Qingjun Zhou

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,508,618
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 11,302,519
- Issue date Apr 12, 2022
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multicolor self-aligned contact selective etch
- Patent number 11,094,589
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,840,138
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to remove III-V materials in high aspect ratio structures
- Patent number 10,770,568
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bottom up fin structure formation
- Patent number 10,741,393
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of selective aluminum oxide etch
- Patent number 10,692,728
- Issue date Jun 23, 2020
- Micromaterials LLC
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively etched self-aligned via processes
- Patent number 10,593,594
- Issue date Mar 17, 2020
- Micromaterials LLC
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask scheme for cut pattern flow with enlarged EPE window
- Patent number 10,510,540
- Issue date Dec 17, 2019
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing self-aligned vias
- Patent number 10,510,602
- Issue date Dec 17, 2019
- Mirocmaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etch mask and fin structure formation
- Patent number 10,439,047
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bottom up fin structure formation
- Patent number 10,204,781
- Issue date Feb 12, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic oxide spacer etch process
- Patent number 9,818,621
- Issue date Nov 14, 2017
- Applied Materials, Inc.
- Aurelien Tavernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,721,807
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,478,433
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature ramping using gas distribution plate heat
- Patent number 9,368,370
- Issue date Jun 14, 2016
- Applied Materials, Inc.
- Sergey G. Belostotskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 9,165,783
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a silicon nitride dielectric film
- Patent number 9,093,389
- Issue date Jul 28, 2015
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a low-k dielectric film
- Patent number 8,802,572
- Issue date Aug 12, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide recess etch
- Patent number 8,748,322
- Issue date Jun 10, 2014
- Applied Materials, Inc.
- Nancy Fung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing masking materials with reduced low-k dielectric...
- Patent number 7,790,047
- Issue date Sep 7, 2010
- Applied Materials, Inc.
- Zhilin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH
- Publication number 20210343592
- Publication date Nov 4, 2021
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multicolor Self-Aligned Contact Selective Etch
- Publication number 20190279901
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCH MASK AND FIN STRUCTURE FORMATION
- Publication number 20190252523
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Yung-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BOTTOM UP FIN STRUCTURE FORMATION
- Publication number 20190252187
- Publication date Aug 15, 2019
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Etched Self-Aligned Via Processes
- Publication number 20190189510
- Publication date Jun 20, 2019
- Micromaterials LLC.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REMOVE III-V MATERIALS IN HIGH ASPECT RATIO STRUCTURES
- Publication number 20190181246
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Xinyu BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of Selective Aluminum Oxide Etch
- Publication number 20190096666
- Publication date Mar 28, 2019
- Micromaterials LLC.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY ETCHED SELF-ALIGNED VIA PROCESSES
- Publication number 20190088543
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Yung-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Producing Self-Aligned Vias
- Publication number 20190067102
- Publication date Feb 28, 2019
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Scheme For Cut Pattern Flow With Enlarged EPE Window
- Publication number 20190019676
- Publication date Jan 17, 2019
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC OXIDE SPACER ETCH PROCESS
- Publication number 20170243754
- Publication date Aug 24, 2017
- Applied Materials, Inc.
- Aurelien TAVERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LAYER ETCH SYSTEM WITH MULTIPLE TYPE CHAMBERS
- Publication number 20170229315
- Publication date Aug 10, 2017
- Applied Materials, Inc.
- Ying ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FORMATION PROCESS WITH FLAT TOP PROFILE
- Publication number 20160307772
- Publication date Oct 20, 2016
- Applied Materials, Inc.
- Tom CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293437
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293438
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20150380215
- Publication date Dec 31, 2015
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE RAMPING USING GAS DISTRIBUTION PLATE HEAT
- Publication number 20150262834
- Publication date Sep 17, 2015
- Applied Materials, Inc.
- Sergey G. BELOSTOTSKIY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PATTERNING A HARDMASK LAYER FOR AN ION IMPLANTATION PRO...
- Publication number 20150118832
- Publication date Apr 30, 2015
- Applied Materials, Inc.
- Bingxi Sun WOOD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A SILICON NITRIDE DIELECTRIC FILM
- Publication number 20140199851
- Publication date Jul 17, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20140120726
- Publication date May 1, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A LOW-K DIELECTRIC FILM
- Publication number 20140017898
- Publication date Jan 16, 2014
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS
- Publication number 20110253670
- Publication date Oct 20, 2011
- Applied Materials, Inc.
- YIFENG ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE
- Publication number 20110079918
- Publication date Apr 7, 2011
- Applied Materials, Inc.
- Yifeng ZHOU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF PHOTORESIST REMOVAL IN THE PRESENCE OF A LOW-K DIELECTRIC...
- Publication number 20100043821
- Publication date Feb 25, 2010
- Siyi Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS
- Publication number 20100022091
- Publication date Jan 28, 2010
- SIYI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing masking materials with reduced low-k dielectric...
- Publication number 20070249172
- Publication date Oct 25, 2007
- Applied Materials, Inc.
- Zhilin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Qingjun Zhou

Person

Patents Grantslast 30 patents

Multicolor self-aligned contact selective etch

Method of patterning a low-k dielectric film

Multicolor self-aligned contact selective etch

Selectively etched self-aligned via processes

Method to remove III-V materials in high aspect ratio structures

Methods for bottom up fin structure formation

Use of selective aluminum oxide etch

Selectively etched self-aligned via processes

Mask scheme for cut pattern flow with enlarged EPE window

Methods of producing self-aligned vias

Methods for etch mask and fin structure formation

Methods for bottom up fin structure formation

Cyclic oxide spacer etch process

Cyclic spacer etching process with improved profile control

Cyclic spacer etching process with improved profile control

Temperature ramping using gas distribution plate heat

Method of patterning a low-k dielectric film

Method of patterning a silicon nitride dielectric film

Method of patterning a low-k dielectric film

Silicon oxide recess etch

Method for removing masking materials with reduced low-k dielectric...

Patents Applicationslast 30 patents

MULTICOLOR SELF-ALIGNED CONTACT SELECTIVE ETCH

Multicolor Self-Aligned Contact Selective Etch

METHODS FOR ETCH MASK AND FIN STRUCTURE FORMATION

METHODS FOR BOTTOM UP FIN STRUCTURE FORMATION

Selectively Etched Self-Aligned Via Processes

METHOD TO REMOVE III-V MATERIALS IN HIGH ASPECT RATIO STRUCTURES

Use of Selective Aluminum Oxide Etch

SELECTIVELY ETCHED SELF-ALIGNED VIA PROCESSES

Methods Of Producing Self-Aligned Vias

Mask Scheme For Cut Pattern Flow With Enlarged EPE Window

CYCLIC OXIDE SPACER ETCH PROCESS

INTEGRATED LAYER ETCH SYSTEM WITH MULTIPLE TYPE CHAMBERS

SPACER FORMATION PROCESS WITH FLAT TOP PROFILE

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

TEMPERATURE RAMPING USING GAS DISTRIBUTION PLATE HEAT

METHODS FOR PATTERNING A HARDMASK LAYER FOR AN ION IMPLANTATION PRO...

METHOD OF PATTERNING A SILICON NITRIDE DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHOD OF PATTERNING A LOW-K DIELECTRIC FILM

METHODS FOR ETCHING SILICON-BASED ANTIREFLECTIVE LAYERS

PLASMA-BASED ORGANIC MASK REMOVAL WITH SILICON FLUORIDE

METHOD OF PHOTORESIST REMOVAL IN THE PRESENCE OF A LOW-K DIELECTRIC...

METHOD FOR PLASMA ETCHING POROUS LOW-K DIELECTRIC LAYERS

Method for removing masking materials with reduced low-k dielectric...