PAUL S. MCLAUGHLIN

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metallic synapses for neuromorphic and evolvable hardware
- Patent number 10,840,174
- Issue date Nov 17, 2020
- Samsung Electronics Co., Ltd.
- Shawn P. Fetterolf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
On-chip sensor for monitoring active circuits on integrated circuit...
- Patent number 10,191,108
- Issue date Jan 29, 2019
- GLOBALFOUNDRIES Inc.
- Gregory G. Freeman
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration test structure for Cu barrier integrity and blech...
- Patent number 9,759,766
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration test structure for Cu barrier integrity and blech...
- Patent number 9,472,477
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Griselda Bonilla
- G01 - MEASURING TESTING
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,443,776
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,287,186
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromigration resistant via-to-line interconnect
- Patent number 8,922,022
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to predict a number of electromigration critical...
- Patent number 8,726,201
- Issue date May 13, 2014
- International Business Machines Corporation
- Jeanne P. Bickford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromigration resistant via-to-line interconnect
- Patent number 8,114,768
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prediction of premature dielectric breakdown in a semico...
- Patent number 8,053,257
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming an embedded barrier layer for protection from che...
- Patent number 7,968,456
- Issue date Jun 28, 2011
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser fuse structures for high power applications
- Patent number 7,701,035
- Issue date Apr 20, 2010
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for modeling stress-induced degradation of conductive int...
- Patent number 7,692,439
- Issue date Apr 6, 2010
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Test structure for determining optimal seed and liner layer thickne...
- Patent number 7,671,362
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for monitoring stress-induced degradation of conductive i...
- Patent number 7,639,032
- Issue date Dec 29, 2009
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a crack stop void in a low-k dielectric layer bet...
- Patent number 7,479,447
- Issue date Jan 20, 2009
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing electromigration lifetime and current density in IC usin...
- Patent number 7,439,173
- Issue date Oct 21, 2008
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for monitoring stress-induced degradation of c...
- Patent number 7,397,260
- Issue date Jul 8, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Embedded barrier for dielectric encapsulation
- Patent number 7,394,154
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for determining thermal cycle reliability
- Patent number 7,388,224
- Issue date Jun 17, 2008
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integration of business process and use of fields in a master database
- Patent number 7,386,549
- Issue date Jun 10, 2008
- International Business Machines Corporation
- Jeanne P. S. Bickford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Increasing electromigration lifetime and current density in IC usin...
- Patent number 7,301,236
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 7,098,054
- Issue date Aug 29, 2006
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test structure for locating electromigration voids in dual damascen...
- Patent number 6,995,392
- Issue date Feb 7, 2006
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relational database for producing bill-of-materials from planning i...
- Patent number 6,850,904
- Issue date Feb 1, 2005
- International Business Machines Corporation
- Donald F. Ballas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Relational database for producing bill-of-materials from planning i...
- Patent number 6,819,967
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Donald F. Ballas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Screening mask having a stress-relieving area
- Patent number 6,662,718
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Evelyn Barrington
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,593,660
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive line features for enhanced reliability...
- Patent number 6,348,233
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Jeffrey A. Brody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,261,951
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METALLIC SYNAPSES FOR NEUROMORPHIC AND EVOLVABLE HARDWARE
- Publication number 20180300599
- Publication date Oct 18, 2018
- International Business Machines Corporation
- SHAWN P. FETTEROLF
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROMIGRATION TEST STRUCTURE FOR CU BARRIER INTEGRITY AND BLECH...
- Publication number 20170176514
- Publication date Jun 22, 2017
- International Business Machines Corporation
- GRISELDA BONILLA
- G01 - MEASURING TESTING
Information Patent Application
ON-CHIP SENSOR FOR MONITORING ACTIVE CIRCUITS ON INTEGRATED CIRCUIT...
- Publication number 20170146592
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Gregory G. Freeman
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20150262899
- Publication date Sep 17, 2015
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OBJECT BASED METHOD TO EVALUATE RULES
- Publication number 20140067747
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Yaowu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT
- Publication number 20120119366
- Publication date May 17, 2012
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM TO PREDICT A NUMBER OF ELECTROMIGRATION CRITICAL...
- Publication number 20110283249
- Publication date Nov 17, 2011
- International Business Machines Corporation
- Jeanne P. BICKFORD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT
- Publication number 20100164116
- Publication date Jul 1, 2010
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...
- Publication number 20090146143
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Destructive Electrical Characterization Macro and Methodology f...
- Publication number 20090006014
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for modeling stress-induced degradation of conductive int...
- Publication number 20080231312
- Publication date Sep 25, 2008
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20080224135
- Publication date Sep 18, 2008
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED BARRIER FOR DIELECTRIC ENCAPSULATION
- Publication number 20080217777
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20080174334
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for monitoring stress-induced degradation of conductive inte...
- Publication number 20080107149
- Publication date May 8, 2008
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...
- Publication number 20080026567
- Publication date Jan 31, 2008
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER FUSE STRUCTURES FOR HIGH POWER APPLICATIONS
- Publication number 20070120232
- Publication date May 31, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MONITORING STRESS-INDUCED DEGRADATION OF C...
- Publication number 20070115018
- Publication date May 24, 2007
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...
- Publication number 20070087555
- Publication date Apr 19, 2007
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded barrier for dielectric encapsulation
- Publication number 20070057374
- Publication date Mar 15, 2007
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20060281338
- Publication date Dec 14, 2006
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20060273460
- Publication date Dec 7, 2006
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A CRACK STOP VOID IN A LOW-K DIELECTRIC LAYER BET...
- Publication number 20060223242
- Publication date Oct 5, 2006
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20050186689
- Publication date Aug 25, 2005
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integration of business process and use of fields in a master database
- Publication number 20040220937
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Jeanne P. S. Bickford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Test structure for locating electromigration voids in dual damascen...
- Publication number 20040026693
- Publication date Feb 12, 2004
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Relational database for producing bill-of-materials from planning i...
- Publication number 20040019604
- Publication date Jan 29, 2004
- International Business Machines Corporation
- Donald F. Ballas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Relational database for producing bill-of-materials from planning i...
- Publication number 20040019538
- Publication date Jan 29, 2004
- International Business Machines Corporation
- Donald F. Ballas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Screening mask having a stress-relieving area
- Publication number 20030004076
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Evelyn Barrington
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Publication number 20010053591
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

PAUL S. MCLAUGHLIN

Person

Patents Grantslast 30 patents

Metallic synapses for neuromorphic and evolvable hardware

On-chip sensor for monitoring active circuits on integrated circuit...

Electromigration test structure for Cu barrier integrity and blech...

Electromigration test structure for Cu barrier integrity and blech...

Method and structure for determining thermal cycle reliability

Method and structure for determining thermal cycle reliability

Electromigration resistant via-to-line interconnect

Method and system to predict a number of electromigration critical...

Electromigration resistant via-to-line interconnect

Method for prediction of premature dielectric breakdown in a semico...

Method of forming an embedded barrier layer for protection from che...

Laser fuse structures for high power applications

Structure for modeling stress-induced degradation of conductive int...

Test structure for determining optimal seed and liner layer thickne...

Structure for monitoring stress-induced degradation of conductive i...

Method of forming a crack stop void in a low-k dielectric layer bet...

Increasing electromigration lifetime and current density in IC usin...

Structure and method for monitoring stress-induced degradation of c...

Embedded barrier for dielectric encapsulation

Structure for determining thermal cycle reliability

Integration of business process and use of fields in a master database

Increasing electromigration lifetime and current density in IC usin...

Method and structure for determining thermal cycle reliability

Test structure for locating electromigration voids in dual damascen...

Relational database for producing bill-of-materials from planning i...

Relational database for producing bill-of-materials from planning i...

Screening mask having a stress-relieving area

Plasma treatment to enhance inorganic dielectric adhesion to copper

Method of forming conductive line features for enhanced reliability...

Plasma treatment to enhance inorganic dielectric adhesion to copper

Patents Applicationslast 30 patents

METALLIC SYNAPSES FOR NEUROMORPHIC AND EVOLVABLE HARDWARE

ELECTROMIGRATION TEST STRUCTURE FOR CU BARRIER INTEGRITY AND BLECH...

ON-CHIP SENSOR FOR MONITORING ACTIVE CIRCUITS ON INTEGRATED CIRCUIT...

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

OBJECT BASED METHOD TO EVALUATE RULES

ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT

METHOD AND SYSTEM TO PREDICT A NUMBER OF ELECTROMIGRATION CRITICAL...

ELECTROMIGRATION RESISTANT VIA-TO-LINE INTERCONNECT

TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...

Non-Destructive Electrical Characterization Macro and Methodology f...

Structure for modeling stress-induced degradation of conductive int...

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

EMBEDDED BARRIER FOR DIELECTRIC ENCAPSULATION

METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...

Method for monitoring stress-induced degradation of conductive inte...

INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...

LASER FUSE STRUCTURES FOR HIGH POWER APPLICATIONS

STRUCTURE AND METHOD FOR MONITORING STRESS-INDUCED DEGRADATION OF C...

INCREASING ELECTROMIGRATION LIFETIME AND CURRENT DENSITY IN IC USIN...

Embedded barrier for dielectric encapsulation

METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...

Method and structure for determining thermal cycle reliability

METHOD OF FORMING A CRACK STOP VOID IN A LOW-K DIELECTRIC LAYER BET...

Method and structure for determining thermal cycle reliability

Integration of business process and use of fields in a master database

Test structure for locating electromigration voids in dual damascen...

Relational database for producing bill-of-materials from planning i...

Relational database for producing bill-of-materials from planning i...

Screening mask having a stress-relieving area

Plasma treatment to enhance inorganic dielectric adhesion to copper