping

Method for forming interconnects on semiconductor substrates and st...

Method of controlling chemical bath composition in a manufacturing...

Method for forming interconnects on semiconductor substrates and st...

Method for depositing copper onto a barrier layer

Apparatus to monitor and add plating solution to plating baths and...

Copper seed layer repair technique using electroless touch-up

Patents Applicationslast 30 patents

METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING

METHOD OF FABRICATING A HIGH Q FACTOR INTEGRATED CIRCUIT INDUCTOR

STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...

Counter-electrode for electrodeposition and electroetching of resis...

Method and composition for electro-chemical-mechanical polishing

Apparatus for direct plating on resistive liners

Noble metal contacts for micro-electromechanical switches

High Q factor integrated circuit inductor

Field effect transistor with electroplated metal gate

Selective capping of copper wiring

Electroplated interconnection structures on integrated circuit chips

Tungsten encapsulated copper interconnections using electroplating

BARRIER FOR INTERCONNECT AND METHOD

Plating apparatus and plating method

Method for electroplating on resistive substrates

High Q factor integrated circuit inductor

Micro-electro-mechanical RF switch

Field effect transistor with electroplated metal gate

Deep filled vias

NOBLE METAL CONTACTS FOR MICRO-ELECTROMECHANICAL SWITCHES

Void-free damascene copper deposition process and means of monitori...

Structure comprising an interlayer of palladium and/or platinum and...

Selective capping of copper wiring

Electroplated interconnection structures on integrated circuit chips

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Structure comprising a barrier layer of a tungsten alloy comprising...

INTEGRATED PLATING AND PLANARIZATION APPARATUS HAVING A VARIABLE-DI...

Apparatus and method for forming uniformly thick anodized films on...

Method for electroplating on resistive substrates