Philip C. Smith

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Ellicott City, MD, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a micro-electrical-mechanical system with t...
- Patent number 7,989,249
- Issue date Aug 2, 2011
- Northrop Grumman Systems Corporation
- Nathan Bluzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer scale package and method of assembly
- Patent number 6,939,784
- Issue date Sep 6, 2005
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer scale package and method of assembly
- Patent number 6,812,558
- Issue date Nov 2, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive type microelectromechanical RF switch
- Patent number 6,777,765
- Issue date Aug 17, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state RF switch with high cutoff frequency
- Patent number 6,486,511
- Issue date Nov 26, 2002
- Northrop Grumman Corporation
- Harvey C. Nathanson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing a Micro-Electrical-Mechanical System with T...
- Publication number 20100197063
- Publication date Aug 5, 2010
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Nathan BLUZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Radiation hardened multi-bit sonos non-volatile memory
- Publication number 20090059675
- Publication date Mar 5, 2009
- Joseph T. Smith
- G11 - INFORMATION STORAGE
Information Patent Application
TUNGSTEN INTERCONNECT SUPER STRUCTURE FOR SEMICONDUCTOR POWER DEVICES
- Publication number 20080128913
- Publication date Jun 5, 2008
- NORTHROP GRUMMAN SYSTEMS CORPORATION
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE PACKAGE AND METHOD OF ASSEMBLY
- Publication number 20040188821
- Publication date Sep 30, 2004
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer scale package and method of assembly
- Publication number 20040191957
- Publication date Sep 30, 2004
- Northrop Grumman Corporation
- Li-Shu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE TYPE MICROELECTROMECHANICAL RF SWITCH
- Publication number 20040119126
- Publication date Jun 24, 2004
- Li-Shu Chen
- H01 - BASIC ELECTRIC ELEMENTS