Praneeth Akkinepally

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,737,208
- Issue date Aug 22, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge having a substrate with cond...
- Patent number 11,688,692
- Issue date Jun 27, 2023
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 11,652,071
- Issue date May 16, 2023
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric film with pressure sensitive microcapsules of adhesion p...
- Patent number 11,571,876
- Issue date Feb 7, 2023
- Intel Corporation
- Praneeth Akkinepally
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package architecture utilizing photoimageable dielectric (PID) for...
- Patent number 11,574,874
- Issue date Feb 7, 2023
- Intel Corporation
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side de-bonding in component carriers using photoablation
- Patent number 11,462,432
- Issue date Oct 4, 2022
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device including a substrate having interconnects
- Patent number 11,348,865
- Issue date May 31, 2022
- Intel Corporation
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 11,296,186
- Issue date Apr 5, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-die interconnect bridge having a molded region with...
- Patent number 11,233,009
- Issue date Jan 25, 2022
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 11,081,448
- Issue date Aug 3, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes lamination layer
- Patent number 10,985,080
- Issue date Apr 20, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including a capacitor
- Patent number 10,923,443
- Issue date Feb 16, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated vertical capacitors and methods of assembling same
- Patent number 10,546,916
- Issue date Jan 28, 2020
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with cavity
- Patent number 10,410,940
- Issue date Sep 10, 2019
- Intel Corporation
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raster-planarized substrate interlayers and methods of planarizing...
- Patent number 10,068,776
- Issue date Sep 4, 2018
- Intel Corporation
- Frank Truong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TEC...
- Publication number 20240222274
- Publication date Jul 4, 2024
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20230345621
- Publication date Oct 26, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLA...
- Publication number 20230187331
- Publication date Jun 15, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC PASSIVATION FOR FINE PITCH ARCHITECTURES
- Publication number 20230085196
- Publication date Mar 16, 2023
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
- Publication number 20220093515
- Publication date Mar 24, 2022
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20210366835
- Publication date Nov 25, 2021
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...
- Publication number 20210305163
- Publication date Sep 30, 2021
- Intel Corporation
- Praneeth Kumar Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20210151393
- Publication date May 20, 2021
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...
- Publication number 20210134727
- Publication date May 6, 2021
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SUBSTRATE
- Publication number 20210098356
- Publication date Apr 1, 2021
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH SURROUNDING A PAD
- Publication number 20210090981
- Publication date Mar 25, 2021
- Intel Corporation
- Praneeth AKKINEPALLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR
- Publication number 20200312793
- Publication date Oct 1, 2020
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...
- Publication number 20200253037
- Publication date Aug 6, 2020
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200144359
- Publication date May 7, 2020
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME
- Publication number 20200006468
- Publication date Jan 2, 2020
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILM WITH PRESSURE SENSITIVE MICROCAPSULES OF ADHESION P...
- Publication number 20190389179
- Publication date Dec 26, 2019
- Intel Corporation
- Praneeth AKKINEPALLY
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT
- Publication number 20190333861
- Publication date Oct 31, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION
- Publication number 20190287841
- Publication date Sep 19, 2019
- Intel Corporation
- Frank Truong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Package with Cavity
- Publication number 20190006252
- Publication date Jan 3, 2019
- Intel Corporation
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
- Publication number 20180350709
- Publication date Dec 6, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS

Praneeth Akkinepally

Person

Patents Grantslast 30 patents

Embedded die microelectronic device with molded component

Microelectronic assemblies having conductive structures with differ...

Embedded multi-die interconnect bridge having a substrate with cond...

Electronic device package including a capacitor

Dielectric film with pressure sensitive microcapsules of adhesion p...

Package architecture utilizing photoimageable dielectric (PID) for...

Dual side de-bonding in component carriers using photoablation

Electronic device including a substrate having interconnects

Package-integrated vertical capacitors and methods of assembling same

Embedded multi-die interconnect bridge having a molded region with...

Embedded die microelectronic device with molded component

Electronic package that includes lamination layer

Electronic device package including a capacitor

Package-integrated vertical capacitors and methods of assembling same

Semiconductor package with cavity

Raster-planarized substrate interlayers and methods of planarizing...

Patents Applicationslast 30 patents

HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TEC...

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLA...

ORGANIC PASSIVATION FOR FINE PITCH ARCHITECTURES

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

EMBEDDED MULTI-DIE INTERCONNECT BRIDGE HAVING A MOLDED REGION WITH...

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...

ELECTRONIC DEVICE INCLUDING A SUBSTRATE

SURFACE FINISH SURROUNDING A PAD

ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR

MICROELECTRONIC ASSEMBLIES HAVING CONDUCTIVE STRUCTURES WITH DIFFE...

PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME

PACKAGE-INTEGRATED VERTICAL CAPACITORS AND METHODS OF ASSEMBLING SAME

DIELECTRIC FILM WITH PRESSURE SENSITIVE MICROCAPSULES OF ADHESION P...

EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT

DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION

Semiconductor Package with Cavity

ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER