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Paul A. Totta
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Poughkeepsie, NY, US
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last 30 patents
Information
Patent Grant
Selective wafer-level testing and burn-in
Patent number
6,255,208
Issue date
Jul 3, 2001
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure using Al.sub.2 Cu for an integrated circuit...
Patent number
6,110,819
Issue date
Aug 29, 2000
International Business Machines Corporation
Evan George Colgan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of argon sputtering to modify surface properties by thin film d...
Patent number
6,068,923
Issue date
May 30, 2000
International Business Machines Corporation
Thomas E. Dinan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Use of argon sputtering to modify surface properties by thin film d...
Patent number
5,956,573
Issue date
Sep 21, 1999
International Business Machines Corporation
Thomas E. Dinan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure using Al.sub.2 -Cu for an integrated circuit...
Patent number
5,925,933
Issue date
Jul 20, 1999
International Business Machines Corporation
Evan George Colgan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroplated solder terminal
Patent number
5,629,564
Issue date
May 13, 1997
International Business Machines Corporation
Henry A. Nye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure using a Al.sub.2 Cu for an integrated circui...
Patent number
5,565,707
Issue date
Oct 15, 1996
International Business Machines Corporation
Evan G. Colgan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroplated solder terminal
Patent number
5,503,286
Issue date
Apr 2, 1996
International Business Machines Corporation
Henry A. Nye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming dual height solder interconnections
Patent number
5,251,806
Issue date
Oct 12, 1993
International Business Machines Corporation
Birendra N. Agarwala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayered intermetallic connection for semiconductor devices
Patent number
5,171,642
Issue date
Dec 15, 1992
International Business Machines Corporation
Patrick W. DeHaven
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder mass having conductive encapsulating arrangement
Patent number
5,130,779
Issue date
Jul 14, 1992
International Business Machines Corporation
Birendra N. Agarwala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayered intermetallic connection for semiconductor devices
Patent number
5,071,714
Issue date
Dec 10, 1991
International Business Machines Corporation
Kenneth P. Rodbell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact stud structure for semiconductor devices
Patent number
5,008,730
Issue date
Apr 16, 1991
International Business Machines Corporation
Hung-Chang W. Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for improved contact stud structure for semiconductor devices
Patent number
5,008,216
Issue date
Apr 16, 1991
International Business Machines Corporation
Hung-Chang W. Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip contacts without oxide discontinuities
Patent number
4,839,715
Issue date
Jun 13, 1989
International Business Machines Corporation
Joseph J. Gajda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for braze attachment of electronic package members
Patent number
4,824,009
Issue date
Apr 25, 1989
International Business Machines Corporation
Raj N. Master
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Variable axis rotary drive vacuum deposition system
Patent number
4,583,488
Issue date
Apr 22, 1986
International Business Machines Corporation
William W. Brown
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Hybrid process for SBD metallurgies
Patent number
4,272,561
Issue date
Jun 9, 1981
International Business Machines Corporation
Laura B. Rothman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conduction-cooled circuit package
Patent number
4,081,825
Issue date
Mar 28, 1978
International Business Machines Corporation
Nicholas George Koopman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making conduction-cooled circuit package
Patent number
4,034,469
Issue date
Jul 12, 1977
IBM Corporation
Nicholas George Koopman
H01 - BASIC ELECTRIC ELEMENTS