Membership
Tour
Register
Log in
Puay Gek Chua
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for producing vias in fan-out wafers using dry film and cond...
Patent number
8,535,980
Issue date
Sep 17, 2013
STMicroelectronics Pte Ltd
Puay Gek Chua
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
System for fabricating an integrated circuit package on a printed c...
Patent number
7,306,133
Issue date
Dec 11, 2007
ST Assembly Test Services Ltd.
Yonggang Jin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR PRODUCING A TWO-SIDED FAN-OUT WAFER LEVEL PACKAGE WITH E...
Publication number
20120282767
Publication date
Nov 8, 2012
STMicroelectronics Pte Ltd
Yonggang Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL GRID ARRAY METHOD AND STRUCTURE
Publication number
20120161319
Publication date
Jun 28, 2012
STMicroelectronics Pte Ltd
Yaohuang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING VIAS IN FAN-OUT WAFERS USING DRY FILM AND COND...
Publication number
20120161332
Publication date
Jun 28, 2012
STMicroelectronics Pte Ltd
Puay Gek Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Under bump metallurgy in integrated circuits
Publication number
20060160267
Publication date
Jul 20, 2006
STATS ChipPAC Ltd.
Hyeong Ryeol Hur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System for fabricating an integrated circuit package on a printed c...
Publication number
20040211817
Publication date
Oct 28, 2004
ST ASSEMBLY TEST SERVICES LTD.
Yonggang Jin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR