Pao-Huei Chang Chien

Person

Kaohsiung County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Advanced quad flat non-leaded package structure and manufacturing m...
- Patent number 8,237,250
- Issue date Aug 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of advanced quad flat non-leaded package
- Patent number 8,124,447
- Issue date Feb 28, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced quad flat no lead chip package having marking and corner l...
- Patent number 8,120,152
- Issue date Feb 21, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,106,492
- Issue date Jan 31, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor package and method of making a sem...
- Patent number 7,642,133
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20120119342
- Publication date May 17, 2012
- MEDIATEK INC.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHO...
- Publication number 20100258921
- Publication date Oct 14, 2010
- Advanced Semiconductor Engineering, Inc.
- PAO-HUEI CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100258934
- Publication date Oct 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100044843
- Publication date Feb 25, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100044850
- Publication date Feb 25, 2010
- Advanced Semiconductor Engineering, Inc.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING MARKING AND CORNER L...
- Publication number 20090230525
- Publication date Sep 17, 2009
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME
- Publication number 20080164595
- Publication date Jul 10, 2008
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor package and method of making a sem...
- Publication number 20080076208
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20080073769
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Pao-Huei Chang Chien

Person

Patents Grantslast 30 patents

Advanced quad flat non-leaded package structure and manufacturing m...

Manufacturing method of advanced quad flat non-leaded package

Advanced quad flat no lead chip package having marking and corner l...

Semiconductor package and manufacturing method thereof

Method of making a semiconductor package and method of making a sem...

Patents Applicationslast 30 patents

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHO...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING MARKING AND CORNER L...

STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME

Method of making a semiconductor package and method of making a sem...

Semiconductor package and semiconductor device