Phil Geng

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cold plate architecture for liquid cooling of devices
- Patent number 12,133,357
- Issue date Oct 29, 2024
- Intel Corporation
- Jin Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Retention latch with spring mechanism
- Patent number 11,984,685
- Issue date May 14, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Connector retention mechanism for improved structural reliability
- Patent number 11,587,597
- Issue date Feb 21, 2023
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module connector, memory module, and pivotable latch
- Patent number 10,950,958
- Issue date Mar 16, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention of dual in-line memory modules
- Patent number 10,888,010
- Issue date Jan 5, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector with relaxation mechanism for latch
- Patent number 10,790,603
- Issue date Sep 29, 2020
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a via-in-pad with off-center geometry
- Patent number 7,208,348
- Issue date Apr 24, 2007
- Intel Corporation
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via-in-pad with off-center geometry
- Patent number 6,833,615
- Issue date Dec 21, 2004
- Intel Corporation
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Design and assembly methodology for reducing bridging in bonding el...
- Patent number 6,622,905
- Issue date Sep 23, 2003
- Intel Corporation
- Daniel E. Shier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS
- Publication number 20240355702
- Publication date Oct 24, 2024
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...
- Publication number 20240240688
- Publication date Jul 18, 2024
- Phil Geng
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
DUAL IN-LINE MEMORY MODULE RETAINER
- Publication number 20240242740
- Publication date Jul 18, 2024
- Intel Corporation
- Phil GENG
- G11 - INFORMATION STORAGE
Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS
- Publication number 20240113479
- Publication date Apr 4, 2024
- Intel Corporation
- Kai Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...
- Publication number 20230307379
- Publication date Sep 28, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL IN-LINE MEMORY MODULE COVER
- Publication number 20230273654
- Publication date Aug 31, 2023
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM
- Publication number 20230092972
- Publication date Mar 23, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230038805
- Publication date Feb 9, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...
- Publication number 20230031457
- Publication date Feb 2, 2023
- Intel Corporation
- Phil Geng
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...
- Publication number 20230022058
- Publication date Jan 26, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK
- Publication number 20230014898
- Publication date Jan 19, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER
- Publication number 20220210950
- Publication date Jun 30, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY
- Publication number 20220208645
- Publication date Jun 30, 2022
- Intel Corporation
- Olaotan ELENITOBA-JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...
- Publication number 20220174843
- Publication date Jun 2, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE
- Publication number 20220117080
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE
- Publication number 20220117079
- Publication date Apr 14, 2022
- Intel Corporation
- Phil GENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMM RETENTION ASSEMBLY FOR COMPRESSION MOUNT TECHNOLOGY AND LAND G...
- Publication number 20210408724
- Publication date Dec 30, 2021
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR...
- Publication number 20210410317
- Publication date Dec 30, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE CHAMBER WITH STIFFENING STRUCTURE FOR THERMAL...
- Publication number 20210410329
- Publication date Dec 30, 2021
- Intel Corporation
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY
- Publication number 20210378099
- Publication date Dec 2, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAF SPRING FOR IMPROVED MEMORY MODULE THAT CONSERVES MOTHERBOARD W...
- Publication number 20210328370
- Publication date Oct 21, 2021
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
- Publication number 20210193558
- Publication date Jun 24, 2021
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Publication number 20210105911
- Publication date Apr 8, 2021
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20210043537
- Publication date Feb 11, 2021
- Intel Corporation
- Barrett M. FANEUF
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Cold plate architecture for liquid cooling of devices

Electronic systems with inverted circuit board with heat sink to ch...

Retention latch with spring mechanism

Electronic systems with inverted circuit board with heat sink to ch...

Connector retention mechanism for improved structural reliability

Multi-surface heat sink suitable for multi-chip packages

Memory module connector, memory module, and pivotable latch

Retention of dual in-line memory modules

Connector with relaxation mechanism for latch

Methods of fabricating a via-in-pad with off-center geometry

Via-in-pad with off-center geometry

Design and assembly methodology for reducing bridging in bonding el...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYS...

DUAL IN-LINE MEMORY MODULE RETAINER

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE

SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...

DUAL IN-LINE MEMORY MODULE COVER

DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...

BACK PLATES TO SUPPORT INTEGRATED CIRCUIT PACKAGES IN SOCKETS ON PR...

METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK

MULTILAYER BACK PLATE WITH MOLDED CERAMIC LAYER

SEMICONDUCTOR CHIP PACKAGE THERMO-MECHANICAL COOLING ASSEMBLY

COOLING ASSEMBLY WITH STRAP ELEMENT TO DIMINISH LATERAL MOVEMENT OF...

BALL GRID ARRAY CHIP (BGA) PACKAGE COOLING ASSEMBLY WITH BOLSTER PLATE

COOLING ASSEMBLY WITH DAMPENED OSCILLATION RESPONSE

DIMM RETENTION ASSEMBLY FOR COMPRESSION MOUNT TECHNOLOGY AND LAND G...

PATTERNED BOLSTER PLATE AND COMPOSITE BACK PLATE FOR SEMICONDUCTOR...

THERMALLY CONDUCTIVE CHAMBER WITH STIFFENING STRUCTURE FOR THERMAL...

MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY

LEAF SPRING FOR IMPROVED MEMORY MODULE THAT CONSERVES MOTHERBOARD W...

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...