Paul Robert Hoffman

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lead-frame method and assembly for interconnecting circuits within...
- Patent number 7,176,062
- Issue date Feb 13, 2007
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 7,064,009
- Issue date Jun 20, 2006
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 7,045,883
- Issue date May 16, 2006
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for improving heat dissipation in stacked semiconductor...
- Patent number 6,919,631
- Issue date Jul 19, 2005
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame method and assembly for interconnecting circuits within...
- Patent number 6,900,527
- Issue date May 31, 2005
- Amkor Technology, Inc.
- Jeffrey Alan Miks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package an...
- Patent number 6,873,032
- Issue date Mar 29, 2005
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick sealing glass-lidded package fabrication method
- Patent number 6,759,266
- Issue date Jul 6, 2004
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for improving heat dissipation in stacked semiconductor...
- Patent number 6,737,750
- Issue date May 18, 2004
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with single-sided substrate and meth...
- Patent number 6,707,168
- Issue date Mar 16, 2004
- Amkor Technology, Inc.
- Paul Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalized circuit module package and method for packaging circui...
- Patent number 6,632,997
- Issue date Oct 14, 2003
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor module with integrated discrete components mounted on a window
- Patent number 6,630,661
- Issue date Oct 7, 2003
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor leadframe package
- Patent number 6,614,102
- Issue date Sep 2, 2003
- Amkor Technology, Inc.
- Paul Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick sealing glass-lidded package
- Patent number 6,603,183
- Issue date Aug 5, 2003
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced chip scale lead on chip semiconductor package
- Patent number 6,597,059
- Issue date Jul 22, 2003
- Amkor Technology, Inc.
- David R. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package with semiconductor chip and electronic d...
- Patent number 6,576,998
- Issue date Jun 10, 2003
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing such device
- Patent number 6,489,667
- Issue date Dec 3, 2002
- Amkor Technology, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor package of the fan-out type and method of...
- Patent number 6,462,274
- Issue date Oct 8, 2002
- Amkor Technology, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package having a heat sink structure for inc...
- Patent number 6,423,576
- Issue date Jul 23, 2002
- Amkor Technology, Inc.
- Paul Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for stacked integrated circuits
- Patent number 6,414,396
- Issue date Jul 2, 2002
- Amkor Technology, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package having a heat sink structure for inc...
- Patent number 6,028,354
- Issue date Feb 22, 2000
- Amkor Technology, Inc.
- Paul Hoffman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOOK DOWN IMAGE SENSOR PACKAGE
- Publication number 20050051859
- Publication date Mar 10, 2005
- Amkor Technology, Inc.
- Paul Robert Hoffman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR MULTIPLE INTEGRATED CIRCUITS AND METHOD OF MAKING
- Publication number 20030082845
- Publication date May 1, 2003
- Amkor Technology, Inc.
- PAUL HOFFMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Personalized circuit module package and method for packaging Circui...
- Publication number 20030000722
- Publication date Jan 2, 2003
- Paul Robert Hoffman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In...
- Publication number 20020096253
- Publication date Jul 25, 2002
- AMKOR Technology, Inc.,
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Paul Robert Hoffman

Person

Patents Grantslast 30 patents

Lead-frame method and assembly for interconnecting circuits within...

Thermally enhanced chip scale lead on chip semiconductor package an...

Thermally enhanced chip scale lead on chip semiconductor package an...

Structures for improving heat dissipation in stacked semiconductor...

Lead-frame method and assembly for interconnecting circuits within...

Thermally enhanced chip scale lead on chip semiconductor package an...

Quick sealing glass-lidded package fabrication method

Structures for improving heat dissipation in stacked semiconductor...

Shielded semiconductor package with single-sided substrate and meth...

Personalized circuit module package and method for packaging circui...

Sensor module with integrated discrete components mounted on a window

Shielded semiconductor leadframe package

Quick sealing glass-lidded package

Thermally enhanced chip scale lead on chip semiconductor package

Thin semiconductor package with semiconductor chip and electronic d...

Semiconductor device and method of manufacturing such device

Chip-scale semiconductor package of the fan-out type and method of...

Microelectronic device package having a heat sink structure for inc...

Package for stacked integrated circuits

Microelectronic device package having a heat sink structure for inc...

Patents Applicationslast 30 patents

LOOK DOWN IMAGE SENSOR PACKAGE

PACKAGE FOR MULTIPLE INTEGRATED CIRCUITS AND METHOD OF MAKING

Personalized circuit module package and method for packaging Circui...

Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In...