John A. Mock, "On-Off Plating Puts Down Dense, Fine-Grained Finishes", ME, Sep. 1978, pp. 76-78. |
C. J. Raub et al., Pulse-Plated Gold, Plating and Surface Finishing, Sep. 1978, pp. 32-34. |
Richard Haynes, Quantity of Metal Deposited in Pulsed Plating vs. Direct Current Plating, Journal of the Electrochemical Society, May 1979. |
F. A. Lowenheim, Modern Electroplating, John Wiley & Sons, Inc. New York, 1979, pp. 224-233. |
IBM Technical Disclosure Bulletin vol. 14, No. 9, Feb. 1972, p. 2769 "Dendritic Wick for Heat Pipe Application" Ingram et al. |
IBM Technical Disclosure Bulletin vol. 18, No. 4 Sep. 1975 pp. 1239-1240 "Low to High-Temperature Capillary", J. J. Cuomo. |
IBM Technical Disclosure Bulletin vol. 19, No. 5, Oct. 1976 p. 1922 "Converting Anisotropic Photon Absorbers into Isotropic Absorbers", J. J. Cuomo. |
IBM Technical Disclosure Bulletin vol. 20, No. 118, Apr. 1978 p. 4789 "Liquid Metal Multihead Connector", V. Y. Doo. |
IBM Technical Disclosure Bulletin vol. 22, No. 7, Dec. 1979 p. 2706 "Liquid Metal/Dendrite Connector" Babuka et al. |
IBM Technical Disclosure Bulletin vol. 23, No. 8, Jan. 1981 p. 3631 "Dendrite Connector System with Reinforced Base", E. J. Armstrong. |
IBM Technical Disclosure Bulletin, vol 24 No. 1A Jun. 1981 p. 2 "Process for Producing Palladium Structures" E. J. Armstrong et al. |
Electrical Manufacturing Nov. 1954 pp. 110 to 114 "A Hidden Cause of Failure in Electronic Equipment: Metal Whiskers", S. M. Arnold. |
Wiley & Sons 1976 pp. 136-139, 144 "The Structure and Properties of Materials", Moffatt et al. |
Scientific American, Jul. 1960 pp. 64-72 "Whiskers", S. S. Brenner. |
Encyclopaedic Dictionary of Physics, Pergamon Press, 1961 pp. 286-287 Thewlis et al. |
American Electroplaters Society-Solar Collectors Symposium, Atlanta, Ga. Nov. 9-10, 1976 "Dendritic Tungsten for Solar Thermal Conversion", Cuomo et al. |
IBM Journal of Research and Development vol. No. 4 Jul. 1978 pp. 372-377 "Solar Absorbing Surfaces of Anodized Dendritic Tungsten", Pettit et al. |
Journal of Electrochemical Society vol. 116 No. 12 pp. 1742-1745 Dec. 1969 "Electrical Resistivity of Tungsten Films Prepared by WF.sub.6 Reduction", Mayadas et al. |
Electronic Design Sep. 13, 1965 pp. 34-37 "Switch Needs Dictate Contact Material", M. Grundfest. |
IBM Technical Report TR01A230 Jun. 11, 1987 "Encapsulating C-4 Joints on Metallized Ceramics", J. G. Ameen et al. |
ASM World Materials Congress Sep. 1988 "Controlled Collapse Chip Connections (C4)". |
Research Disclosure-vol. 287 No. 48 Mar. 10, 1988 p. 155. |