Patrick A. Halahan

Person

San Mateo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplating and electroless plating of conductive materials into...
- Patent number 7,521,360
- Issue date Apr 21, 2009
- Tru-Si Technologies, Inc.
- Patrick A. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and packaging substrates with cavities, and att...
- Patent number 7,186,586
- Issue date Mar 6, 2007
- Tru-Si Technologies, Inc.
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrates for integrated circuits and soldering methods
- Patent number 7,060,601
- Issue date Jun 13, 2006
- Tru-Si Technologies, Inc.
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and packaging substrates with cavities, and att...
- Patent number 7,049,170
- Issue date May 23, 2006
- Tru-Si Technologies, Inc.
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrates for integrated circuits and soldering methods
- Patent number 7,034,401
- Issue date Apr 25, 2006
- Tru-Si Technologies, Inc.
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having multiple conductive layers in an op...
- Patent number 7,001,825
- Issue date Feb 21, 2006
- Tru-Si Technologies, Inc.
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating and electroless plating of conductive materials into...
- Patent number 6,897,148
- Issue date May 24, 2005
- Tru-Si Technologies, Inc.
- Patrick A. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of semiconductor structures having multiple conductive...
- Patent number 6,844,241
- Issue date Jan 18, 2005
- Tru-Si Technologies, Inc.
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a substrate with a cavity and having an integrate...
- Patent number 6,787,916
- Issue date Sep 7, 2004
- Tru-Si Technologies, Inc.
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure comprising a substrate with a...
- Patent number 6,753,205
- Issue date Jun 22, 2004
- Tru-Si Technologies, Inc.
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing comprising three rotational motions of an article...
- Patent number 6,749,764
- Issue date Jun 15, 2004
- Tru-Si Technologies, Inc.
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning and dicing of semiconductor wafers using dry etch, and obt...
- Patent number 6,498,074
- Issue date Dec 24, 2002
- Tru-Si Technologies, Inc.
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having multiple conductive layers in an op...
- Patent number 6,498,381
- Issue date Dec 24, 2002
- Tru-Si Technologies, Inc.
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning and dicing of semiconductor wafers using dry etch, and obt...
- Patent number 6,448,153
- Issue date Sep 10, 2002
- Tru-Si Technologies, Inc.
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma generator ignition circuit
- Patent number 6,121,571
- Issue date Sep 19, 2000
- Oleg Siniaguine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO...
- Publication number 20070128868
- Publication date Jun 7, 2007
- Patrick A. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuits and packaging substrates with cavities, and att...
- Publication number 20060035416
- Publication date Feb 16, 2006
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuits and packaging substrates with cavities, and att...
- Publication number 20050212127
- Publication date Sep 29, 2005
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrates for integrated circuits and soldering methods
- Publication number 20050189636
- Publication date Sep 1, 2005
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating and electroless plating of conductive materials into...
- Publication number 20050170647
- Publication date Aug 4, 2005
- Patrick A. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuits and packaging substrates with cavities, and att...
- Publication number 20050136634
- Publication date Jun 23, 2005
- Sergey Savastiouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrates for integrated circuits and soldering methods
- Publication number 20050133930
- Publication date Jun 23, 2005
- Sergey Savastisuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures having multiple conductive layers in an op...
- Publication number 20050106845
- Publication date May 19, 2005
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplating and electroless plating of conductive materials into...
- Publication number 20040203224
- Publication date Oct 14, 2004
- Patrick A. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma processing comprising three rotational motions of an article...
- Publication number 20040016406
- Publication date Jan 29, 2004
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures with cavities, and methods of fabrication
- Publication number 20030148552
- Publication date Aug 7, 2003
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures with cavities, and methods of fabrication
- Publication number 20030047798
- Publication date Mar 13, 2003
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures having multiple conductive layers in an op...
- Publication number 20020115260
- Publication date Aug 22, 2002
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures having multiple conductive layers in an op...
- Publication number 20020115290
- Publication date Aug 22, 2002
- Patrick B. Halahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinning and dicing of semiconductor wafers using dry etch, and obt...
- Publication number 20020013061
- Publication date Jan 31, 2002
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinning and dicing of semiconductor wafers using dry etch, and obt...
- Publication number 20010001215
- Publication date May 17, 2001
- Oleg Siniaguine
- H01 - BASIC ELECTRIC ELEMENTS

Patrick A. Halahan

Person

Patents Grantslast 30 patents

Electroplating and electroless plating of conductive materials into...

Integrated circuits and packaging substrates with cavities, and att...

Packaging substrates for integrated circuits and soldering methods

Integrated circuits and packaging substrates with cavities, and att...

Packaging substrates for integrated circuits and soldering methods

Semiconductor structures having multiple conductive layers in an op...

Electroplating and electroless plating of conductive materials into...

Fabrication of semiconductor structures having multiple conductive...

Structures having a substrate with a cavity and having an integrate...

Method for manufacturing a structure comprising a substrate with a...

Plasma processing comprising three rotational motions of an article...

Thinning and dicing of semiconductor wafers using dry etch, and obt...

Semiconductor structures having multiple conductive layers in an op...

Thinning and dicing of semiconductor wafers using dry etch, and obt...

Plasma generator ignition circuit

Patents Applicationslast 30 patents

ELECTROPLATING AND ELECTROLESS PLATING OF CONDUCTIVE MATERIALS INTO...

Integrated circuits and packaging substrates with cavities, and att...

Integrated circuits and packaging substrates with cavities, and att...

Packaging substrates for integrated circuits and soldering methods

Electroplating and electroless plating of conductive materials into...

Integrated circuits and packaging substrates with cavities, and att...

Packaging substrates for integrated circuits and soldering methods

Semiconductor structures having multiple conductive layers in an op...

Electroplating and electroless plating of conductive materials into...

Plasma processing comprising three rotational motions of an article...

Semiconductor structures with cavities, and methods of fabrication

Semiconductor structures with cavities, and methods of fabrication

Semiconductor structures having multiple conductive layers in an op...

Semiconductor structures having multiple conductive layers in an op...

Thinning and dicing of semiconductor wafers using dry etch, and obt...

Thinning and dicing of semiconductor wafers using dry etch, and obt...