RAMNATH VENKATRAMAN

Person

AUSTIN, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device including interconnect barri...
- Patent number 6,713,381
- Issue date Mar 30, 2004
- Motorola, Inc.
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,218,302
- Issue date Apr 17, 2001
- Motorola Inc.
- Gregor Braeckelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and method of formation
- Patent number 6,174,810
- Issue date Jan 16, 2001
- Motorola, Inc.
- Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a copper barrier layer and formation thereof
- Patent number 6,093,966
- Issue date Jul 25, 2000
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a multilevel interconnect
- Patent number 6,077,768
- Issue date Jun 20, 2000
- Motorola, Inc.
- T. P. Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure
- Patent number 5,814,557
- Issue date Sep 29, 1998
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a metallized interconnect
- Patent number 5,783,485
- Issue date Jul 21, 1998
- Motorola, Inc.
- T. P. Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of alloying an interconnect structure with copper
- Patent number 5,677,244
- Issue date Oct 14, 1997
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method of formation
- Publication number 20020093098
- Publication date Jul 18, 2002
- Alexander L. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER
- Publication number 20020000665
- Publication date Jan 3, 2002
- ALEXANDER L. BARR
- H01 - BASIC ELECTRIC ELEMENTS

RAMNATH VENKATRAMAN

Person

Patents Grantslast 30 patents

Method of forming semiconductor device including interconnect barri...

Method for forming a semiconductor device

Copper interconnect structure and method of formation

Semiconductor device with a copper barrier layer and formation thereof

Process for fabricating a multilevel interconnect

Method of forming an interconnect structure

Process for fabricating a metallized interconnect

Method of alloying an interconnect structure with copper

Patents Applicationslast 30 patents

Semiconductor device and method of formation

SEMICONDUCTOR DEVICE CONDUCTIVE BUMP AND INTERCONNECT BARRIER