Number | Name | Date | Kind |
---|---|---|---|
4254445 | Ho | Mar 1981 | A |
4480288 | Gazdik et al. | Oct 1984 | A |
4489364 | Chance et al. | Dec 1984 | A |
5220490 | Weigler et al. | Jun 1993 | A |
5224022 | Weigler et al. | Jun 1993 | A |
5243140 | Bhatia et al. | Sep 1993 | A |
5258236 | Arjavalingam et al. | Nov 1993 | A |
5371390 | Mohsen | Dec 1994 | A |
Entry |
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IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3729-3730. Planar Wiring Repair Technique for the Thin-Film Metal Package Via Solder Evaporation. |