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Rajesh Tiwari
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Plano, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Die having coefficient of thermal expansion graded layer
Patent number
8,618,661
Issue date
Dec 31, 2013
Texas Instruments Incorporated
Brian K. Kirkpatrick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual depth trench termination method for improving Cu-based interco...
Patent number
7,387,960
Issue date
Jun 17, 2008
Texas Instruments Incorporated
Rajesh Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Versatile system for controlling semiconductor topography
Patent number
7,010,381
Issue date
Mar 7, 2006
Texas Instruments Incorporated
Nital S. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Versatile system for variance-based data analysis
Patent number
6,941,242
Issue date
Sep 6, 2005
Texas Instruments Incorporated
Nital S. Patel
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of preventing seam defects in isolated lines
Patent number
6,709,974
Issue date
Mar 23, 2004
Texas Instruments Incorporated
David Permana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
Patent number
6,573,173
Issue date
Jun 3, 2003
Motorola, Inc.
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
Patent number
6,444,569
Issue date
Sep 3, 2002
Motorola, Inc.
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
Patent number
6,274,478
Issue date
Aug 14, 2001
Motorola, Inc.
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE HAVING THROUGH-SUBSTRATE VIAS WITH DEFORMATION PROTECTED TIPS
Publication number
20140151895
Publication date
Jun 5, 2014
TEXAS INSTRUMENTS INCORPORATED
JEFFREY ALAN WEST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Post-Polymer Revealing of Through-Substrate Via Tips
Publication number
20140154880
Publication date
Jun 5, 2014
TEXAS INSTRUMENTS INCORPORATED
JEFFREY E. BRIGHTON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SILICON VIA (TSV) DIE AND METHOD TO CONTROL WARPAGE
Publication number
20140124900
Publication date
May 8, 2014
TEXAS INSTRUMENTS INCORPORATED
JEFFREY ALAN WEST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING A SEMICONDUCTOR DIE HAVING COEFFICIENT OF THERMAL EXPAN...
Publication number
20140080301
Publication date
Mar 20, 2014
Brian K. Kirkpatrick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS
Publication number
20130113103
Publication date
May 9, 2013
TEXAS INSTRUMENTS INCORPORATED
JEFFREY A. WEST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE HAVING COEFFICIENT OF THERMAL EXPANSION GRADED LAYER
Publication number
20130082385
Publication date
Apr 4, 2013
TEXAS INSTRUMENTS INCORPORATED
BRIAN K. KIRKPATRICK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POST-POLYMER REVEALING OF THROUGH-SUBSTRATE VIA TIPS
Publication number
20130062736
Publication date
Mar 14, 2013
TEXAS INSTRUMENTS INCORPORATED
JEFFREY E. BRIGHTON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL DEPTH TRENCH TERMINATION METHOD FOR IMPROVING CU-BASED INTERCO...
Publication number
20090121358
Publication date
May 14, 2009
TEXAS INSTRUMENTS INCORPORATED
Rajesh Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Versatile system for variance-based data analysis
Publication number
20050075834
Publication date
Apr 7, 2005
Nital S. Patel
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Versatile system for controlling semiconductor topography
Publication number
20050064608
Publication date
Mar 24, 2005
Nital S. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dual depth trench termination method for improving Cu-based interco...
Publication number
20050059189
Publication date
Mar 17, 2005
Rajesh Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of preventing seam defects in isolated lines
Publication number
20030199150
Publication date
Oct 23, 2003
David Permana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
Publication number
20020151167
Publication date
Oct 17, 2002
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
Publication number
20010027083
Publication date
Oct 4, 2001
Janos Farkas
H01 - BASIC ELECTRIC ELEMENTS