PEIQI WANG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for low resistivity and stress tungsten gap fill
- Patent number 12,094,773
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming low resistivity tungsten features
- Patent number 12,037,682
- Issue date Jul 16, 2024
- Applied Materials, Inc.
- Peiqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas delivery for tungsten-containing layer
- Patent number 11,939,668
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Zubin Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low resistivity and stress tungsten gap fill
- Patent number 11,798,845
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES
- Publication number 20240368754
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Peiqi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGST...
- Publication number 20240274407
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER
- Publication number 20240229230
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS
- Publication number 20240222128
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Mingrui ZHAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...
- Publication number 20240209500
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...
- Publication number 20240162089
- Publication date May 16, 2024
- Applied Materials, Inc.
- Dixiong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20240047268
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR F...
- Publication number 20230374660
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Harpreet SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20230369113
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY
- Publication number 20230357929
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER
- Publication number 20230340662
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL ENHANCEMENT WITH THERMAL ETCH
- Publication number 20230317458
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Kai WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM COVER PLATE TO REDUCE WAFER PLANAR NONUNIFORMITY
- Publication number 20230130756
- Publication date Apr 27, 2023
- Applied Materials, Inc.
- Zubin HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES
- Publication number 20230107536
- Publication date Apr 6, 2023
- Applied Materials, Inc.
- Peiqi WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES
- Publication number 20220359279
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220336274
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220130724
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR CLEANING A SHOWERHEAD
- Publication number 20210335586
- Publication date Oct 28, 2021
- Applied Materials, Inc.
- Tom H. YU
- B08 - CLEANING
Information Patent Application
METHODS, APPARATUSES AND SYSTEMS FOR CONDUCTIVE FILM LAYER THICKNES...
- Publication number 20190390949
- Publication date Dec 26, 2019
- KAI WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Methods for low resistivity and stress tungsten gap fill

Methods for forming low resistivity tungsten features

Gas delivery for tungsten-containing layer

Methods and apparatus for low resistivity and stress tungsten gap fill

Patents Applicationslast 30 patents

METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES

PROCESSING SYSTEM AND METHODS TO CO-STRIKE PLASMA TO ENHANCE TUNGST...

GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER

METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS

PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...

SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

HARDWARE TO UNIFORMLY DISTRIBUTE ACTIVE SPECIES FOR SEMICONDUCTOR F...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY

GAS DELIVERY FOR TUNGSTEN-CONTAINING LAYER

GAP FILL ENHANCEMENT WITH THERMAL ETCH

BOTTOM COVER PLATE TO REDUCE WAFER PLANAR NONUNIFORMITY

METHODS FOR FORMING LOW RESISTIVITY TUNGSTEN FEATURES

METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES

METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

METHODS AND APPARATUS FOR CLEANING A SHOWERHEAD

METHODS, APPARATUSES AND SYSTEMS FOR CONDUCTIVE FILM LAYER THICKNES...