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6022457 | Huang et al. | Feb 2000 | A |
6025267 | Peg et al. | Feb 2000 | A |
6083817 | Nogami et al. | Jul 2000 | A |
6274470 | Ichimori et al. | Aug 2001 | B1 |
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Sohn et al, “High Thermal Stability and Low Junction Leakage Current of Ti Capped Co salicide and its Feasibility for High Thermal Budget CMOS devices”, Electron Device Meeting, 1998, IEDM's 98 Technical Digest, Internation, Dec. 6, 1998, pp. 1005-1008. |