Pramod Malatkar

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with bumpless die-package interface for...
- Patent number 11,201,128
- Issue date Dec 14, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes lamination layer
- Patent number 10,985,080
- Issue date Apr 20, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with patterned protective material
- Patent number 10,957,656
- Issue date Mar 23, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane test for mechanical testing of stretchable electronics
- Patent number 10,634,594
- Issue date Apr 28, 2020
- Intel Corporation
- Ravindranth V. Mahajan
- G01 - MEASURING TESTING
Information Patent Grant
Systems, methods, and apparatuses for implementing a thermal soluti...
- Patent number 10,607,909
- Issue date Mar 31, 2020
- Intel Corporation
- Purushotham Kaushik Muthur Srinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, methods, and apparatuses for implementing an organic stiff...
- Patent number 10,475,750
- Issue date Nov 12, 2019
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constrained cure component attach process for improved IC package w...
- Patent number 10,290,569
- Issue date May 14, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling an electronic component using a probe having a...
- Patent number 10,278,318
- Issue date Apr 30, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming trenches in packages structures and structures f...
- Patent number 10,231,338
- Issue date Mar 12, 2019
- Intel Corporation
- Naga Sivakumar Yagnamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-rectangular electronic device components
- Patent number 10,090,259
- Issue date Oct 2, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic particle embedded flex or printed flex for magnetic tray o...
- Patent number 10,070,520
- Issue date Sep 4, 2018
- Intel Corporation
- Yoshihiro Tomita
- A43 - FOOTWEAR
Information Patent Grant
Bumpless build-up layer package with pre-stacked microelectronic de...
- Patent number 9,831,213
- Issue date Nov 28, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package design with an interposer
- Patent number 9,818,719
- Issue date Nov 14, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal expansion compensators for controlling microelectronic pack...
- Patent number 9,793,225
- Issue date Oct 17, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum lamination of depth-sensing camera module PCB to stiffener u...
- Patent number 9,661,745
- Issue date May 23, 2017
- Intel Corporation
- Kyle Yazzie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bumpless build-up layer package warpage reduction
- Patent number 9,627,227
- Issue date Apr 18, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermal expansion compensators for controlling microelectronic pack...
- Patent number 9,414,484
- Issue date Aug 9, 2016
- Intel Corporation
- Pramod Malatkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumpless build-up layer package with pre-stacked microelectronic de...
- Patent number 9,362,253
- Issue date Jun 7, 2016
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with bumpless die-package interface for...
- Patent number 9,224,674
- Issue date Dec 29, 2015
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and stacked microelectronic assembly and co...
- Patent number 9,159,649
- Issue date Oct 13, 2015
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package warpage reduction
- Patent number 8,848,380
- Issue date Sep 30, 2014
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package with pre-stacked microelectronic de...
- Patent number 8,754,516
- Issue date Jun 17, 2014
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming fully embedded bumpless build-up layer packages...
- Patent number 8,580,616
- Issue date Nov 12, 2013
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming fully embedded bumpless build-up layer packages...
- Patent number 8,304,913
- Issue date Nov 6, 2012
- Intel Corporation
- Ravi K Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retractable ledge socket
- Patent number 7,179,093
- Issue date Feb 20, 2007
- Intel Corporation
- Nicholas L. Holmberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...
- Publication number 20230420400
- Publication date Dec 28, 2023
- Intel Corporation
- Pramod MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...
- Publication number 20220068861
- Publication date Mar 3, 2022
- Intel Corporation
- Pramod MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME
- Publication number 20210242105
- Publication date Aug 5, 2021
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
- Publication number 20200357752
- Publication date Nov 12, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
- Publication number 20200066655
- Publication date Feb 27, 2020
- Intel Corporation
- Feras EID
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
- Publication number 20190304931
- Publication date Oct 3, 2019
- Intel Corporation
- Pramod Malatkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
- Publication number 20190103345
- Publication date Apr 4, 2019
- Intel Corporation
- Kyle YAZZIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...
- Publication number 20190051615
- Publication date Feb 14, 2019
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...
- Publication number 20190043772
- Publication date Feb 7, 2019
- Intel Corporation
- Purushotham Kaushik MUTHUR SRINATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED PACKAGE ASSEMBLY PROCESSING
- Publication number 20190043776
- Publication date Feb 7, 2019
- Intel Corporation
- Pramod MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20190043747
- Publication date Feb 7, 2019
- Intel Corporation
- Pramod MALATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...
- Publication number 20180376591
- Publication date Dec 27, 2018
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
- Publication number 20180350709
- Publication date Dec 6, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PICK AND PLACE PROBE
- Publication number 20180322993
- Publication date Nov 8, 2018
- Intel Corporation
- Kyle YAZZIE
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...
- Publication number 20180089984
- Publication date Mar 29, 2018
- Intel Corporation
- Vijay Krishnan Subramanian
- G01 - MEASURING TESTING
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...
- Publication number 20180047702
- Publication date Feb 15, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...
- Publication number 20170287873
- Publication date Oct 5, 2017
- Santosh Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVABLE IC PACKAGE STIFFENER
- Publication number 20170287799
- Publication date Oct 5, 2017
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...
- Publication number 20170268972
- Publication date Sep 21, 2017
- Intel Corporation
- Vijay Krishnan SUBRAMANIAN
- G01 - MEASURING TESTING
Information Patent Application
Inflatable Bladder Based Mechanical Testing for Stretchable Electro...
- Publication number 20170269017
- Publication date Sep 21, 2017
- Intel Corporation
- Steven A. KLEIN
- G01 - MEASURING TESTING
Information Patent Application
Membrane test for Mechanical Testing of Stretchable Electronics
- Publication number 20170268971
- Publication date Sep 21, 2017
- Intel Corporation
- Ravindranth V. MAHAJAN
- G01 - MEASURING TESTING
Information Patent Application
Magnetic particle embedded flex or printed flex for magnetic tray o...
- Publication number 20170188455
- Publication date Jun 29, 2017
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
Non-Rectangular Electronic Device Components
- Publication number 20170186705
- Publication date Jun 29, 2017
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...
- Publication number 20170176516
- Publication date Jun 22, 2017
- Intel Corporation
- Mohit Mamodia
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...
- Publication number 20170181339
- Publication date Jun 22, 2017
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE
- Publication number 20170166407
- Publication date Jun 15, 2017
- Intel Corporation
- Kumar Abhishek Singh
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES F...
- Publication number 20160381800
- Publication date Dec 29, 2016
- Intel Corporation
- Naga Sivakumar Yagnamurthy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACK...
- Publication number 20160322311
- Publication date Nov 3, 2016
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS

Pramod Malatkar

Person

Patents Grantslast 30 patents

Printed heat spreader structures and methods of providing same

Varied ball ball-grid-array (BGA) packages

Die back side structures for warpage control

Packaged semiconductor die with bumpless die-package interface for...

Electronic package that includes lamination layer

Integrated circuit packages with patterned protective material

Membrane test for mechanical testing of stretchable electronics

Systems, methods, and apparatuses for implementing a thermal soluti...

Thermal head with a thermal barrier for integrated circuit die proc...

Systems, methods, and apparatuses for implementing an organic stiff...

Constrained cure component attach process for improved IC package w...

Method of assembling an electronic component using a probe having a...

Methods of forming trenches in packages structures and structures f...

Non-rectangular electronic device components

Magnetic particle embedded flex or printed flex for magnetic tray o...

Bumpless build-up layer package with pre-stacked microelectronic de...

Bumpless build-up layer package design with an interposer

Thermal expansion compensators for controlling microelectronic pack...

Vacuum lamination of depth-sensing camera module PCB to stiffener u...

Bumpless build-up layer package warpage reduction

Reduced expansion thermal compression bonding process bond head

Thermal expansion compensators for controlling microelectronic pack...

Bumpless build-up layer package with pre-stacked microelectronic de...

Packaged semiconductor die with bumpless die-package interface for...

Microelectronic package and stacked microelectronic assembly and co...

Bumpless build-up layer package warpage reduction

Bumpless build-up layer package with pre-stacked microelectronic de...

Methods of forming fully embedded bumpless build-up layer packages...

Methods of forming fully embedded bumpless build-up layer packages...

Retractable ledge socket

Patents Applicationslast 30 patents

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...

PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR...

PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL

DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL

NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS

CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING AN ORGANIC STIFF...

SYSTEMS, METHODS, AND APPARATUSES FOR IMPLEMENTING A THERMAL SOLUTI...

DUAL-SIDED PACKAGE ASSEMBLY PROCESSING

FLEXIBLE CIRCUIT INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...

ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER

MAGNETIC PICK AND PLACE PROBE

DEVICE, SYSTEM AND METHOD FOR DETECTING DEGRADATION OF A FLEXIBLE C...

BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC...

ELECTRONIC ASSEMBLY COMPONENTS WITH CORNER ADHESIVE FOR WARPAGE RED...

REMOVABLE IC PACKAGE STIFFENER

Lateral Expansion Apparatus for Mechanical Testing of Stretchable E...

Inflatable Bladder Based Mechanical Testing for Stretchable Electro...

Membrane test for Mechanical Testing of Stretchable Electronics

Magnetic particle embedded flex or printed flex for magnetic tray o...

Non-Rectangular Electronic Device Components

Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...

ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...

UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE

METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES F...

THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACK...