Paul Raymond Besser

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Correlated electron material (CEM) devices with contact region side...
- Patent number 11,075,339
- Issue date Jul 27, 2021
- CERFE LABS, INC.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of correlated electron material (CEM) devices with restor...
- Patent number 10,854,811
- Issue date Dec 1, 2020
- ARM Limited
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of a CEM device
- Patent number 10,833,271
- Issue date Nov 10, 2020
- ARM Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of correlated electron material (CEM) devices
- Patent number 10,672,982
- Issue date Jun 2, 2020
- ARM Limited
- Ming He
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for fabrication of a CEM device
- Patent number 10,566,527
- Issue date Feb 18, 2020
- ARM, Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition of HfAlC as a metal gate workfunction mater...
- Patent number 9,607,904
- Issue date Mar 28, 2017
- Intermolecular, Inc.
- Albert Sanghyup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrating germanides in high performance integrated ci...
- Patent number 9,553,031
- Issue date Jan 24, 2017
- Lam Research Corporation
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer integration for improved fin device performance
- Patent number 9,515,156
- Issue date Dec 6, 2016
- Lam Research Corporation
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact integration for reduced interface and series contact resist...
- Patent number 9,484,251
- Issue date Nov 1, 2016
- Lam Research Corporation
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structures for transistor devices for CMOS applications and pr...
- Patent number 9,362,283
- Issue date Jun 7, 2016
- GLOBALFOUNDRIES Inc.
- Zhendong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer for interconnect structure
- Patent number 9,269,615
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a contact for a semiconductor component an...
- Patent number 9,202,758
- Issue date Dec 1, 2015
- GLOBALFOUNDRIES Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits including fluorine inco...
- Patent number 9,196,475
- Issue date Nov 24, 2015
- GLOBALFOUNDRIES, INC.
- Bongki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,142,633
- Issue date Sep 22, 2015
- GLOBALFOUNDRIES, INC.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming gate structures for transistor devices for CMOS...
- Patent number 9,105,497
- Issue date Aug 11, 2015
- GLOBALFOUNDRIES Inc.
- Zhendong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer stacks for interconnect structures
- Patent number 9,076,792
- Issue date Jul 7, 2015
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits having low resistance m...
- Patent number 8,778,789
- Issue date Jul 15, 2014
- GLOBALFOUNDRIES, INC.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer stacks for interconnect structures
- Patent number 8,772,158
- Issue date Jul 8, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer barrier layer for interconnect structure
- Patent number 8,728,931
- Issue date May 20, 2014
- GLOBALFOUNDRIES, INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnects with improved electromigration lifetime
- Patent number 8,723,321
- Issue date May 13, 2014
- GLOBALFOUNDIES Inc.
- Christy Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming contact in an integrated circuit
- Patent number 8,709,941
- Issue date Apr 29, 2014
- Advanced Micro Devices, Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for PFET fabrication using APM solutions
- Patent number 8,703,620
- Issue date Apr 22, 2014
- GLOBALFOUNDRIES, INC.
- Joanna Wasyluk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits having low resistance d...
- Patent number 8,691,689
- Issue date Apr 8, 2014
- GLOBALFOUNDRIES Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metal multi-layer barrier layer for interconnect structure
- Patent number 8,623,758
- Issue date Jan 7, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce mol damage on NiSi
- Patent number 8,330,235
- Issue date Dec 11, 2012
- GLOBALFOUNDRIES Inc.
- Karthik Ramani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with contact integration
- Patent number 8,283,786
- Issue date Oct 9, 2012
- Advanced Micro Devices, Inc.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming silicides of different thicknesses on different...
- Patent number 8,236,693
- Issue date Aug 7, 2012
- Advanced Micro Devices, Inc.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit eliminating source/drain junction spiking
- Patent number 8,102,009
- Issue date Jan 24, 2012
- Advanced Micro Devices, Inc.
- Simon Siu-Sing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact in a semiconductor device with engineer...
- Patent number 8,039,391
- Issue date Oct 18, 2011
- Spansion LLC
- Jinsong Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce MOL damage on NiSi
- Patent number 7,994,038
- Issue date Aug 9, 2011
- GLOBALFOUNDRIES Inc.
- Karthik Ramani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE FOR CORRELATED ELECTRON DEVICE
- Publication number 20210226124
- Publication date Jul 22, 2021
- Cerfe Labs, Inc.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPANT ACTIVATION ANNEAL FOR CORRELATED ELECTRON DEVICE
- Publication number 20210066593
- Publication date Mar 4, 2021
- Cerfe Labs, Inc.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Structure Having a Barrier Layer
- Publication number 20200357996
- Publication date Nov 12, 2020
- ARM Limited
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRELATED ELECTRON SWITCH DEVICE SIDEWALL RESTORATION
- Publication number 20200295260
- Publication date Sep 17, 2020
- ARM Limited
- Xueming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES
- Publication number 20200295259
- Publication date Sep 17, 2020
- ARM Limited
- Ming He
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FABRICATION OF A CEM DEVICE
- Publication number 20200259083
- Publication date Aug 13, 2020
- ARM Limited
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES
- Publication number 20200176676
- Publication date Jun 4, 2020
- ARM Limited
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRELATED ELECTRON MATERIAL (CEM) DEVICES WITH CONTACT REGION SIDE...
- Publication number 20200127200
- Publication date Apr 23, 2020
- ARM Limited
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES WITH RESTOR...
- Publication number 20200127196
- Publication date Apr 23, 2020
- ARM Limited
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF A CEM DEVICE
- Publication number 20190296232
- Publication date Sep 26, 2019
- ARM Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF A CEM DEVICE
- Publication number 20190296236
- Publication date Sep 26, 2019
- ARM Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF A CEM DEVICE
- Publication number 20190296231
- Publication date Sep 26, 2019
- ARM Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF CORRELATED ELECTRON MATERIAL DEVICES
- Publication number 20180216228
- Publication date Aug 2, 2018
- ARM Ltd.
- Paul Raymond Besser
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER FILM INCLUDING A TANTALUM AND TITANIUM ALLOY AS A SCALAB...
- Publication number 20170170114
- Publication date Jun 15, 2017
- LAM RESEARCH CORPORATION
- Paul Raymond Besser
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Device Metal-Insulator-Semiconductor Contacts with In...
- Publication number 20160181380
- Publication date Jun 23, 2016
- INTERMOLECULAR INC.
- Amol Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER INTEGRATION FOR IMPROVED FIN DEVICE PERFORMANCE
- Publication number 20160111515
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tantalum carbide metal gate stack for mid-gap work function applica...
- Publication number 20160093711
- Publication date Mar 31, 2016
- INTERMOLECULAR INC.
- Zhendong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Deposition of HfAlC as a Metal Gate Workfunction Mater...
- Publication number 20160035631
- Publication date Feb 4, 2016
- GLOBALFOUNDRIES, Inc.
- Albert Sanghyup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING GATE STRUCTURES FOR TRANSISTOR DEVICES FOR CMOS...
- Publication number 20150311206
- Publication date Oct 29, 2015
- GLOBAL FOUNDRIES Inc.
- Zhendong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS INCLUDING FLUORINE INCO...
- Publication number 20150303057
- Publication date Oct 22, 2015
- GLOBALFOUNDRIES, Inc.
- Bongki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING GATE STRUCTURES FOR TRANSISTOR DEVICES FOR CMOS...
- Publication number 20150061027
- Publication date Mar 5, 2015
- GLOBALFOUNDRIES INC.
- Zhendong Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES
- Publication number 20140264876
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE-ASSISTED HEATING OF STRONG ACID SOLUTION TO REMOVE NICKEL...
- Publication number 20140248770
- Publication date Sep 4, 2014
- GLOBALFOUNDRIES INC.
- Clemens FITZ
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140217591
- Publication date Aug 7, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Poly Removal for replacement gate with an APM mixture
- Publication number 20140187051
- Publication date Jul 3, 2014
- INTERMOLECULAR INC.
- Joanna Wasyluk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20140167264
- Publication date Jun 19, 2014
- GLOBALFOUNDRIES INC.
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING LOW RESISTANCE M...
- Publication number 20140154877
- Publication date Jun 5, 2014
- Paul R. Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES
- Publication number 20140021615
- Publication date Jan 23, 2014
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140024212
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE
- Publication number 20140021613
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS

Paul Raymond Besser

Person

Patents Grantslast 30 patents

Correlated electron material (CEM) devices with contact region side...

Formation of correlated electron material (CEM) devices with restor...

Method for fabrication of a CEM device

Fabrication of correlated electron material (CEM) devices

Method for fabrication of a CEM device

Atomic layer deposition of HfAlC as a metal gate workfunction mater...

Method for integrating germanides in high performance integrated ci...

Air gap spacer integration for improved fin device performance

Contact integration for reduced interface and series contact resist...

Gate structures for transistor devices for CMOS applications and pr...

Multi-layer barrier layer for interconnect structure

Method for manufacturing a contact for a semiconductor component an...

Methods for fabricating integrated circuits including fluorine inco...

Integrated circuits and methods for fabricating integrated circuits...

Methods of forming gate structures for transistor devices for CMOS...

Multi-layer barrier layer stacks for interconnect structures

Methods for fabricating integrated circuits having low resistance m...

Multi-layer barrier layer stacks for interconnect structures

Multi-layer barrier layer for interconnect structure

Copper interconnects with improved electromigration lifetime

Method for forming contact in an integrated circuit

Methods for PFET fabrication using APM solutions

Methods for fabricating integrated circuits having low resistance d...

Subtractive metal multi-layer barrier layer for interconnect structure

Method to reduce mol damage on NiSi

Integrated circuit system with contact integration

Methods of forming silicides of different thicknesses on different...

Integrated circuit eliminating source/drain junction spiking

Method of forming a contact in a semiconductor device with engineer...

Method to reduce MOL damage on NiSi

Patents Applicationslast 30 patents

ELECTRODE FOR CORRELATED ELECTRON DEVICE

DOPANT ACTIVATION ANNEAL FOR CORRELATED ELECTRON DEVICE

Multi-Layered Structure Having a Barrier Layer

CORRELATED ELECTRON SWITCH DEVICE SIDEWALL RESTORATION

FABRICATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES

METHOD FOR FABRICATION OF A CEM DEVICE

FABRICATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES

CORRELATED ELECTRON MATERIAL (CEM) DEVICES WITH CONTACT REGION SIDE...

FORMATION OF CORRELATED ELECTRON MATERIAL (CEM) DEVICES WITH RESTOR...

METHOD FOR FABRICATION OF A CEM DEVICE

METHOD FOR FABRICATION OF A CEM DEVICE

METHOD FOR FABRICATION OF A CEM DEVICE

FABRICATION OF CORRELATED ELECTRON MATERIAL DEVICES

MULTILAYER FILM INCLUDING A TANTALUM AND TITANIUM ALLOY AS A SCALAB...

Semiconductor Device Metal-Insulator-Semiconductor Contacts with In...

AIR GAP SPACER INTEGRATION FOR IMPROVED FIN DEVICE PERFORMANCE

Tantalum carbide metal gate stack for mid-gap work function applica...

Atomic Layer Deposition of HfAlC as a Metal Gate Workfunction Mater...

METHODS OF FORMING GATE STRUCTURES FOR TRANSISTOR DEVICES FOR CMOS...

METHODS FOR FABRICATING INTEGRATED CIRCUITS INCLUDING FLUORINE INCO...

METHODS OF FORMING GATE STRUCTURES FOR TRANSISTOR DEVICES FOR CMOS...

MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES

MICROWAVE-ASSISTED HEATING OF STRONG ACID SOLUTION TO REMOVE NICKEL...

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE

Poly Removal for replacement gate with an APM mixture

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING LOW RESISTANCE M...

MULTI-LAYER BARRIER LAYER STACKS FOR INTERCONNECT STRUCTURES

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE

MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE