Membership
Tour
Register
Log in
Prayudi LIANTO
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Methods and apparatus for processing a substrate
Patent number
12,138,742
Issue date
Nov 12, 2024
Applied Materials, Inc.
Prayudi Lianto
B24 - GRINDING POLISHING
Information
Patent Grant
Methods and apparatus for processing a substrate
Patent number
12,020,992
Issue date
Jun 25, 2024
Applied Materials, Inc.
Prayudi Lianto
G01 - MEASURING TESTING
Information
Patent Grant
Planarization methods for packaging substrates
Patent number
11,931,855
Issue date
Mar 19, 2024
Applied Materials, Inc.
Han-Wen Chen
B24 - GRINDING POLISHING
Information
Patent Grant
Diffusion layers in metal interconnects
Patent number
11,901,225
Issue date
Feb 13, 2024
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming alignment marks
Patent number
11,899,376
Issue date
Feb 13, 2024
Applied Materials, Inc.
Prayudi Lianto
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Methods and apparatus for controlling warpage in wafer level packag...
Patent number
11,421,316
Issue date
Aug 23, 2022
Applied Materials, Inc.
Prayudi Lianto
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Methods of thinning silicon on epoxy mold compound for radio freque...
Patent number
11,355,358
Issue date
Jun 7, 2022
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fine redistribution interconnect formation for advanced p...
Patent number
11,342,256
Issue date
May 24, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for bonding substrates
Patent number
11,309,278
Issue date
Apr 19, 2022
Applied Materials, Inc.
Prayudi Lianto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatus for backside via reveal processing
Patent number
11,289,387
Issue date
Mar 29, 2022
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming vias in polymer layers
Patent number
10,636,696
Issue date
Apr 28, 2020
Applied Materials, Inc.
Yu Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for semiconductor package processing
Patent number
10,515,927
Issue date
Dec 24, 2019
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slurry for polishing of integrated circuit packaging
Patent number
10,319,601
Issue date
Jun 11, 2019
Applied Materials, Inc.
Ranga Rao Arnepalli
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Methods for chemical mechanical polishing (CMP) processing with ozone
Patent number
10,002,771
Issue date
Jun 19, 2018
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of enhancing polymer adhesion to copper
Patent number
9,922,874
Issue date
Mar 20, 2018
Applied Materials, Inc.
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
Publication number
20250062129
Publication date
Feb 20, 2025
Applied Materials, Inc.
Yin Wei LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Grain Structure Engineering for Metal Gapfill Materials
Publication number
20250038137
Publication date
Jan 30, 2025
Applied Materials, Inc.
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR SUBSTRATE CLEANING IN STACK-DIE HYBRID BON...
Publication number
20240390950
Publication date
Nov 28, 2024
Applied Materials, Inc.
Ke ZHENG
B08 - CLEANING
Information
Patent Application
PRE-BONDING AUTOMATIC OPTICAL INSPECTION DEFECT CLASSIFICATION
Publication number
20240331131
Publication date
Oct 3, 2024
Rahul Reddy KOMATIREDDI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
AUTOMATION METHOD FOR DEFECT CHARACTERIZATION FOR HYBRID BONDING AP...
Publication number
20240330671
Publication date
Oct 3, 2024
Rahul Reddy KOMATIREDDI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
POST BONDING AOI DEFECT CLASSIFICATION
Publication number
20240331126
Publication date
Oct 3, 2024
Rahul Reddy KOMATIREDDI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHODS FOR DEPOSITING DIELECTRIC FILMS WITH INCREASED STABILITY
Publication number
20240332005
Publication date
Oct 3, 2024
Applied Materials, Inc.
Wenhui Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon (Si) Dry Etch for Die-to-Wafer Thinning
Publication number
20240213028
Publication date
Jun 27, 2024
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selective Deposition of Thin Films with Improved Stability
Publication number
20240110284
Publication date
Apr 4, 2024
Applied Materials, Inc.
Lulu XIONG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS FOR FORMING ALIGNMENT MARKS
Publication number
20240069448
Publication date
Feb 29, 2024
Applied Materials, Inc.
Prayudi LIANTO
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20230238287
Publication date
Jul 27, 2023
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WATER VAPOR PLASMA TO ENHANCE SURFACE HYDROPHILICITY
Publication number
20230100863
Publication date
Mar 30, 2023
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION LAYERS IN METAL INTERCONNECTS
Publication number
20230077737
Publication date
Mar 16, 2023
Applied Materials, Inc.
Eric J. Bergman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Publication number
20220258304
Publication date
Aug 18, 2022
National University of Singapore
Prayudi LIANTO
G01 - MEASURING TESTING
Information
Patent Application
METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
Publication number
20220037216
Publication date
Feb 3, 2022
Applied Materials, Inc.
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
Publication number
20210202334
Publication date
Jul 1, 2021
Applied Materials, Inc.
PENG SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF THINNING SILICON ON EPOXY MOLD COMPOUND FOR RADIO FREQUE...
Publication number
20210090905
Publication date
Mar 25, 2021
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTION
Publication number
20210057238
Publication date
Feb 25, 2021
Applied Materials, Inc.
CHIN WEI TAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR DETERMINING ENDPOINTS FOR CHEMICAL MECHAN...
Publication number
20210057292
Publication date
Feb 25, 2021
Applied Materials, Inc.
PRAYUDI LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR SUBSTRATE WARPAGE CORRECTION
Publication number
20210035795
Publication date
Feb 4, 2021
Applied Materials, Inc.
Qi Jie PENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANARIZATION METHODS FOR PACKAGING SUBSTRATES
Publication number
20200391343
Publication date
Dec 17, 2020
Applied Materials, Inc.
Han-Wen CHEN
B24 - GRINDING POLISHING
Information
Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
Publication number
20200306931
Publication date
Oct 1, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FINE REDISTRIBUTION INTERCONNECT FORMATION FOR ADVANCED P...
Publication number
20200243432
Publication date
Jul 30, 2020
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR BONDING SUBSTRATES
Publication number
20200135690
Publication date
Apr 30, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS AND APPARATUS FOR CONTROLLING WARPAGE IN WAFER LEVEL PACKAG...
Publication number
20200131624
Publication date
Apr 30, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGE PROCESSING
Publication number
20180308822
Publication date
Oct 25, 2018
Prayudi Lianto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLURRY FOR POLISHING OF INTEGRATED CIRCUIT PACKAGING
Publication number
20180277384
Publication date
Sep 27, 2018
Applied Materials, Inc.
Ranga Rao Arnepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF ENHANCING POLYMER ADHESION TO COPPER
Publication number
20180005881
Publication date
Jan 4, 2018
Prayudi LIANTO
H01 - BASIC ELECTRIC ELEMENTS