Pramod Subramonium

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nitride films with improved etch selectivity for 3D NAND integration
- Patent number 12,040,180
- Issue date Jul 16, 2024
- Lam Research Corporation
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing a carbon hardmask by high power pulsed low frequency RF
- Patent number 11,837,441
- Issue date Dec 5, 2023
- Lam Research Corporation
- Matthew Scott Weimer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tilting a wafer for achieving deposition un...
- Patent number 10,541,117
- Issue date Jan 21, 2020
- Lam Research Corporation
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier ring wall for reduction of back-diffusion of reactive speci...
- Patent number 10,475,627
- Issue date Nov 12, 2019
- Lam Research Corporation
- Chengzhu Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PECVD apparatus for in-situ deposition of film stacks
- Patent number 10,214,816
- Issue date Feb 26, 2019
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma activated conformal dielectric film deposition
- Patent number 10,043,655
- Issue date Aug 7, 2018
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for formation of low-k aluminum-containing etch stop films
- Patent number 9,633,896
- Issue date Apr 25, 2017
- Lam Research Corporation
- Daniel Damjanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High selectivity and low stress carbon hardmask by pulsed low frequ...
- Patent number 9,589,799
- Issue date Mar 7, 2017
- Lam Research Corporation
- Sirish K. Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma activated conformal dielectric film deposition
- Patent number 9,570,274
- Issue date Feb 14, 2017
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for purging and plasma suppression in a proces...
- Patent number 9,399,228
- Issue date Jul 26, 2016
- Novellus Systems, Inc.
- Patrick Breiling
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods of depositing smooth and conformal ashable hard mask films
- Patent number 9,240,320
- Issue date Jan 19, 2016
- Novellus Systems, Inc.
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for selective deposition of cobalt in semicon...
- Patent number 9,153,482
- Issue date Oct 6, 2015
- Lam Research Corporation
- Thomas Joseph Knisley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ deposition of film stacks
- Patent number 9,028,924
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Jason Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma activated conformal dielectric film deposition
- Patent number 8,999,859
- Issue date Apr 7, 2015
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for plasma-based deposition
- Patent number 8,962,101
- Issue date Feb 24, 2015
- Novellus Systems, Inc.
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal doping via plasma activated atomic layer deposition and c...
- Patent number 8,956,983
- Issue date Feb 17, 2015
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal and silicon containing capping layers for interconnects
- Patent number 8,753,978
- Issue date Jun 17, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ deposition of film stacks
- Patent number 8,741,394
- Issue date Jun 3, 2014
- Novellus Systems, Inc.
- Jason Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion barrier and etch stop films
- Patent number 8,669,181
- Issue date Mar 11, 2014
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma activated conformal dielectric film deposition
- Patent number 8,637,411
- Issue date Jan 28, 2014
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma clean method for deposition chamber
- Patent number 8,591,659
- Issue date Nov 26, 2013
- Novellus Systems, Inc.
- Zhiyuan Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus including a plasma chamber and controller including instr...
- Patent number 8,479,683
- Issue date Jul 9, 2013
- Novellus Systems, Inc.
- George Andrew Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of depositing smooth and conformal ashable hard mask films
- Patent number 8,435,608
- Issue date May 7, 2013
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High compressive stress carbon liners for MOS devices
- Patent number 8,362,571
- Issue date Jan 29, 2013
- Novellus Systems, Inc.
- Qingguo Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing conformal boron nitride film by CVD without plasma
- Patent number 8,288,292
- Issue date Oct 16, 2012
- Novellus Systems, Inc.
- George Andrew Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interfacial capping layers for interconnects
- Patent number 8,268,722
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed PECVD method for modulating hydrogen content in hard mask
- Patent number 8,110,493
- Issue date Feb 7, 2012
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of depositing highly selective transparent ashable hardmask...
- Patent number 7,981,810
- Issue date Jul 19, 2011
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of depositing stable and hermetic ashable hardmask films
- Patent number 7,981,777
- Issue date Jul 19, 2011
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Diffusion barrier and etch stop films
- Patent number 7,915,166
- Issue date Mar 29, 2011
- Novellus Systems, Inc.
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF
- Publication number 20240234091
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF
- Publication number 20240136153
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20230366094
- Publication date Nov 16, 2023
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH SELECTIVITY, LOW STRESS, AND LOW HYDROGEN DIAMOND-LIKE CARBON...
- Publication number 20220216037
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NITRIDE FILMS WITH IMPROVED ETCH SELECTIVITY FOR 3D NAND INTEGRATION
- Publication number 20210320004
- Publication date Oct 14, 2021
- LAM RESEARCH CORPORATION
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20190376186
- Publication date Dec 12, 2019
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER RING WALL FOR REDUCTION OF BACK-DIFFUSION OF REACTIVE SPECI...
- Publication number 20170278681
- Publication date Sep 28, 2017
- LAM RESEARCH CORPORATION
- Chengzhu Qi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
- Publication number 20170148628
- Publication date May 25, 2017
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Systems And Methods For Tilting A Wafer For Achieving Deposition Un...
- Publication number 20170121819
- Publication date May 4, 2017
- LAM RESEARCH CORPORATION
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMATION OF LOW-K ALUMINUM-CONTAINING ETCH STOP FILMS
- Publication number 20170103914
- Publication date Apr 13, 2017
- LAM RESEARCH CORPORATION
- Daniel Damjanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING OF CARBON-BASED CONTAMINANTS IN METAL INTERCONNECTS FOR IN...
- Publication number 20150380296
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- George Andrew Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR SELECTIVE DEPOSITION OF COBALT IN SEMICON...
- Publication number 20150221542
- Publication date Aug 6, 2015
- LAM RESEARCH CORPORATION
- Thomas Joseph Knisley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
- Publication number 20150206719
- Publication date Jul 23, 2015
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH SELECTIVITY AND LOW STRESS CARBON HARDMASK BY PULSED LOW FREQU...
- Publication number 20150093908
- Publication date Apr 2, 2015
- LAM RESEARCH CORPORATION
- Sirish K. Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20150013607
- Publication date Jan 15, 2015
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR PURGING AND PLASMA SUPPRESSION IN A PROCES...
- Publication number 20140217193
- Publication date Aug 7, 2014
- Novellus Systems, Inc.
- Patrick Breiling
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20140216336
- Publication date Aug 7, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
- Publication number 20140216337
- Publication date Aug 7, 2014
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR PLASMA-BASED DEPOSITION
- Publication number 20140057454
- Publication date Feb 27, 2014
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA CLEAN METHOD FOR DEPOSITION CHAMBER
- Publication number 20140053867
- Publication date Feb 27, 2014
- Novellus Systems, Inc.
- Zhiyuan Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective Capping of Metal Interconnect Lines during Air Gap Formation
- Publication number 20130323930
- Publication date Dec 5, 2013
- Kaushik Chattopadhyay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20130171834
- Publication date Jul 4, 2013
- Jason Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20130143401
- Publication date Jun 6, 2013
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DOPING VIA PLASMA ACTIVATED ATOMIC LAYER DEPOSITION AND C...
- Publication number 20130040447
- Publication date Feb 14, 2013
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITING CONFORMAL BORON NITRIDE FILMS
- Publication number 20130008378
- Publication date Jan 10, 2013
- George Andrew Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INCREASING ETCH SELECTIVITY OF CARBON FILMS WITH LOWER ABSORPTION C...
- Publication number 20120258261
- Publication date Oct 11, 2012
- Novellus Systems, Inc.
- Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
- Publication number 20120028454
- Publication date Feb 2, 2012
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITING CONFORMAL BORON NITRIDE FILMS
- Publication number 20110244694
- Publication date Oct 6, 2011
- George Andrew Antonelli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Deposition of Film Stacks
- Publication number 20110236594
- Publication date Sep 29, 2011
- Jason Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20100308463
- Publication date Dec 9, 2010
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS

Pramod Subramonium

Person

Patents Grantslast 30 patents

Nitride films with improved etch selectivity for 3D NAND integration

Depositing a carbon hardmask by high power pulsed low frequency RF

Systems and methods for tilting a wafer for achieving deposition un...

Carrier ring wall for reduction of back-diffusion of reactive speci...

PECVD apparatus for in-situ deposition of film stacks

Plasma activated conformal dielectric film deposition

Methods for formation of low-k aluminum-containing etch stop films

High selectivity and low stress carbon hardmask by pulsed low frequ...

Plasma activated conformal dielectric film deposition

Method and apparatus for purging and plasma suppression in a proces...

Methods of depositing smooth and conformal ashable hard mask films

Methods and apparatus for selective deposition of cobalt in semicon...

In-situ deposition of film stacks

Plasma activated conformal dielectric film deposition

Methods and apparatus for plasma-based deposition

Conformal doping via plasma activated atomic layer deposition and c...

Metal and silicon containing capping layers for interconnects

In-situ deposition of film stacks

Diffusion barrier and etch stop films

Plasma activated conformal dielectric film deposition

Plasma clean method for deposition chamber

Apparatus including a plasma chamber and controller including instr...

Methods of depositing smooth and conformal ashable hard mask films

High compressive stress carbon liners for MOS devices

Depositing conformal boron nitride film by CVD without plasma

Interfacial capping layers for interconnects

Pulsed PECVD method for modulating hydrogen content in hard mask

Methods of depositing highly selective transparent ashable hardmask...

Methods of depositing stable and hermetic ashable hardmask films

Diffusion barrier and etch stop films

Patents Applicationslast 30 patents

DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF

DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF

PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS

HIGH SELECTIVITY, LOW STRESS, AND LOW HYDROGEN DIAMOND-LIKE CARBON...

NITRIDE FILMS WITH IMPROVED ETCH SELECTIVITY FOR 3D NAND INTEGRATION

PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS

CARRIER RING WALL FOR REDUCTION OF BACK-DIFFUSION OF REACTIVE SPECI...

PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION

Systems And Methods For Tilting A Wafer For Achieving Deposition Un...

METHODS FOR FORMATION OF LOW-K ALUMINUM-CONTAINING ETCH STOP FILMS

CLEANING OF CARBON-BASED CONTAMINANTS IN METAL INTERCONNECTS FOR IN...

METHODS AND APPARATUS FOR SELECTIVE DEPOSITION OF COBALT IN SEMICON...

PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION

HIGH SELECTIVITY AND LOW STRESS CARBON HARDMASK BY PULSED LOW FREQU...

IN-SITU DEPOSITION OF FILM STACKS

METHOD AND APPARATUS FOR PURGING AND PLASMA SUPPRESSION IN A PROCES...

METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS

PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION

METHODS AND APPARATUS FOR PLASMA-BASED DEPOSITION

PLASMA CLEAN METHOD FOR DEPOSITION CHAMBER

Selective Capping of Metal Interconnect Lines during Air Gap Formation

IN-SITU DEPOSITION OF FILM STACKS

METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS

CONFORMAL DOPING VIA PLASMA ACTIVATED ATOMIC LAYER DEPOSITION AND C...

DEPOSITING CONFORMAL BORON NITRIDE FILMS

INCREASING ETCH SELECTIVITY OF CARBON FILMS WITH LOWER ABSORPTION C...

PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION

DEPOSITING CONFORMAL BORON NITRIDE FILMS

In-Situ Deposition of Film Stacks

INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS