Rajesh Subraya Aiyandra

Person

Ostfildern, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 11,309,255
- Issue date Apr 19, 2022
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 10,797,012
- Issue date Oct 6, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhancement of exposed die-down package
- Patent number 10,764,989
- Issue date Sep 1, 2020
- Dialog Semiconductor (UK) Limited
- Tung Ching Lui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 10,636,742
- Issue date Apr 28, 2020
- Dialog Semiconductor (US) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of cross talk in WLCSP's through laser drilled technique
- Patent number 10,607,912
- Issue date Mar 31, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of cross talk in WLCSP's through laser drilled technique
- Patent number 10,396,004
- Issue date Aug 27, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief solutions on WLCSP large/bulk copper plane design
- Patent number 10,083,926
- Issue date Sep 25, 2018
- Dialog Semiconductor (UK) Limited
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20200395325
- Publication date Dec 17, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20200227356
- Publication date Jul 16, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique
- Publication number 20190355641
- Publication date Nov 21, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Re-Routable Clip for Leadframe Based Product
- Publication number 20190259689
- Publication date Aug 22, 2019
- Dialog Semiconductor (UK) Limited
- Tung Ching Lui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique
- Publication number 20190229028
- Publication date Jul 25, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20190096815
- Publication date Mar 28, 2019
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20190067229
- Publication date Feb 28, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...
- Publication number 20180025965
- Publication date Jan 25, 2018
- Dialog Semiconductor (UK) Limited
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS

Rajesh Subraya Aiyandra

Person

Patents Grantslast 30 patents

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Very thin embedded trace substrate-system in package (SIP)

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Thermal enhancement of exposed die-down package

Very thin embedded trace substrate-system in package (SIP)

Reduction of cross talk in WLCSP's through laser drilled technique

Integrated circuit package for assembling various dice in a single...

Reduction of cross talk in WLCSP's through laser drilled technique

Integrated circuit package for assembling various dice in a single...

Stress relief solutions on WLCSP large/bulk copper plane design

Patents Applicationslast 30 patents

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

Very Thin Embedded Trace Substrate-System in Package (SIP)

Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique

Re-Routable Clip for Leadframe Based Product

Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique

Very Thin Embedded Trace Substrate-System in Package (SIP)

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

Integrated Circuit Package For Assembling Various Dice In A Single...

WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...