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Paul M. Enquist

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  • Cary, NC, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    HETEROGENEOUS ANNEALING METHOD AND DEVICE
    • Publication number 20250149510
    • Publication date May 8, 2025
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20240145458
    • Publication date May 2, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20240088120
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20230282634
    • Publication date Sep 7, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HETEROGENEOUS ANNEALING METHOD AND DEVICE
    • Publication number 20230207322
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20230131849
    • Publication date Apr 27, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20230130580
    • Publication date Apr 27, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE BARRIER DIRECT HYBRID BONDING
    • Publication number 20220254746
    • Publication date Aug 11, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. ENQUIST
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECTLY BONDED STRUCTURES
    • Publication number 20220208723
    • Publication date Jun 30, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20220189941
    • Publication date Jun 16, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20210313225
    • Publication date Oct 7, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20210280461
    • Publication date Sep 9, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20210183847
    • Publication date Jun 17, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HETEROGENEOUS ANNEALING METHOD AND DEVICE
    • Publication number 20200328193
    • Publication date Oct 15, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20200144217
    • Publication date May 7, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
    • Publication number 20200105630
    • Publication date Apr 2, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Javier A. DELACRUZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS
    • Publication number 20200043910
    • Publication date Feb 6, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20190355706
    • Publication date Nov 21, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING
    • Publication number 20190244899
    • Publication date Aug 8, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE BARRIER DIRECT HYBRID BONDING
    • Publication number 20190237419
    • Publication date Aug 1, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. ENQUIST
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20190189607
    • Publication date Jun 20, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20190148222
    • Publication date May 16, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROOM TEMPERATURE METAL DIRECT BONDING
    • Publication number 20190115247
    • Publication date Apr 18, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Qin-Yi Tong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Probe methodology for ultrafine pitch Interconnects
    • Publication number 20180331000
    • Publication date Nov 15, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Javier A. DELACRUZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20180226375
    • Publication date Aug 9, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE BARRIER DIRECT HYBRID BONDING
    • Publication number 20180226371
    • Publication date Aug 9, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. ENQUIST
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING
    • Publication number 20180204798
    • Publication date Jul 19, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
    • Publication number 20170338214
    • Publication date Nov 23, 2017
    • ZIPTRONIX, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D IC METHOD AND DEVICE
    • Publication number 20170316971
    • Publication date Nov 2, 2017
    • ZIPTRONIX, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HETEROGENEOUS ANNEALING METHOD AND DEVICE
    • Publication number 20170301656
    • Publication date Oct 19, 2017
    • ZIPTRONIX, INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS