Peter Chew

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit system with contact distribution film
- Patent number 8,685,861
- Issue date Apr 1, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chih Ping Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetal dielectric layer for integrated circuits
- Patent number 6,528,886
- Issue date Mar 4, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetal dielectric layer for integrated circuits
- Patent number 6,451,687
- Issue date Sep 17, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal stability improvement of CoSi2 film by stuffing in titanium
- Patent number 6,383,922
- Issue date May 7, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Bei Chao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a shallow trench isolation using HDP silicon oxy...
- Patent number 6,258,676
- Issue date Jul 10, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Kong Hean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous deposit and etch method for forming a void-free and ga...
- Patent number 5,858,876
- Issue date Jan 12, 1999
- Chartered Semiconductor Manufacturing, Ltd.
- Peter Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective WSix deposition
- Patent number 5,618,756
- Issue date Apr 8, 1997
- Chartered Semiconductor Manufacturing Pte Ltd
- Peter Chew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CONTACT FILM
- Publication number 20080029853
- Publication date Feb 7, 2008
- Chartered Semiconductor Manufacturing LTD.
- Chih Ping Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermetal dielectric layer for integrated circuits
- Publication number 20020130418
- Publication date Sep 19, 2002
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit system with contact distribution film

Intermetal dielectric layer for integrated circuits

Intermetal dielectric layer for integrated circuits

Thermal stability improvement of CoSi2 film by stuffing in titanium

Method for forming a shallow trench isolation using HDP silicon oxy...

Simultaneous deposit and etch method for forming a void-free and ga...

Selective WSix deposition

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT SYSTEM WITH CONTACT FILM

Intermetal dielectric layer for integrated circuits