Radesh Jewram

Person

Lakeville, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging thermal interface materials
- Patent number 8,430,264
- Issue date Apr 30, 2013
- The Bergquist Company
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for packaging thermal interface materials
- Patent number 8,205,766
- Issue date Jun 26, 2012
- The Bergquist Company
- Radesh Jewram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface with non-tacky surface
- Patent number 8,110,919
- Issue date Feb 7, 2012
- The Bergquist Company
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface with non-tacky surface
- Patent number 8,076,773
- Issue date Dec 13, 2011
- The Bergquist Company
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermally and electrically conductive interconnect structures
- Patent number 7,760,507
- Issue date Jul 20, 2010
- The Bergquist Company
- Radesh Jewram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface pad utilizing low melting metal with retention ma...
- Patent number 6,984,685
- Issue date Jan 10, 2006
- The Bergquist Company
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible surface layer film for delivery of highly filled or low cr...
- Patent number 6,657,297
- Issue date Dec 2, 2003
- The Bergquist Company
- Radesh Jewram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated release films for phase-change interfaces
- Patent number 6,399,209
- Issue date Jun 4, 2002
- The Bergquist Company
- Sanjay Misra
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE COMPOSITION FOR HIGH TEMPERATURE APPLICATIONS
- Publication number 20240417612
- Publication date Dec 19, 2024
- Henkel AG & Co. KGaA
- Radesh Jewram
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW THERMAL RESISTANCE PHASE CHANGE THERMAL INTERFACE MATERIALS
- Publication number 20240400880
- Publication date Dec 5, 2024
- Henkel AG & Co. KGaA
- Radesh Jewram
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL INTERFACE MATERIALS AND METHODS FOR APPLICATION
- Publication number 20220380547
- Publication date Dec 1, 2022
- Henkel AG & Co. KGaA
- Ryan Verhulst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT OF HIGH HEAT FLUX MULTICOMPONENT ASSEMBLY
- Publication number 20220151108
- Publication date May 12, 2022
- Henkel AG & Co. KGaA
- Radesh Jewram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIALS
- Publication number 20210388203
- Publication date Dec 16, 2021
- Henkel IP & Holding GmbH
- Chunyong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Packaging Thermal Interface Materials
- Publication number 20130221014
- Publication date Aug 29, 2013
- The Bergquist Company
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method for Packaging Thermal Interface Materials
- Publication number 20110186586
- Publication date Aug 4, 2011
- Radesh Jewram
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Thermal Interface with Non-Tacky Surface
- Publication number 20100309634
- Publication date Dec 9, 2010
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermally and electrically conductive interconnect structures
- Publication number 20090168354
- Publication date Jul 2, 2009
- Radesh Jewram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface with Non-Tacky Surface
- Publication number 20090166854
- Publication date Jul 2, 2009
- Radesh Jewram
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal interface pad utilizing low melting metal with retention ma...
- Publication number 20030187116
- Publication date Oct 2, 2003
- The Bergquist Company
- Sanjay Misra
- H01 - BASIC ELECTRIC ELEMENTS

Radesh Jewram

Person

Patents Grantslast 30 patents

Method for packaging thermal interface materials

Method for packaging thermal interface materials

Thermal interface with non-tacky surface

Thermal interface with non-tacky surface

Thermally and electrically conductive interconnect structures

Thermal interface pad utilizing low melting metal with retention ma...

Flexible surface layer film for delivery of highly filled or low cr...

Integrated release films for phase-change interfaces

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE COMPOSITION FOR HIGH TEMPERATURE APPLICATIONS

LOW THERMAL RESISTANCE PHASE CHANGE THERMAL INTERFACE MATERIALS

THERMAL INTERFACE MATERIALS AND METHODS FOR APPLICATION

THERMAL MANAGEMENT OF HIGH HEAT FLUX MULTICOMPONENT ASSEMBLY

THERMAL INTERFACE MATERIALS

Method for Packaging Thermal Interface Materials

Method for Packaging Thermal Interface Materials

Thermal Interface with Non-Tacky Surface

Thermally and electrically conductive interconnect structures

Thermal Interface with Non-Tacky Surface

Thermal interface pad utilizing low melting metal with retention ma...