Prithwish Chatterjee

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of thin film capacitors in organic substrate packages
- Patent number 11,651,902
- Issue date May 16, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing photoimageable dielectric (PID) for...
- Patent number 11,574,874
- Issue date Feb 7, 2023
- Intel Corporation
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,495,552
- Issue date Nov 8, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
- Patent number 11,443,885
- Issue date Sep 13, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attaching large components in a package substrate for a...
- Patent number 11,432,405
- Issue date Aug 30, 2022
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded magnetic material using photo...
- Patent number 11,289,263
- Issue date Mar 29, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enabling magnetic films in inductors integrated into semiconductor...
- Patent number 11,270,959
- Issue date Mar 8, 2022
- Intel Corporation
- Kirstof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,205,626
- Issue date Dec 21, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded dielectric magnetic material...
- Patent number 11,189,409
- Issue date Nov 30, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 10,700,021
- Issue date Jun 30, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edible supercapacitors
- Patent number 10,468,203
- Issue date Nov 5, 2019
- Arizona Board of Regents on behalf of Arizona State University
- Hanqing Jiang
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20240014149
- Publication date Jan 11, 2024
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220285079
- Publication date Sep 8, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20220068847
- Publication date Mar 3, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20220013265
- Publication date Jan 13, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PLANE INDUCTORS IN IC PACKAGES
- Publication number 20210273036
- Publication date Sep 2, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...
- Publication number 20210134727
- Publication date May 6, 2021
- Robert A. May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE
- Publication number 20200411413
- Publication date Dec 31, 2020
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200279819
- Publication date Sep 3, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED HEAT PIPE
- Publication number 20200176355
- Publication date Jun 4, 2020
- Intel Corporation
- Robert A. May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200075511
- Publication date Mar 5, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER
- Publication number 20200006211
- Publication date Jan 2, 2020
- Intel Corporation
- Andrew J. BROWN
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...
- Publication number 20200006258
- Publication date Jan 2, 2020
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATTACHING LARGE COMPONENTS IN A PACKAGE SUBSTRATE FOR A...
- Publication number 20200008302
- Publication date Jan 2, 2020
- Rahul JAIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES
- Publication number 20200006005
- Publication date Jan 2, 2020
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MAGNETIC FILMS IN INDUCTORS INTEGRATED INTO SEMICONDUCTOR...
- Publication number 20190295967
- Publication date Sep 26, 2019
- Intel Corporation
- Kirstof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BARRIER SEED MATALLIZATION IN MAGNETIC-PLUGGED THROUGH HO...
- Publication number 20190279806
- Publication date Sep 12, 2019
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE LAYER-ASSISTED SELECTIVE EMBEDDING OF MAGNETIC MATERIAL IN...
- Publication number 20190221345
- Publication date Jul 18, 2019
- Intel Corporation
- Sai Vadlamani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20190206597
- Publication date Jul 4, 2019
- Intel Corporation
- Andrew J. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20190206780
- Publication date Jul 4, 2019
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED MAGNETIC MATERIAL USING PHOTO...
- Publication number 20190198228
- Publication date Jun 27, 2019
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20190198436
- Publication date Jun 27, 2019
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDIBLE SUPERCAPACITORS
- Publication number 20180235881
- Publication date Aug 23, 2018
- Arizona Board of Regents on behalf of Arizona State University
- Hanqing Jiang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Prithwish Chatterjee

Person

Patents Grantslast 30 patents

Coreless organic packages with embedded die and magnetic inductor s...

Methods of embedding magnetic structures in substrates

Substrate integrated thin film capacitors using amorphous high-k di...

Patterning of thin film capacitors in organic substrate packages

Release layer-assisted selective embedding of magnetic material in...

Package architecture utilizing photoimageable dielectric (PID) for...

Asymmetric cored integrated circuit package supports

Substrate integrated thin film capacitors using amorphous high-k di...

Thin film barrier seed metallization in magnetic-plugged through ho...

Methods for attaching large components in a package substrate for a...

Magnetic inductor structures for package devices

Electronic substrates having embedded magnetic material using photo...

Enabling magnetic films in inductors integrated into semiconductor...

Methods of embedding magnetic structures in substrates

Coreless organic packages with embedded die and magnetic inductor s...

Electronic substrates having embedded dielectric magnetic material...

Coreless organic packages with embedded die and magnetic inductor s...

Edible supercapacitors

Patents Applicationslast 30 patents

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

IN-PLANE INDUCTORS IN IC PACKAGES

PACKAGE ARCHITECTURE UTILIZING PHOTOIMAGEABLE DIELECTRIC (PID) FOR...

SUBSTRATE FOR AN ELECTRONIC DEVICE

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

SUBSTRATE EMBEDDED HEAT PIPE

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

SUBSTRATE ASSEMBLY REGION WITH CERAMIC OR BORON FIBER

SUBSTRATE INTEGRATED THIN FILM CAPACITORS USING AMORPHOUS HIGH-K DI...

METHODS FOR ATTACHING LARGE COMPONENTS IN A PACKAGE SUBSTRATE FOR A...

PATTERNING OF THIN FILM CAPACITORS IN ORGANIC SUBSTRATE PACKAGES

ENABLING MAGNETIC FILMS IN INDUCTORS INTEGRATED INTO SEMICONDUCTOR...

THIN FILM BARRIER SEED MATALLIZATION IN MAGNETIC-PLUGGED THROUGH HO...

RELEASE LAYER-ASSISTED SELECTIVE EMBEDDING OF MAGNETIC MATERIAL IN...

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

ELECTRONIC SUBSTRATES HAVING EMBEDDED MAGNETIC MATERIAL USING PHOTO...

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

EDIBLE SUPERCAPACITORS