Ra-Min Tain

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered resonator circuit structure and multi-layered filter...
- Patent number 12,347,912
- Issue date Jul 1, 2025
- Unimicron Technology Corp.
- Chi-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card testing device
- Patent number 11,808,787
- Issue date Nov 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 11,690,173
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,641,720
- Issue date May 2, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,631,626
- Issue date Apr 18, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,545,412
- Issue date Jan 3, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 11,410,971
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,933
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 11,410,940
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method having a mesh gas-permea...
- Patent number 11,373,927
- Issue date Jun 28, 2022
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 11,337,303
- Issue date May 17, 2022
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,127,664
- Issue date Sep 21, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming circuit board stacked structure
- Patent number 11,013,103
- Issue date May 18, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 10,957,658
- Issue date Mar 23, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier board structure and manufacturing method thereof
- Patent number 10,888,001
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier and package structure
- Patent number 10,881,006
- Issue date Dec 29, 2020
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded chip package, manufacturing method thereof, and package-on...
- Patent number 10,797,017
- Issue date Oct 6, 2020
- Unimicron Technology Corp.
- Po-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with porous bonding layer and stacked structure with po...
- Patent number 10,714,448
- Issue date Jul 14, 2020
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 10,685,922
- Issue date Jun 16, 2020
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier having a mesh gas-permeable structure disposed in t...
- Patent number 10,515,870
- Issue date Dec 24, 2019
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 10,211,139
- Issue date Feb 19, 2019
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board stacked structure and method for forming the same
- Patent number 10,178,755
- Issue date Jan 8, 2019
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of interconnection structure
- Patent number 10,141,224
- Issue date Nov 27, 2018
- Unimicron Technology Corp.
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 9,859,159
- Issue date Jan 2, 2018
- Unimicron Technology Corp.
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an interposer, interposer and chip package...
- Patent number 9,368,442
- Issue date Jun 14, 2016
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239558
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250240889
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239511
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250240887
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250105536
- Publication date Mar 27, 2025
- Unimicron Technology Corp.
- Ra-Min TAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20250096145
- Publication date Mar 20, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240159473
- Publication date May 16, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED RESONATOR CIRCUIT STRUCTURE AND MULTI-LAYERED FILTER...
- Publication number 20230420818
- Publication date Dec 28, 2023
- Unimicron Technology Corp.
- Chi-Feng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335506
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335466
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268256
- Publication date Aug 24, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268257
- Publication date Aug 24, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20230137841
- Publication date May 4, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20230067112
- Publication date Mar 2, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20230046699
- Publication date Feb 16, 2023
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20220408554
- Publication date Dec 22, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220287182
- Publication date Sep 8, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220108953
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220108934
- Publication date Apr 7, 2022
- Unimicron Technology Corp.
- Ra-Min Tain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220095464
- Publication date Mar 24, 2022
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071000
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROBE CARD TESTING DEVICE
- Publication number 20220065897
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220059498
- Publication date Feb 24, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210247147
- Publication date Aug 12, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210251107
- Publication date Aug 12, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
PACKAGE STRUCTURE WITH STRUCTURE REINFORCING ELEMENT AND MANUFACTUR...
- Publication number 20210159191
- Publication date May 27, 2021
- Unimicron Technology Corp.
- Pu-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS

Ra-Min Tain

Person

Patents Grantslast 30 patents

Multi-layered resonator circuit structure and multi-layered filter...

Circuit carrier and manufacturing method thereof and package structure

Circuit board structure

Probe card testing device

Circuit board structure

Manufacturing method of circuit carrier board structure

Circuit board and manufacturing method thereof

Package structure

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Chip package structure

Package structure and manufacturing method thereof

Package structure with structure reinforcing element and manufactur...

Package substrate and manufacturing method having a mesh gas-permea...

Chip package structure and manufacturing method thereof

Circuit board structure

Circuit board and manufacturing method thereof

Method for forming circuit board stacked structure

Package structure with structure reinforcing element and manufactur...

Circuit carrier board structure and manufacturing method thereof

Package carrier and package structure

Embedded chip package, manufacturing method thereof, and package-on...

Chip module with porous bonding layer and stacked structure with po...

Package structure with structure reinforcing element and manufactur...

Package carrier having a mesh gas-permeable structure disposed in t...

Chip package structure

Circuit board stacked structure and method for forming the same

Manufacturing method of interconnection structure

Interconnection structure and manufacturing method thereof

Method for manufacturing an interposer, interposer and chip package...

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF CIRCUIT CARRIER

CONNECTOR AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGING STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYERED RESONATOR CIRCUIT STRUCTURE AND MULTI-LAYERED FILTER...

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE

CIRCUIT BOARD STRUCTURE

CIRCUIT BOARD STRUCTURE

EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PROBE CARD TESTING DEVICE

CHIP PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

VAPOR CHAMBER STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH STRUCTURE REINFORCING ELEMENT AND MANUFACTUR...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF