Praburam Gopalraja

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additive patterning of semiconductor film stacks
- Patent number 11,798,606
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- John O. Dukovic
- G11 - INFORMATION STORAGE
Information Patent Grant
Bottom-up approach to high aspect ratio hole formation in 3D memory...
- Patent number 11,315,943
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Praburam Gopalraja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned high aspect ratio structures and methods of making
- Patent number 11,177,164
- Issue date Nov 16, 2021
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive patterning of semiconductor film stacks
- Patent number 11,049,537
- Issue date Jun 29, 2021
- Applied Materials, Inc.
- John O. Dukovic
- G11 - INFORMATION STORAGE
Information Patent Grant
Chamber with individually controllable plasma generation regions fo...
- Patent number 10,957,518
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming self-aligned vias and air gaps
- Patent number 10,840,186
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single oxide metal deposition chamber
- Patent number 10,597,785
- Issue date Mar 24, 2020
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering showerhead
- Patent number 10,577,689
- Issue date Mar 3, 2020
- Applied Materials, Inc.
- Anantha K. Subramani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming self-aligned vias and air gaps
- Patent number 10,403,542
- Issue date Sep 3, 2019
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned multiple spacer patterning schemes for advanced nanome...
- Patent number 9,978,596
- Issue date May 22, 2018
- Applied Materials, Inc.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned multiple spacer patterning schemes for advanced nanome...
- Patent number 9,548,201
- Issue date Jan 17, 2017
- Applied Materials, Inc.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-ionized and capacitively-coupled plasma for sputtering and res...
- Patent number 9,062,372
- Issue date Jun 23, 2015
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electromagnet array in a sputter reactor
- Patent number 8,871,064
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering chamber having auxiliary backside magnet to improve etch...
- Patent number 8,557,094
- Issue date Oct 15, 2013
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Coils for generating a plasma and for sputtering
- Patent number 8,398,832
- Issue date Mar 19, 2013
- Applied Materials Inc.
- Jaim Nulman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective ruthenium deposition on copper materials
- Patent number 7,737,028
- Issue date Jun 15, 2010
- Applied Materials, Inc.
- Rongjun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Remote plasma pre-clean with low hydrogen pressure
- Patent number 7,704,887
- Issue date Apr 27, 2010
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step process for forming a metal barrier in a sputter reactor
- Patent number 7,686,926
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidized barrier layer
- Patent number 7,659,204
- Issue date Feb 9, 2010
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming barrier layers in high aspect rat...
- Patent number 7,547,644
- Issue date Jun 16, 2009
- Applied Materials, Inc.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and capacitively-coupled plasma for sputtering and res...
- Patent number 7,504,006
- Issue date Mar 17, 2009
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputtering using an unbalanced magnetron
- Patent number 7,335,282
- Issue date Feb 26, 2008
- Jianming Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process kit for improved power coupling through a workpiece in a se...
- Patent number 7,163,607
- Issue date Jan 16, 2007
- Applied Materials, Inc.
- Bradley O. Stimson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step magnetron sputtering process
- Patent number 6,991,709
- Issue date Jan 31, 2006
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming barrier layers in high aspect rat...
- Patent number 6,974,771
- Issue date Dec 13, 2005
- Applied Materials, Inc.
- Fusen Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ADDITIVE PATTERNING OF SEMICONDUCTOR FILM STACKS
- Publication number 20210305501
- Publication date Sep 30, 2021
- Applied Materials, Inc.
- John O. DUKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-Up Approach To High Aspect Ratio Hole Formation In 3D Memory...
- Publication number 20210050365
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Praburam Gopalraja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE PATTERNING OF SEMICONDUCTOR FILM STACKS
- Publication number 20210035619
- Publication date Feb 4, 2021
- Applied Materials, Inc.
- John O. DUKOVIC
- G11 - INFORMATION STORAGE
Information Patent Application
CHAMBER WITH INDIVIDUALLY CONTROLLABLE PLASMA GENERATION REGIONS FO...
- Publication number 20200312630
- Publication date Oct 1, 2020
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned High Aspect Ratio Structures And Methods Of Making
- Publication number 20200194304
- Publication date Jun 18, 2020
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Self-Aligned Vias And Air Gaps
- Publication number 20190348368
- Publication date Nov 14, 2019
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Self-Aligned Vias And Air Gaps
- Publication number 20180358260
- Publication date Dec 13, 2018
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING SHOWERHEAD
- Publication number 20180087155
- Publication date Mar 29, 2018
- Applied Materials, Inc.
- Anantha K. SUBRAMANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE OXIDE METAL DEPOSITION CHAMBER
- Publication number 20180073150
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Anantha K. SUBRAMANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA REACTOR FOR PROCESSING A WORKPIECE WITH AN ARRAY OF PLASMA P...
- Publication number 20170092470
- Publication date Mar 30, 2017
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED MULTIPLE SPACER PATTERNING SCHEMES FOR ADVANCED NANOME...
- Publication number 20170092494
- Publication date Mar 30, 2017
- Applied Materials, Inc.
- Ying ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED MULTIPLE SPACER PATTERNING SCHEMES FOR ADVANCED NANOME...
- Publication number 20150371852
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Ying ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STABILIZING AN INTERFACE POST ETCH TO MINIMIZE QUEUE TIM...
- Publication number 20150079799
- Publication date Mar 19, 2015
- Applied Materials, Inc.
- Srinivas D. NEMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COILS FOR GENERATING A PLASMA AND FOR SPUTTERING
- Publication number 20130168232
- Publication date Jul 4, 2013
- Jaim NULMAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electromagnet array in a sputter reactor
- Publication number 20100155223
- Publication date Jun 24, 2010
- Applied Materials, Inc.
- Tza-Jing GUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PVD CU SEED OVERHANG RE-SPUTTERING WITH ENHANCED CU IONIZATION
- Publication number 20100096253
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- Yong Cao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS
- Publication number 20090087982
- Publication date Apr 2, 2009
- APPLIED MATERIALS, INC.
- RONGJUN WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxidized Barrier Layer
- Publication number 20080237029
- Publication date Oct 2, 2008
- Applied Materials, Inc.
- Xianmin TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESPUTTERED COPPER SEED LAYER
- Publication number 20080190760
- Publication date Aug 14, 2008
- Applied Materials, Inc.
- XIANMIN TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND CAPACITIVELY-COUPLED PLASMA FOR SPUTTERING AND RES...
- Publication number 20080142359
- Publication date Jun 19, 2008
- Applied Materials, Inc.
- Praburam GOPALRAJA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch...
- Publication number 20080083610
- Publication date Apr 10, 2008
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch and sidewall selectivity in plasma sputtering
- Publication number 20070209925
- Publication date Sep 13, 2007
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Remote plasma pre-clean with low hydrogen pressure
- Publication number 20070117397
- Publication date May 24, 2007
- Applied Materials, Inc.
- Xinyu Fu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Controlled multi-step magnetron sputtering process
- Publication number 20070095654
- Publication date May 3, 2007
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Praburam Gopalraja

Person

Patents Grantslast 30 patents

Additive patterning of semiconductor film stacks

Bottom-up approach to high aspect ratio hole formation in 3D memory...

Self-aligned high aspect ratio structures and methods of making

Additive patterning of semiconductor film stacks

Chamber with individually controllable plasma generation regions fo...

Methods of forming self-aligned vias and air gaps

Single oxide metal deposition chamber

Sputtering showerhead

Methods of forming self-aligned vias and air gaps

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-aligned multiple spacer patterning schemes for advanced nanome...

Self-aligned multiple spacer patterning schemes for advanced nanome...

Self-ionized and capacitively-coupled plasma for sputtering and res...

Electromagnet array in a sputter reactor

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Sputtering chamber having auxiliary backside magnet to improve etch...

Coils for generating a plasma and for sputtering

Selective ruthenium deposition on copper materials

Remote plasma pre-clean with low hydrogen pressure

Metal / metal nitride barrier layer for semiconductor device applic...

Multi-step process for forming a metal barrier in a sputter reactor

Oxidized barrier layer

Methods and apparatus for forming barrier layers in high aspect rat...

Self-ionized and capacitively-coupled plasma for sputtering and res...

Sputtering using an unbalanced magnetron

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Process kit for improved power coupling through a workpiece in a se...

Multi-step magnetron sputtering process

Methods and apparatus for forming barrier layers in high aspect rat...

Patents Applicationslast 30 patents

ADDITIVE PATTERNING OF SEMICONDUCTOR FILM STACKS

Bottom-Up Approach To High Aspect Ratio Hole Formation In 3D Memory...

ADDITIVE PATTERNING OF SEMICONDUCTOR FILM STACKS

CHAMBER WITH INDIVIDUALLY CONTROLLABLE PLASMA GENERATION REGIONS FO...

Self-Aligned High Aspect Ratio Structures And Methods Of Making

Methods Of Forming Self-Aligned Vias And Air Gaps

Methods Of Forming Self-Aligned Vias And Air Gaps

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SPUTTERING SHOWERHEAD

SINGLE OXIDE METAL DEPOSITION CHAMBER

PLASMA REACTOR FOR PROCESSING A WORKPIECE WITH AN ARRAY OF PLASMA P...

SELF-ALIGNED MULTIPLE SPACER PATTERNING SCHEMES FOR ADVANCED NANOME...

SELF-ALIGNED MULTIPLE SPACER PATTERNING SCHEMES FOR ADVANCED NANOME...

METHOD FOR STABILIZING AN INTERFACE POST ETCH TO MINIMIZE QUEUE TIM...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

COILS FOR GENERATING A PLASMA AND FOR SPUTTERING

Electromagnet array in a sputter reactor

PVD CU SEED OVERHANG RE-SPUTTERING WITH ENHANCED CU IONIZATION

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS

Method of depositing a diffusion barrier layer which provides an im...

Oxidized Barrier Layer

RESPUTTERED COPPER SEED LAYER

SELF-IONIZED AND CAPACITIVELY-COUPLED PLASMA FOR SPUTTERING AND RES...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Sputtering Chamber Having Auxiliary Backside Magnet to Improve Etch...

Metal / metal nitride barrier layer for semiconductor device applic...

Etch and sidewall selectivity in plasma sputtering

Remote plasma pre-clean with low hydrogen pressure

Controlled multi-step magnetron sputtering process