Peter A. Franklin

Person

Marlboro, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inherently robust repair process for thin film circuitry using uv l...
- Patent number 6,541,709
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Peter A. Franklin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of top-surface-metallurgy plate-up bonding and rewiring for...
- Patent number 6,455,331
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inherently robust repair process for thin film circuitry using UV l...
- Patent number 6,427,324
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Peter A. Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,248,599
- Issue date Jun 19, 2001
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed metal delete process for thin film repair solutions using dire...
- Patent number 6,235,544
- Issue date May 22, 2001
- International Business Machines Corporation
- Peter A. Franklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film device repaired using enhanced repair process
- Patent number 6,054,749
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,048,741
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thin film wiring net repair process
- Patent number 5,972,723
- Issue date Oct 26, 1999
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics assisted manufacturing process for thin-film devices
- Patent number 5,937,269
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process of top-surface-metallurgy plate-up bonding and rewiring for...
- Publication number 20010023081
- Publication date Sep 20, 2001
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS

Peter A. Franklin

Person

Patents Grantslast 30 patents

Inherently robust repair process for thin film circuitry using uv l...

Process of top-surface-metallurgy plate-up bonding and rewiring for...

Inherently robust repair process for thin film circuitry using UV l...

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Seed metal delete process for thin film repair solutions using dire...

Thin film device repaired using enhanced repair process

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Enhanced thin film wiring net repair process

Graphics assisted manufacturing process for thin-film devices

Patents Applicationslast 30 patents

Process of top-surface-metallurgy plate-up bonding and rewiring for...