RAMESH R. KODNANI

Person

BROOME, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding together surfaces
- Patent number 6,835,441
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Michael A. Gaynes
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,770,968
- Issue date Aug 3, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,719,871
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,713,858
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
LCD cover optical structure and method
- Patent number 6,639,638
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- G02 - OPTICS
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,596,559
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,576,996
- Issue date Jun 10, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for making semiconductor chip assembly
- Patent number 6,517,662
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Thomas M. Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFT panel alignment and attachment method and apparatus
- Patent number 6,487,461
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Michael A. Gaynes
- G02 - OPTICS
Information Patent Grant
Selectively compliant chuck for LCD assembly
- Patent number 6,458,005
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Richard L. Baker
- G02 - OPTICS
Information Patent Grant
Bonding together surfaces
- Patent number 6,447,885
- Issue date Sep 10, 2002
- International Business Machines Corporation
- Michael A. Gaynes
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plate for liquid crystal display, method and polymeric compositions
- Patent number 6,444,407
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Richard A. Day
- G02 - OPTICS
Information Patent Grant
TFT panel alignment and attachment method and apparatus
- Patent number 6,344,099
- Issue date Feb 5, 2002
- International Business Machines Corporation
- Michael A. Gaynes
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flip-chip package with optimized encapsulant adhesion and method
- Patent number 6,248,614
- Issue date Jun 19, 2001
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding heat sinks to overmolds and device formed thereby
- Patent number 6,206,997
- Issue date Mar 27, 2001
- International Business Machines Corporation
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
TFT panel alignment and attachment method and apparatus
- Patent number 6,193,576
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Michael A. Gaynes
- G02 - OPTICS
Information Patent Grant
Bonding together surfaces
- Patent number 6,174,406
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Michael A. Gaynes
- B32 - LAYERED PRODUCTS
Information Patent Grant
TFT panel alignment and attachment method and apparatus
- Patent number 6,129,804
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Michael A. Gaynes
- B32 - LAYERED PRODUCTS
Information Patent Grant
TFT panel alignment and attachment method and apparatus
- Patent number 5,980,348
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Michael A. Gaynes
- G02 - OPTICS
Information Patent Grant
Semiconductor chip carrier assembly
- Patent number 5,973,389
- Issue date Oct 26, 1999
- International Business Machines Corporation
- Thomas M. Culnane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffeners with improved adhesion to flexible substrates
- Patent number 5,889,321
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Thomas M. Culnane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20030203535
- Publication date Oct 30, 2003
- International Business Machines Corporation
- Ramesh R. Kodnani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20030123229
- Publication date Jul 3, 2003
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROCESS FOR MAKING SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20020046804
- Publication date Apr 25, 2002
- THOMAS M. CULNANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20020005245
- Publication date Jan 17, 2002
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Flip-chip package with optimized encapsulant adhesion and method
- Publication number 20010012642
- Publication date Aug 9, 2001
- International Business Machines Corporation
- Ramesh R. Kodnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding heat sinks to overmolds and device formed thereby
- Publication number 20010001183
- Publication date May 17, 2001
- Frank D. Egitto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

RAMESH R. KODNANI

Person

Patents Grantslast 30 patents

Bonding together surfaces

Method for bonding heat sinks to overmolds and device formed thereby

Method for bonding heat sinks to overmolds and device formed thereby

Flip-chip package with optimized encapsulant adhesion and method

LCD cover optical structure and method

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby

Process for making semiconductor chip assembly

TFT panel alignment and attachment method and apparatus

Selectively compliant chuck for LCD assembly

Bonding together surfaces

Plate for liquid crystal display, method and polymeric compositions

TFT panel alignment and attachment method and apparatus

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby

TFT panel alignment and attachment method and apparatus

Bonding together surfaces

TFT panel alignment and attachment method and apparatus

TFT panel alignment and attachment method and apparatus

Semiconductor chip carrier assembly

Stiffeners with improved adhesion to flexible substrates

Patents Applicationslast 30 patents

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby

PROCESS FOR MAKING SEMICONDUCTOR CHIP ASSEMBLY

Method for bonding heat sinks to overmolds and device formed thereby

Flip-chip package with optimized encapsulant adhesion and method

Method for bonding heat sinks to overmolds and device formed thereby