Peter J. Brofman

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly apparatus employing a warpage-suppressor assembly
- Patent number 8,978,960
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip assembly apparatus employing a warpage-suppressor assembly
- Patent number 8,870,051
- Issue date Oct 28, 2014
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chips with crack stop regions for reducing crack prop...
- Patent number 7,875,502
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid edge capping load
- Patent number 7,733,655
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips with crack stop regions for reducing crack prop...
- Patent number 7,732,932
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pillow
- Patent number 7,709,951
- Issue date May 4, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,984,792
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture of silicon based package
- Patent number 6,878,608
- Issue date Apr 12, 2005
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,657,313
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a carrier and a semiconductor device
- Patent number 6,584,684
- Issue date Jul 1, 2003
- International Business Machines
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,559,527
- Issue date May 6, 2003
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,548,909
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-axis compressible polymer with fine metal matrix suspension
- Patent number 6,270,363
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting electronic components using a plurality o...
- Patent number 6,258,625
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a chip carrier to a semiconductor device
- Patent number 6,220,499
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with metal-ion matrix induced dendrites for interconnection
- Patent number 6,218,629
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,184,062
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 6,070,782
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive low melt test for off-composition solder
- Patent number 6,016,947
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Timothy W. Donahue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20160049345
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20150255312
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY APPARATUS EMPLOYING A WARPAGE-SUPPRESSOR ASSEMBLY
- Publication number 20140124566
- Publication date May 8, 2014
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP ASSEMBLY APPARATUS EMPLOYING A WARPAGE-SUPPRESSOR ASSEMBLY
- Publication number 20130292455
- Publication date Nov 7, 2013
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...
- Publication number 20100233872
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID EDGE CAPPING LOAD
- Publication number 20100020503
- Publication date Jan 28, 2010
- International Business Machines Corporation
- MARTIN BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...
- Publication number 20090032909
- Publication date Feb 5, 2009
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PILLOW
- Publication number 20080225484
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric interposer for chip to substrate soldering
- Publication number 20030193093
- Publication date Oct 16, 2003
- International Business Machines Corporation
- Peter J. Brofman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacture of silicon based package and device manufactu...
- Publication number 20020180013
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of interconnecting electronic components using a plurality o...
- Publication number 20010019178
- Publication date Sep 6, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming cone shaped solder for chip interconnection
- Publication number 20010015495
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling a carrier and a semiconductor device
- Publication number 20010007288
- Publication date Jul 12, 2001
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Peter J. Brofman

Person

Patents Grantslast 30 patents

Low-stress dual underfill packaging

Low-stress dual underfill packaging

Flip chip assembly apparatus employing a warpage-suppressor assembly

Additives for grain fragmentation in Pb-free Sn-based solder

Flip chip assembly apparatus employing a warpage-suppressor assembly

Additives for grain fragmentation in Pb-free Sn-based solder

Semiconductor chips with crack stop regions for reducing crack prop...

Lid edge capping load

Semiconductor chips with crack stop regions for reducing crack prop...

Thermal pillow

Dielectric interposer for chip to substrate soldering

Method of manufacture of silicon based package

Dielectric interposer for chip to substrate soldering

Method for assembling a carrier and a semiconductor device

Process for forming cone shaped solder for chip interconnection

Method of interconnecting electronic components using a plurality o...

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Z-axis compressible polymer with fine metal matrix suspension

Method of interconnecting electronic components using a plurality o...

Solder disc connection

Method for assembling a chip carrier to a semiconductor device

Module with metal-ion matrix induced dendrites for interconnection

Process for forming cone shaped solder for chip interconnection

Method for enhancing fatigue life of ball grid arrays

Socketable bump grid array shaped-solder on copper spheres

Solder disc connection

Non-destructive low melt test for off-composition solder

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Patents Applicationslast 30 patents

LOW-STRESS DUAL UNDERFILL PACKAGING

LOW-STRESS DUAL UNDERFILL PACKAGING

FLIP CHIP ASSEMBLY APPARATUS EMPLOYING A WARPAGE-SUPPRESSOR ASSEMBLY

FLIP CHIP ASSEMBLY APPARATUS EMPLOYING A WARPAGE-SUPPRESSOR ASSEMBLY

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

LID EDGE CAPPING LOAD

SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...

THERMAL PILLOW

Dielectric interposer for chip to substrate soldering

Method of manufacture of silicon based package and device manufactu...

Method of interconnecting electronic components using a plurality o...

Process for forming cone shaped solder for chip interconnection

Method for assembling a carrier and a semiconductor device