Paul M. Enquist

Person

Cary, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 12,199,069
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,916,054
- Issue date Feb 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,837,596
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,658,173
- Issue date May 23, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method
- Patent number 11,631,586
- Issue date Apr 18, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 11,276,676
- Issue date Mar 15, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for efficient transfer of semiconductor elements
- Patent number 10,896,902
- Issue date Jan 19, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 10,879,226
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous device
- Patent number 10,777,533
- Issue date Sep 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,748,824
- Issue date Aug 18, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 10,607,937
- Issue date Mar 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,529,634
- Issue date Jan 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,522,499
- Issue date Dec 31, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for efficient transfer of semiconductor elements
- Patent number 10,446,532
- Issue date Oct 15, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 10,269,708
- Issue date Apr 23, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 10,262,963
- Issue date Apr 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 10,204,893
- Issue date Feb 12, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 10,141,218
- Issue date Nov 27, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 9,953,941
- Issue date Apr 24, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 9,852,988
- Issue date Dec 26, 2017
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20240145458
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20240088120
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20230282634
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20230207322
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20230131849
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20230130580
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED STRUCTURES
- Publication number 20220208723
- Publication date Jun 30, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20220189941
- Publication date Jun 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20210183847
- Publication date Jun 17, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20200328193
- Publication date Oct 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20200144217
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
- Publication number 20200105630
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS
- Publication number 20200043910
- Publication date Feb 6, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICES AND METHODS OF FABRICATION
- Publication number 20190355706
- Publication date Nov 21, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING
- Publication number 20190244899
- Publication date Aug 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20190189607
- Publication date Jun 20, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Probe methodology for ultrafine pitch Interconnects
- Publication number 20180331000
- Publication date Nov 15, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20180226375
- Publication date Aug 9, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20180226371
- Publication date Aug 9, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING
- Publication number 20180204798
- Publication date Jul 19, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20170338214
- Publication date Nov 23, 2017
- ZIPTRONIX, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20170301656
- Publication date Oct 19, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS
- Publication number 20170200711
- Publication date Jul 13, 2017
- ZIPTRONIX, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Paul M. Enquist

Person

Patents Grantslast 30 patents

Stacked dies and methods for forming bonded structures

Heterogeneous annealing method and device

Stacked dies and methods for forming bonded structures

Stacked devices and methods of fabrication

Stacked dies and methods for forming bonded structures

Stacked dies and methods for forming bonded structures

Heterogeneous annealing method

3D IC method and device

3D IC method and device

Stacked devices and methods of fabrication

Conductive barrier direct hybrid bonding

3D IC method and device

Systems and methods for efficient transfer of semiconductor elements

Bonded structures

Stacked dies and methods for forming bonded structures

Heterogeneous device

Probe methodology for ultrafine pitch interconnects

Increased contact alignment tolerance for direct bonding

Probe methodology for ultrafine pitch interconnects

Bonded structures

Systems and methods for efficient transfer of semiconductor elements

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Increased contact alignment tolerance for direct bonding

Conductive barrier direct hybrid bonding

Stacked dies and methods for forming bonded structures

3D IC method and device

Room temperature metal direct bonding

Conductive barrier direct hybrid bonding

Increased contact alignment tolerance for direct bonding

Patents Applicationslast 30 patents

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

STACKED DEVICES AND METHODS OF FABRICATION

STACKED DEVICES AND METHODS OF FABRICATION

HETEROGENEOUS ANNEALING METHOD AND DEVICE

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

DIRECTLY BONDED STRUCTURES

STACKED DEVICES AND METHODS OF FABRICATION

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

HETEROGENEOUS ANNEALING METHOD AND DEVICE

BONDED STRUCTURES

PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS

SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS

STACKED DEVICES AND METHODS OF FABRICATION

INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

3D IC METHOD AND DEVICE

ROOM TEMPERATURE METAL DIRECT BONDING

Probe methodology for ultrafine pitch Interconnects

BONDED STRUCTURES

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

3D IC METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS