R. Scott List

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling micro-channels
- Patent number 7,842,553
- Issue date Nov 30, 2010
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated re-combiner for electroosmotic pumps using porous frits
- Patent number 7,723,208
- Issue date May 25, 2010
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method of forming a stack of heat generating integrated circuit chi...
- Patent number 7,696,015
- Issue date Apr 13, 2010
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Electroosmotic pump using nanoporous dielectric frit
- Patent number 7,667,319
- Issue date Feb 23, 2010
- Intel Corporation
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...
- Patent number 7,615,462
- Issue date Nov 10, 2009
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 7,576,432
- Issue date Aug 18, 2009
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method integrating an electro-osmotic pump and microc...
- Patent number 7,569,426
- Issue date Aug 4, 2009
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
- Patent number 7,537,954
- Issue date May 26, 2009
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method integrating an electro-osmotic pump and microc...
- Patent number 7,355,277
- Issue date Apr 8, 2008
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for interfacing electronic devices
- Patent number 7,348,217
- Issue date Mar 25, 2008
- Intel Corporation
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of doping a conductive layer near a via
- Patent number 7,300,871
- Issue date Nov 27, 2007
- Intel Corporation
- Stefan Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electroosmotic pumps using porous frits for cooling integr...
- Patent number 7,274,106
- Issue date Sep 25, 2007
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling micro-channels
- Patent number 7,227,257
- Issue date Jun 5, 2007
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of vertically stacking multiple wafers supporting different...
- Patent number 7,157,787
- Issue date Jan 2, 2007
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...
- Patent number 7,148,565
- Issue date Dec 12, 2006
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing method
- Patent number 7,129,172
- Issue date Oct 31, 2006
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of signal distribution based on a standing wave within a clo...
- Patent number 7,120,817
- Issue date Oct 10, 2006
- Intel Corporation
- Mauro J. Kobrinsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-aligned electrodes contained within the trenches of an electro...
- Patent number 7,105,382
- Issue date Sep 12, 2006
- Intel Corporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroosmotic pumps using porous frits for cooling integrated circ...
- Patent number 7,084,495
- Issue date Aug 1, 2006
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Barrier structure against corrosion and contamination in three-dime...
- Patent number 7,056,807
- Issue date Jun 6, 2006
- Intel Corporation
- Scot A. Kellar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming backside connections on a wafer stack
- Patent number 7,056,813
- Issue date Jun 6, 2006
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using a flexible bladder press for three dimensional...
- Patent number 7,037,804
- Issue date May 2, 2006
- Intel Corporation
- Scot A. Kellar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having thermoelectric elements to cool a d...
- Patent number 7,034,394
- Issue date Apr 25, 2006
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 6,992,381
- Issue date Jan 31, 2006
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-osmotic pumps and micro-channels
- Patent number 6,981,849
- Issue date Jan 3, 2006
- Intel Corporation
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Thick metal layer integrated process flow to improve power delivery...
- Patent number 6,977,435
- Issue date Dec 20, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using a flexible bladder press and thinned wafers for...
- Patent number 6,975,016
- Issue date Dec 13, 2005
- Intel Corporation
- Scot A. Kellar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch thinning techniques for wafer-to-wafer vertical stacks
- Patent number 6,908,565
- Issue date Jun 21, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming backside connections on a wafer stack
- Patent number 6,897,125
- Issue date May 24, 2005
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric recess for wafer-to-wafer and die-to-die metal bonding a...
- Patent number 6,887,769
- Issue date May 3, 2005
- Intel Corporation
- Scot A. Kellar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaged electroosmotic pumps using porous frits for cooling integr...
- Publication number 20070278668
- Publication date Dec 6, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling micro-channels
- Publication number 20070200226
- Publication date Aug 30, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD INTEGRATING AN ELECTRO-OSMOTIC PUMP AND MICROC...
- Publication number 20070190695
- Publication date Aug 16, 2007
- Intel Coporation
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of vertically stacking multiple wafers supporting different...
- Publication number 20070111386
- Publication date May 17, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT
- Publication number 20070087528
- Publication date Apr 19, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...
- Publication number 20070020805
- Publication date Jan 25, 2007
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for interfacing electronic devices
- Publication number 20070015340
- Publication date Jan 18, 2007
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
- Publication number 20060226541
- Publication date Oct 12, 2006
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Microelectronic assembly having thermoelectric elements to cool a d...
- Publication number 20060097383
- Publication date May 11, 2006
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick metal layer integrated process flow to improve power delivery...
- Publication number 20060076678
- Publication date Apr 13, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20060055030
- Publication date Mar 16, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer processing method
- Publication number 20050215056
- Publication date Sep 29, 2005
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for interfacing electronic devices
- Publication number 20050184400
- Publication date Aug 25, 2005
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming backside connections on a wafer stack
- Publication number 20050164490
- Publication date Jul 28, 2005
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method integrating an electro-osmotic pump and microc...
- Publication number 20050139996
- Publication date Jun 30, 2005
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned electrodes contained within the trenches of an electro...
- Publication number 20050112816
- Publication date May 26, 2005
- Alan M. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pump using nanoporous dielectric frit
- Publication number 20050104199
- Publication date May 19, 2005
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20050093138
- Publication date May 5, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor device that has copper damascene i...
- Publication number 20050095751
- Publication date May 5, 2005
- Stefan Hau-Riege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pumps using porous frits for cooling integrated circ...
- Publication number 20050085018
- Publication date Apr 21, 2005
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Microelectronic assembly having thermoelectric elements to cool a d...
- Publication number 20050077619
- Publication date Apr 14, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated re-combiner for electroosmotic pumps using porous frits
- Publication number 20050074953
- Publication date Apr 7, 2005
- Sarah E. Kim
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Packaged electroosmotic pumps using porous frits for cooling integr...
- Publication number 20050062150
- Publication date Mar 24, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BACKSIDE CONNECTIONS ON A WAFER STACK
- Publication number 20050059217
- Publication date Mar 17, 2005
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick metal layer integrated process flow to improve power delivery...
- Publication number 20050051894
- Publication date Mar 10, 2005
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Closed loop based timing signal distribution architecture
- Publication number 20040243873
- Publication date Dec 2, 2004
- Mauro J. Kobrinsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and structure for interfacing electronic devices
- Publication number 20040232537
- Publication date Nov 25, 2004
- Mauro J. Kobrinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of vertically stacking multiple wafers supporting different...
- Publication number 20040219763
- Publication date Nov 4, 2004
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroosmotic pump using nanoporous dielectric frit
- Publication number 20040191943
- Publication date Sep 30, 2004
- R. Scott List
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Cooling micro-channels
- Publication number 20040145047
- Publication date Jul 29, 2004
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS

R. Scott List

Person

Patents Grantslast 30 patents

Cooling micro-channels

Integrated re-combiner for electroosmotic pumps using porous frits

Method of forming a stack of heat generating integrated circuit chi...

Electroosmotic pump using nanoporous dielectric frit

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...

Using external radiators with electroosmotic pumps for cooling inte...

Apparatus and method integrating an electro-osmotic pump and microc...

Microelectronic assembly having thermoelectric elements to cool a d...

Apparatus and method integrating an electro-osmotic pump and microc...

Method and structure for interfacing electronic devices

Method of doping a conductive layer near a via

Packaged electroosmotic pumps using porous frits for cooling integr...

Cooling micro-channels

Process of vertically stacking multiple wafers supporting different...

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...

Bonded wafer processing method

Method of signal distribution based on a standing wave within a clo...

Self-aligned electrodes contained within the trenches of an electro...

Electroosmotic pumps using porous frits for cooling integrated circ...

Barrier structure against corrosion and contamination in three-dime...

Methods of forming backside connections on a wafer stack

Wafer bonding using a flexible bladder press for three dimensional...

Microelectronic assembly having thermoelectric elements to cool a d...

Using external radiators with electroosmotic pumps for cooling inte...

Electro-osmotic pumps and micro-channels

Thick metal layer integrated process flow to improve power delivery...

Wafer bonding using a flexible bladder press and thinned wafers for...

Etch thinning techniques for wafer-to-wafer vertical stacks

Methods of forming backside connections on a wafer stack

Dielectric recess for wafer-to-wafer and die-to-die metal bonding a...

Patents Applicationslast 30 patents

Packaged electroosmotic pumps using porous frits for cooling integr...

Cooling micro-channels

APPARATUS AND METHOD INTEGRATING AN ELECTRO-OSMOTIC PUMP AND MICROC...

Process of vertically stacking multiple wafers supporting different...

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D...

Method and structure for interfacing electronic devices

Electroosmotic pumps using porous frits for cooling integrated circ...

Microelectronic assembly having thermoelectric elements to cool a d...

Thick metal layer integrated process flow to improve power delivery...

Using external radiators with electroosmotic pumps for cooling inte...

Bonded wafer processing method

Method and structure for interfacing electronic devices

Methods of forming backside connections on a wafer stack

Apparatus and method integrating an electro-osmotic pump and microc...

Self-aligned electrodes contained within the trenches of an electro...

Electroosmotic pump using nanoporous dielectric frit

Using external radiators with electroosmotic pumps for cooling inte...

Method of making a semiconductor device that has copper damascene i...

Electroosmotic pumps using porous frits for cooling integrated circ...

Microelectronic assembly having thermoelectric elements to cool a d...

Integrated re-combiner for electroosmotic pumps using porous frits

Packaged electroosmotic pumps using porous frits for cooling integr...

METHODS OF FORMING BACKSIDE CONNECTIONS ON A WAFER STACK

Thick metal layer integrated process flow to improve power delivery...

Closed loop based timing signal distribution architecture

Method and structure for interfacing electronic devices

Process of vertically stacking multiple wafers supporting different...

Electroosmotic pump using nanoporous dielectric frit

Cooling micro-channels