Peter D. Albrecht

Person

O'Fallon, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,764,071
- Issue date Sep 19, 2023
- GlobalWafers Co., Ltd.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,282,715
- Issue date Mar 22, 2022
- GlobalWafers Co., Ltd.
- Robert J. Falster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,276,583
- Issue date Mar 15, 2022
- GlobalWafers Co., Ltd.
- Robert J. Falster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 11,276,582
- Issue date Mar 15, 2022
- GlobalWafers Co., Ltd.
- Robert J. Falster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,654,193
- Issue date May 19, 2020
- GlobalWafers Co., Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for stressing semiconductor substrates
- Patent number 10,361,097
- Issue date Jul 23, 2019
- GlobalWafers Co., Ltd.
- Robert J. Falster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,315,337
- Issue date Jun 11, 2019
- GlobalWafers Co. Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes and apparatus for preparing heterostructures with reduced...
- Patent number 9,583,363
- Issue date Feb 28, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Grant
Processes and apparatus for preparing heterostructures with reduced...
- Patent number 9,583,364
- Issue date Feb 28, 2017
- SunEdison Semiconductor Limited (UEN201334164H)
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Grant
Center flex single side polishing head having recess and cap
- Patent number 9,566,687
- Issue date Feb 14, 2017
- Sunedison Semiconductor Limited (UEN201334164H)
- Peter Albrecht
- B24 - GRINDING POLISHING
Information Patent Grant
Double side polisher with platen parallelism control
- Patent number 9,180,569
- Issue date Nov 10, 2015
- Sunedison Semiconductor Limited (UEN201334164H)
- Peter D. Albrecht
- B24 - GRINDING POLISHING
Information Patent Grant
Systems and methods for connecting an ingot to a wire saw
- Patent number 8,960,657
- Issue date Feb 24, 2015
- SunEdison, Inc.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for etching the edge of a silicon wafer
- Patent number 8,309,464
- Issue date Nov 13, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Edge etched silicon wafers
- Patent number 8,192,822
- Issue date Jun 5, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer polishing apparatus and method of polishing
- Patent number 8,192,248
- Issue date Jun 5, 2012
- MEMC Electronic Materials, Inc.
- Peter D. Albrecht
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer, polishing apparatus and method
- Patent number 7,137,874
- Issue date Nov 21, 2006
- MEMC Electronic Materials, SpA
- Ezio Bovio
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus, polishing head and method
- Patent number 6,712,673
- Issue date Mar 30, 2004
- MEMC Electronic Materials, Inc.
- Peter Albrecht
- B24 - GRINDING POLISHING
Information Patent Grant
Automated wafer lapping system
- Patent number 5,679,055
- Issue date Oct 21, 1997
- MEMC Electronic Materials, Inc.
- George W. Greene
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PRODUCING OFF-ORIENTATION SINGLE CRYSTAL SILICON WAFERS
- Publication number 20240218557
- Publication date Jul 4, 2024
- GLOBALWAFERS CO., LTD.
- Carlo Zavattari
- C30 - CRYSTAL GROWTH
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...
- Publication number 20230390962
- Publication date Dec 7, 2023
- GLOBALWAFERS CO., LTD.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP
- Publication number 20220410340
- Publication date Dec 29, 2022
- GLOBALWAFERS CO., LTD.
- Peter Daniel Albrecht
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR IMPLANTING SEMICONDUCTOR SUBSTRATES
- Publication number 20220208619
- Publication date Jun 30, 2022
- GLOBALWAFERS CO., LTD.
- Peter Daniel Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20190333778
- Publication date Oct 31, 2019
- GLOBALWAFERS CO., LTD.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20190311913
- Publication date Oct 10, 2019
- GLOBALWAFERS CO., LTD.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20190311912
- Publication date Oct 10, 2019
- GLOBALWAFERS CO., LTD.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20190295853
- Publication date Sep 26, 2019
- GLOBALWAFERS CO., LTD.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER
- Publication number 20190270222
- Publication date Sep 5, 2019
- GLOBALWAFERS CO., LTD.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER
- Publication number 20180056545
- Publication date Mar 1, 2018
- SunEdison Semiconductor Limited (UEN201334164H)
- Peter D. Albrecht
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP
- Publication number 20160101502
- Publication date Apr 14, 2016
- SunEdison Semiconductor Limited (UEN201334164H)
- Peter Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CENTER FLEX SINGLE SIDE POLISHING HEAD
- Publication number 20140357161
- Publication date Dec 4, 2014
- Sumeet Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Processes and Apparatus for Preparing Heterostructures with Reduced...
- Publication number 20140187022
- Publication date Jul 3, 2014
- SUNEDISON, INC.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
Processes and Apparatus for Preparing Heterostructures with Reduced...
- Publication number 20140187023
- Publication date Jul 3, 2014
- SUNEDISON, INC.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
Apparatus for Stressing Semiconductor Substrates
- Publication number 20140182788
- Publication date Jul 3, 2014
- SUNEDISON, INC.
- Robert J. Falster
- C30 - CRYSTAL GROWTH
Information Patent Application
DOUBLE SIDE POLISHER WITH PLATEN PARALLELISM CONTROL
- Publication number 20140170781
- Publication date Jun 19, 2014
- Peter D. Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND METHODS
- Publication number 20140150826
- Publication date Jun 5, 2014
- Peter D. Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Transport Cart
- Publication number 20130121802
- Publication date May 16, 2013
- MEMC Electronic Materials, Inc.
- Peter D. Albrecht
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
Systems and Methods For Connecting An Ingot To A Wire Saw
- Publication number 20130087132
- Publication date Apr 11, 2013
- MEMC Electronic Materials, Inc.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Grinding Tool For Trapezoid Grinding Of A Wafer
- Publication number 20120028555
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Guoqiang David Zhang
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD OF POLISHING
- Publication number 20090298399
- Publication date Dec 3, 2009
- MEMC Electronic Materials, Inc.
- Peter D. Albrecht
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090247055
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHED SILICON WAFERS
- Publication number 20090246444
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090242126
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing apparatus, polishing head and method
- Publication number 20030068958
- Publication date Apr 10, 2003
- Peter Albrecht
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and process for producing polished semiconductor wafers
- Publication number 20030064902
- Publication date Apr 3, 2003
- MEMC Electronic Materials Inc.
- Kan-Yin Ng
- B24 - GRINDING POLISHING

Peter D. Albrecht

Person

Patents Grantslast 30 patents

Apparatus for stressing semiconductor substrates

Apparatus for stressing semiconductor substrates

Apparatus for stressing semiconductor substrates

Apparatus for stressing semiconductor substrates

Methods and system for controlling a surface profile of a wafer

Apparatus for stressing semiconductor substrates

Methods and system for controlling a surface profile of a wafer

Processes and apparatus for preparing heterostructures with reduced...

Processes and apparatus for preparing heterostructures with reduced...

Center flex single side polishing head having recess and cap

Double side polisher with platen parallelism control

Systems and methods for connecting an ingot to a wire saw

Methods for etching the edge of a silicon wafer

Edge etched silicon wafers

Semiconductor wafer polishing apparatus and method of polishing

Semiconductor wafer, polishing apparatus and method

Polishing apparatus, polishing head and method

Automated wafer lapping system

Patents Applicationslast 30 patents

METHODS FOR PRODUCING OFF-ORIENTATION SINGLE CRYSTAL SILICON WAFERS

SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...

POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP

METHODS FOR IMPLANTING SEMICONDUCTOR SUBSTRATES

APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES

APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES

APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES

APPARATUS FOR STRESSING SEMICONDUCTOR SUBSTRATES

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

METHODS AND SYSTEM FOR CONTROLLING A SURFACE PROFILE OF A WAFER

CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP

CENTER FLEX SINGLE SIDE POLISHING HEAD

Processes and Apparatus for Preparing Heterostructures with Reduced...

Processes and Apparatus for Preparing Heterostructures with Reduced...

Apparatus for Stressing Semiconductor Substrates

DOUBLE SIDE POLISHER WITH PLATEN PARALLELISM CONTROL

WAFER CLEANING APPARATUS AND METHODS

Wafer Transport Cart

Systems and Methods For Connecting An Ingot To A Wire Saw

Grinding Tool For Trapezoid Grinding Of A Wafer

SEMICONDUCTOR WAFER POLISHING APPARATUS AND METHOD OF POLISHING

METHODS FOR ETCHING THE EDGE OF A SILICON WAFER

EDGE ETCHED SILICON WAFERS

EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER

Polishing apparatus, polishing head and method

Apparatus and process for producing polished semiconductor wafers