Perminder S. Bindra

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection method and structure for organic circuit boards
- Patent number 5,435,057
- Issue date Jul 25, 1995
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection method and structure for organic circuit boards
- Patent number 5,298,685
- Issue date Mar 29, 1994
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated circuitized power core alignment and lamination
- Patent number 5,229,550
- Issue date Jul 20, 1993
- International Business Machines Corporation
- Perminder S. Bindra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating nendritic materials
- Patent number 5,185,073
- Issue date Feb 9, 1993
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable electrical connection technology
- Patent number 5,137,461
- Issue date Aug 11, 1992
- International Business Machines Corporation
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated circuitized power core alignment and lamination
- Patent number 5,129,142
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Perminder S. Bindra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment--registration tool for fabricating multi-layer electronic...
- Patent number 5,048,178
- Issue date Sep 17, 1991
- International Business Machines Corp.
- Perminder S. Bindra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regeneration of spent ferric chloride etchants
- Patent number 5,035,778
- Issue date Jul 30, 1991
- International Business Machines Corporation
- Perminder Bindra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct electroplating of through holes
- Patent number 4,969,979
- Issue date Nov 13, 1990
- International Business Machines Corporation
- Bernd K. Appelt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conditioning a dielectric substrate for plating thereon
- Patent number 4,910,049
- Issue date Mar 20, 1990
- International Business Machines Corporation
- Perminder S. Bindra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for monitoring metal ion concentrations in plating baths
- Patent number 4,725,339
- Issue date Feb 16, 1988
- International Business Machines Corporation
- Perminder Bindra
- G01 - MEASURING TESTING
Information Patent Grant
Copper plating bath having increased plating rate, and method
- Patent number 4,540,473
- Issue date Sep 10, 1985
- International Business Machines Corporation
- Perminder S. Bindra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacture employing electrochemically dispersed platinu...
- Patent number 4,490,219
- Issue date Dec 25, 1984
- International Business Machines Corporation
- Perminder S. Bindra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for determination of concentration of organic additive in pl...
- Patent number 4,479,852
- Issue date Oct 30, 1984
- International Business Machines Corporation
- Perminder S. Bindra
- G01 - MEASURING TESTING
Information Patent Grant
Use of underpotential deposited layers of metals on foreign metal s...
- Patent number 4,457,986
- Issue date Jul 3, 1984
- International Business Machines Corporation
- Perminder S. Bindra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic cells with alkaline electrolytes containing trifluorom...
- Patent number 4,397,730
- Issue date Aug 9, 1983
- International Business Machines Corporation
- Perminder S. Bindra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Perminder S. Bindra

Person

Patents Grantslast 30 patents

Interconnection method and structure for organic circuit boards

Interconnection method and structure for organic circuit boards

Encapsulated circuitized power core alignment and lamination

Method of fabricating nendritic materials

Separable electrical connection technology

Encapsulated circuitized power core alignment and lamination

Alignment--registration tool for fabricating multi-layer electronic...

Regeneration of spent ferric chloride etchants

Direct electroplating of through holes

Conditioning a dielectric substrate for plating thereon

Method for monitoring metal ion concentrations in plating baths

Copper plating bath having increased plating rate, and method

Method of manufacture employing electrochemically dispersed platinu...

Method for determination of concentration of organic additive in pl...

Use of underpotential deposited layers of metals on foreign metal s...

Electrolytic cells with alkaline electrolytes containing trifluorom...