Paul R. McHugh

Person

Kalispell, MT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 12,104,269
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for improving within die co-planarity uniformity
- Patent number 11,984,358
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-compartment electrochemical replenishment cell
- Patent number 11,697,887
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 11,585,009
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,578,422
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for improving within die co-planarity uniformity
- Patent number 11,367,653
- Issue date Jun 21, 2022
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electroplating system
- Patent number 11,268,208
- Issue date Mar 8, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 11,230,793
- Issue date Jan 25, 2022
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,971,354
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Controlled etch of nitride features
- Patent number 10,840,104
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods to improve ALD uniformity
- Patent number 10,655,226
- Issue date May 19, 2020
- Applied Materials, Inc.
- Gregory J. Wilson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus with electrolyte agitation
- Patent number 10,577,712
- Issue date Mar 3, 2020
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating wafers having a pattern induced non-uniformity
- Patent number 10,570,526
- Issue date Feb 25, 2020
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Drying high aspect ratio features
- Patent number 10,546,762
- Issue date Jan 28, 2020
- Applied Materials, Inc.
- Eric J. Bergman
- B08 - CLEANING
Information Patent Grant
Electroplating dynamic edge control
- Patent number 10,494,731
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for wetting substrates
- Patent number 10,373,864
- Issue date Aug 6, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus with current crowding adapted contact ring...
- Patent number 10,364,506
- Issue date Jul 30, 2019
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adaptive electric field shielding in an electroplating processor us...
- Patent number 10,240,248
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Paul Van Valkenburg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus with electrolyte agitation
- Patent number 10,227,706
- Issue date Mar 12, 2019
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Inert anode electroplating processor and replenisher
- Patent number 10,227,707
- Issue date Mar 12, 2019
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removing photoresist from a wafer
- Patent number 10,191,379
- Issue date Jan 29, 2019
- Applied Materials, Inc.
- Paul R. McHugh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electroplating apparatus with membrane tube shield
- Patent number 10,081,881
- Issue date Sep 25, 2018
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus
- Patent number 10,047,453
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Inert anode electroplating processor and replenisher with anionic m...
- Patent number 9,920,448
- Issue date Mar 20, 2018
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate rinsing systems and methods
- Patent number 9,859,135
- Issue date Jan 2, 2018
- Applied Materials, Inc.
- Jonathan S. Frankel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating processor with current thief electrode
- Patent number 9,765,443
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus with notch adapted contact ring seal and t...
- Patent number 9,758,897
- Issue date Sep 12, 2017
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating wafers having a notch
- Patent number 9,689,082
- Issue date Jun 27, 2017
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESS CELL FOR FILED GUIDED POST EXPOSURE BAKE PROCESS
- Publication number 20240160117
- Publication date May 16, 2024
- Applied Materials, Inc.
- Dmitry LUBOMIRSKY
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES
- Publication number 20230411222
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Sam K. Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313405
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313406
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20230279576
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PARAMETER ADJUSTMENT MODEL FOR SEMICONDUCTOR PROCESSING CHAMBERS
- Publication number 20230257900
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION
- Publication number 20230193504
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20230167573
- Publication date Jun 1, 2023
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING
- Publication number 20230092346
- Publication date Mar 23, 2023
- Applied Materials, Inc.
- Charles Sharbono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING WITHIN DIE CO-PLANARITY UNIFORMITY
- Publication number 20220270923
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION
- Publication number 20220145485
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20220145489
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-COMPARTMENT ELECTROCHEMICAL REPLENISHMENT CELL
- Publication number 20220127747
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20210348296
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION
- Publication number 20210102307
- Publication date Apr 8, 2021
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING WITHIN DIE CO-PLANARITY UNIFORMITY
- Publication number 20200098628
- Publication date Mar 26, 2020
- Applied Materials, Inc.
- Paul McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYS...
- Publication number 20190345624
- Publication date Nov 14, 2019
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING DYNAMIC EDGE CONTROL
- Publication number 20190177869
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS WITH ELECTROLYTE AGITATION
- Publication number 20190153611
- Publication date May 23, 2019
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLED ETCH OF NITRIDE FEATURES
- Publication number 20190019688
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods to Improve ALD Uniformity
- Publication number 20180340259
- Publication date Nov 29, 2018
- Applied Materials, Inc.
- Gregory J. Wilson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR WETTING SUBSTRATES
- Publication number 20180182664
- Publication date Jun 28, 2018
- Applied Materials, Inc.
- Paul McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180144954
- Publication date May 24, 2018
- Applied Materials, Inc.
- Eric J. Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRYING HIGH ASPECT RATIO FEATURES
- Publication number 20180019119
- Publication date Jan 18, 2018
- Applied Materials Inc,
- Eric J. Bergman
- B08 - CLEANING
Information Patent Application
WAFER PROCESSOR DOOR INTERFACE
- Publication number 20170365492
- Publication date Dec 21, 2017
- Applied Materials, Inc.
- Kyle Moran Hanson
- B08 - CLEANING
Information Patent Application
REMOVING PHOTORESIST FROM A WAFER
- Publication number 20170357158
- Publication date Dec 14, 2017
- Applied Materials, Inc.
- Paul R. McHugh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTROPLATING APPARATUS WITH CURRENT CROWDING ADAPTED CONTACT RING...
- Publication number 20170335484
- Publication date Nov 23, 2017
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING WAFERS HAVING A NOTCH
- Publication number 20170283976
- Publication date Oct 5, 2017
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INERT ANODE ELECTROPLATING PROCESSOR AND REPLENISHER WITH ANIONIC M...
- Publication number 20170137959
- Publication date May 18, 2017
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING PROCESSOR WITH CURRENT THIEF ELECTRODE
- Publication number 20170058424
- Publication date Mar 2, 2017
- Applied Materials Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Paul R. McHugh

Person

Patents Grantslast 30 patents

Parameter adjustment model for semiconductor processing chambers

Mechanically-driven oscillating flow agitation

Electroplating system

Systems and methods for improving within die co-planarity uniformity

Multi-compartment electrochemical replenishment cell

Mechanically-driven oscillating flow agitation

Electroplating system

Systems and methods for improving within die co-planarity uniformity

Electroplating system

Mechanically-driven oscillating flow agitation

Drying high aspect ratio features

Controlled etch of nitride features

Apparatus and methods to improve ALD uniformity

Electroplating apparatus with electrolyte agitation

Electroplating wafers having a pattern induced non-uniformity

Drying high aspect ratio features

Electroplating dynamic edge control

Systems and methods for wetting substrates

Electroplating apparatus with current crowding adapted contact ring...

Adaptive electric field shielding in an electroplating processor us...

Electroplating apparatus with electrolyte agitation

Inert anode electroplating processor and replenisher

Removing photoresist from a wafer

Electroplating apparatus with membrane tube shield

Electroplating apparatus

Inert anode electroplating processor and replenisher with anionic m...

Substrate rinsing systems and methods

Electroplating processor with current thief electrode

Electroplating apparatus with notch adapted contact ring seal and t...

Electroplating wafers having a notch

Patents Applicationslast 30 patents

PROCESS CELL FOR FILED GUIDED POST EXPOSURE BAKE PROCESS

MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

PARAMETER ADJUSTMENT MODEL FOR SEMICONDUCTOR PROCESSING CHAMBERS

MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION

ELECTROPLATING SYSTEM

ELECTROPLATING CO-PLANARITY IMPROVEMENT BY DIE SHIELDING

SYSTEMS AND METHODS FOR IMPROVING WITHIN DIE CO-PLANARITY UNIFORMITY

MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION

ELECTROPLATING SYSTEM

MULTI-COMPARTMENT ELECTROCHEMICAL REPLENISHMENT CELL

ELECTROPLATING SYSTEM

MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION

SYSTEMS AND METHODS FOR IMPROVING WITHIN DIE CO-PLANARITY UNIFORMITY

SYSTEMS AND METHODS FOR REMOVING CONTAMINANTS IN ELECTROPLATING SYS...

ELECTROPLATING DYNAMIC EDGE CONTROL

ELECTROPLATING APPARATUS WITH ELECTROLYTE AGITATION

CONTROLLED ETCH OF NITRIDE FEATURES

Apparatus and Methods to Improve ALD Uniformity

SYSTEMS AND METHODS FOR WETTING SUBSTRATES

DRYING HIGH ASPECT RATIO FEATURES

DRYING HIGH ASPECT RATIO FEATURES

WAFER PROCESSOR DOOR INTERFACE

REMOVING PHOTORESIST FROM A WAFER

ELECTROPLATING APPARATUS WITH CURRENT CROWDING ADAPTED CONTACT RING...

ELECTROPLATING WAFERS HAVING A NOTCH

INERT ANODE ELECTROPLATING PROCESSOR AND REPLENISHER WITH ANIONIC M...

ELECTROPLATING PROCESSOR WITH CURRENT THIEF ELECTRODE