Randle D. Burton

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio metallization structures
- Patent number 6,690,094
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures
- Patent number 6,495,921
- Issue date Dec 17, 2002
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures for shallow junction dev...
- Patent number 6,320,261
- Issue date Nov 20, 2001
- Micron Technology, Inc.
- Randle D. Burton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio metallization structures for shallow junction dev...
- Patent number 6,316,360
- Issue date Nov 13, 2001
- Micron Technology, Inc.
- Randle D. Burton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing surface charge on semiconductor wafers to preve...
- Patent number 6,258,718
- Issue date Jul 10, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-knurled induction coil for ionized metal deposition, sputtering...
- Patent number 6,168,696
- Issue date Jan 2, 2001
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures and processes for fabric...
- Patent number 6,121,134
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing surface charge on semiconducter wafers to preve...
- Patent number 6,057,235
- Issue date May 2, 2000
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
High aspect ratio metallization structures
- Publication number 20030075809
- Publication date Apr 24, 2003
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Randle D. Burton

Person

Patents Grantslast 30 patents

High aspect ratio metallization structures

High aspect ratio metallization structures

High aspect ratio metallization structures for shallow junction dev...

High aspect ratio metallization structures for shallow junction dev...

Method for reducing surface charge on semiconductor wafers to preve...

Non-knurled induction coil for ionized metal deposition, sputtering...

High aspect ratio metallization structures and processes for fabric...

Method for reducing surface charge on semiconducter wafers to preve...

Patents Applicationslast 30 patents

High aspect ratio metallization structures