Peter Baumgartner

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Variable capacitance device with multiple two-dimensional electron...
- Patent number 12,034,085
- Issue date Jul 9, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride Schottky diode
- Patent number 11,545,586
- Issue date Jan 3, 2023
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride silicon controlled rectifier
- Patent number 11,424,354
- Issue date Aug 23, 2022
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable capacitance device with multiple two-dimensional electron...
- Patent number 11,380,806
- Issue date Jul 5, 2022
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-nitride antenna diode
- Patent number 11,373,995
- Issue date Jun 28, 2022
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant fin transistor (RFT)
- Patent number 11,201,151
- Issue date Dec 14, 2021
- Intel Corporation
- Richard Hudeczek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming semiconductor devices
- Patent number 11,024,712
- Issue date Jun 1, 2021
- Intel IP Corporation
- Vase Jovanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 11,018,713
- Issue date May 25, 2021
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 10,135,481
- Issue date Nov 20, 2018
- Intel IP Corporation
- Edmund Goetz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wireless in-chip and chip to chip communication
- Patent number 10,122,420
- Issue date Nov 6, 2018
- Intel IP Corporation
- Thorsten Meyer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flow diversion devices
- Patent number 9,818,672
- Issue date Nov 14, 2017
- Intel IP Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of environmental conditions in a semiconductor chip
- Patent number 9,793,220
- Issue date Oct 17, 2017
- INTEL DEUTSCHLAND GMBH
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexibly-wrapped integrated circuit die
- Patent number 9,515,049
- Issue date Dec 6, 2016
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency shielding within a semiconductor package
- Patent number 9,362,233
- Issue date Jun 7, 2016
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having different fin widths
- Patent number 8,716,786
- Issue date May 6, 2014
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric segmented channel transistors
- Patent number 8,597,999
- Issue date Dec 3, 2013
- Infineon Technologies AG
- Peter Baumgartner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor having a plurality of parallel conductive members
- Patent number 8,569,820
- Issue date Oct 29, 2013
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure
- Patent number 8,536,677
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric segmented channel transistors
- Patent number 8,432,004
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Peter Baumgartner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with reduced capacitance tolerance value
- Patent number 8,394,696
- Issue date Mar 12, 2013
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric segmented channel transistors
- Patent number 8,377,778
- Issue date Feb 19, 2013
- Infineon Technologies AG
- Peter Baumgartner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 8,138,539
- Issue date Mar 20, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric segmented channel transistors
- Patent number 8,067,287
- Issue date Nov 29, 2011
- Infineon Technologies AG
- Peter Baumgartner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor element and a method for producing the same
- Patent number 7,906,802
- Issue date Mar 15, 2011
- Infineon Technologies AG
- Peter Baumgartner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with capacitor arrangement electrically couple...
- Patent number 7,906,831
- Issue date Mar 15, 2011
- Infineon Technologies AG
- Peter Baumgartner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Biasing a transistor out of a supply voltage range
- Patent number 7,897,956
- Issue date Mar 1, 2011
- Infineon Technologies AG
- Domagoj Siprak
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Modulated-Vt transistor
- Patent number 7,880,202
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor structure
- Patent number 7,557,426
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with inductors in multiple conductive layers
- Patent number 7,489,220
- Issue date Feb 10, 2009
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor structure
- Patent number 7,485,945
- Issue date Feb 3, 2009
- Infineon Technologies AG
- Peter Baumgartner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS
- Publication number 20250007145
- Publication date Jan 2, 2025
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL-TRANSPORT TRANSISTOR...
- Publication number 20250006837
- Publication date Jan 2, 2025
- Intel Corporation
- Richard GEIGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Routing and Passive Components in a Direct Bonding Layer
- Publication number 20250006630
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Waveguides for Semiconductor Technology
- Publication number 20250006668
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429269
- Publication date Dec 26, 2024
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE GAIN AMPLIFIER WITH COMPLEMENTARILY SWITCHED NEUTRALIZED D...
- Publication number 20240429888
- Publication date Dec 26, 2024
- Intel Corporation
- Ritesh Bhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429155
- Publication date Dec 26, 2024
- Intel Corporation
- Mamatha YAKKEGONDI VIRUPAKSHAPPA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ON-CHIP PHASE NOISE MEASUREMENT SYSTEM FOR BUILD-IN SELF-TEST OF MU...
- Publication number 20240385307
- Publication date Nov 21, 2024
- Intel Corporation
- Lukas SCHRAMM
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL POWER COMBINERS
- Publication number 20240322775
- Publication date Sep 26, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20230252214
- Publication date Aug 10, 2023
- Intel Corporation
- Richard Hudeczek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ISOLATION OF SEMICONDUCTOR DEVICES BY BURIED SEPARATION RAILS
- Publication number 20230197527
- Publication date Jun 22, 2023
- Intel Corporation
- Richard Geiger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...
- Publication number 20230197566
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY
- Publication number 20230197615
- Publication date Jun 22, 2023
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS
- Publication number 20230197598
- Publication date Jun 22, 2023
- Intel Corporation
- Georgios Panagopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE TRANSMISSION LINES USING BURIED POWER RAIL TECHNOLOGY
- Publication number 20230187313
- Publication date Jun 15, 2023
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back Side Power Supply for Electronic Devices
- Publication number 20230094594
- Publication date Mar 30, 2023
- Intel Corporation
- Wolfgang MOLZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES AND DEVICES WITH COILS FOR INDUCTIVE COUPLING
- Publication number 20230101378
- Publication date Mar 30, 2023
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-N DIODES WITH N-DOPED WELLS AND CAPPING LAYERS
- Publication number 20230068318
- Publication date Mar 2, 2023
- Intel Corporation
- Richard Geiger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE CAPACITANCE DEVICE WITH MULTIPLE TWO-DIMENSIONAL ELECTRON...
- Publication number 20220320350
- Publication date Oct 6, 2022
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT FIN TRANSISTOR (RFT)
- Publication number 20210305245
- Publication date Sep 30, 2021
- Intel Corporation
- Richard HUDECZEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20210281286
- Publication date Sep 9, 2021
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE ANTENNA DIODE
- Publication number 20200411505
- Publication date Dec 31, 2020
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE SCHOTTKY DIODE
- Publication number 20200411699
- Publication date Dec 31, 2020
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE CAPACITANCE DEVICE WITH MULTIPLE TWO-DIMENSIONAL ELECTRON...
- Publication number 20200220030
- Publication date Jul 9, 2020
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE SILICON CONTROLLED RECTIFIER
- Publication number 20200203518
- Publication date Jun 25, 2020
- Santa Clara
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods for forming semiconductor devices
- Publication number 20200006483
- Publication date Jan 2, 2020
- Intel IP Corporation
- Vase JOVANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20190052301
- Publication date Feb 14, 2019
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS IN-CHIP AND CHIP TO CHIP COMMUNICATION
- Publication number 20170180014
- Publication date Jun 22, 2017
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
- Publication number 20160359520
- Publication date Dec 8, 2016
- Intel IP Corporation
- Edmund Goetz
- H01 - BASIC ELECTRIC ELEMENTS

Peter Baumgartner

Person

Patents Grantslast 30 patents

Variable capacitance device with multiple two-dimensional electron...

Group III-nitride Schottky diode

Group III-nitride silicon controlled rectifier

Variable capacitance device with multiple two-dimensional electron...

Group III-nitride antenna diode

Resonant fin transistor (RFT)

Semiconductor devices and methods for forming semiconductor devices

Radio frequency shielding within a semiconductor package

Radio frequency shielding within a semiconductor package

Wireless in-chip and chip to chip communication

Flow diversion devices

Detection of environmental conditions in a semiconductor chip

Flexibly-wrapped integrated circuit die

Radio frequency shielding within a semiconductor package

Semiconductor device having different fin widths

Asymmetric segmented channel transistors

Capacitor having a plurality of parallel conductive members

Capacitor structure

Asymmetric segmented channel transistors

Semiconductor device with reduced capacitance tolerance value

Asymmetric segmented channel transistors

Semiconductor devices and methods of manufacture thereof

Asymmetric segmented channel transistors

Semiconductor element and a method for producing the same

Semiconductor device with capacitor arrangement electrically couple...

Biasing a transistor out of a supply voltage range

Modulated-Vt transistor

Integrated capacitor structure

Integrated circuits with inductors in multiple conductive layers

Integrated capacitor structure

Patents Applicationslast 30 patents

STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS

INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL-TRANSPORT TRANSISTOR...

Routing and Passive Components in a Direct Bonding Layer

Integrated Waveguides for Semiconductor Technology

INTEGRATED CAPACITOR

VARIABLE GAIN AMPLIFIER WITH COMPLEMENTARILY SWITCHED NEUTRALIZED D...

INTEGRATED CAPACITOR

ON-CHIP PHASE NOISE MEASUREMENT SYSTEM FOR BUILD-IN SELF-TEST OF MU...

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

THREE-DIMENSIONAL POWER COMBINERS

PROVIDING FILL PATTERNS FOR INTEGRATED CIRCUIT DEVICES

ISOLATION OF SEMICONDUCTOR DEVICES BY BURIED SEPARATION RAILS

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...

TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY

INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS

TUNABLE TRANSMISSION LINES USING BURIED POWER RAIL TECHNOLOGY

Back Side Power Supply for Electronic Devices

SEMICONDUCTOR DIES AND DEVICES WITH COILS FOR INDUCTIVE COUPLING

III-N DIODES WITH N-DOPED WELLS AND CAPPING LAYERS

VARIABLE CAPACITANCE DEVICE WITH MULTIPLE TWO-DIMENSIONAL ELECTRON...

RESONANT FIN TRANSISTOR (RFT)

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

GROUP III-NITRIDE ANTENNA DIODE

GROUP III-NITRIDE SCHOTTKY DIODE

VARIABLE CAPACITANCE DEVICE WITH MULTIPLE TWO-DIMENSIONAL ELECTRON...

GROUP III-NITRIDE SILICON CONTROLLED RECTIFIER

Semiconductor devices and methods for forming semiconductor devices

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

WIRELESS IN-CHIP AND CHIP TO CHIP COMMUNICATION

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE