This is a divisional application of Ser. No. 07/913,086, and now U.S. Pat. No. 5,298,685, filed on Jul. 14, 1992, which is a continuation-in-part of our U.S. patent application Ser. No. 07/605,615, and now U.S. Pat. No. 5,129,142, filed Oct. 30, 1990 and entitled "Encapsulated Circuitized Power Core Alignment and Lamination," the entire disclosure of which is incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
1155427 | Liebmann et al. | Oct 1915 | |
2461980 | Hansen | Feb 1949 | |
2576528 | Matthysse | Nov 1951 | |
3157735 | Strcup et al. | Nov 1964 | |
3239597 | Flynn | Mar 1966 | |
3254189 | Evanicsko, Jr., et al. | May 1966 | |
3526867 | Keeler | Jul 1967 | |
3725844 | McKeown et al. | Apr 1973 | |
3756891 | Ryan | Sep 1973 | |
3795047 | Adolafa et al. | Mar 1974 | |
3818415 | Evans et al. | Jun 1974 | |
3839727 | Herdzik et al. | Oct 1974 | |
3934334 | Hanni | Jan 1976 | |
3984244 | Collier et al. | Oct 1976 | |
4005698 | Cuomo et al. | Feb 1977 | |
4383003 | Lifshin et al. | May 1983 | |
4478883 | Bupp et al. | Oct 1984 | |
4551210 | Parthasarathi | Nov 1985 | |
4670770 | Tai | Jun 1987 | |
4774122 | Adler | Sep 1988 | |
4803450 | Burgess et al. | Feb 1989 | |
4830264 | Bitaillou et al. | May 1989 | |
5019944 | Ishii et al. | May 1991 | |
5105537 | Datta et al. | Apr 1992 |
Number | Date | Country |
---|---|---|
1121011 | Mar 1982 | CAX |
2151683 | Apr 1973 | DEX |
1-198092 | Aug 1989 | JPX |
Entry |
---|
Whiskers, Sc. Am., 1960. |
Metal Whiskers by S. M. Arnold, Bell Telephone Laboratories, Inc., Electrical Manufacturing Nov. 1954 pp. 110-114. |
Direct Attachment of a Silicon Carrier for IC Chips to a Circuit Card, vol. 32, No. 4A, Sep., 1989. |
Switches by Michael A. Grundfest, Electronic Design, Sep. 13, 1965, pp. 34-38. |
Dendrite Connector System with Reinforced Base, IBM Technical Disclosure Bulletin, vol. 23, No. 8, Jan. 1981. |
Process for Producing Palladium Structures, IBM Technical Disclosure Bulletin, vol. 14, No. 1A, Jun. 1981. |
Liquid Metal/Dendrite Connector, IBM Technical Disclosure Dec. 1979. |
Low to High-temperature Capillary, IBM Technical Disclosure Bulletin, vol. 18, No. 4, Sep. 1975. |
Assembling High-Density Printed-Circuit Boards, IBM Technical Disclosure Bulletin, vol. 15, No. 1, Jun. 1972. |
Dendritic Wick for Heat Pipe Application, IBM Technical Disclosure Bulletin, vol. 14, No. 9, Feb. 1972. |
Number | Date | Country | |
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Parent | 913086 | Jul 1992 |
Number | Date | Country | |
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Parent | 605615 | Oct 1990 |