Ranjul Balakrishnan

Person

Bangalore, IN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package with staggered pin pattern
- Patent number 11,600,544
- Issue date Mar 7, 2023
- Intel Corporation
- Yogasundaram Chandiran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor array and support
- Patent number 11,363,717
- Issue date Jun 14, 2022
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,734,393
- Issue date Aug 4, 2020
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic interposer for a microelectronic package
- Patent number 10,720,407
- Issue date Jul 21, 2020
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable assembly comprising a single wire coupled to a signal launche...
- Patent number 10,608,311
- Issue date Mar 31, 2020
- Intel Corporation
- Arvind Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic interposer for a microelectronic package
- Patent number 10,199,353
- Issue date Feb 5, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming package structures for enhanced memory capacity...
- Patent number 10,177,161
- Issue date Jan 8, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR-LESS M.2 MODULE
- Publication number 20230006375
- Publication date Jan 5, 2023
- Intel Corporation
- Shailendra Singh CHAUHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED GRID ARRAY MODULE
- Publication number 20220272880
- Publication date Aug 25, 2022
- Intel Corporation
- Shailendra Singh CHAUHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A LOW-NOISE-GENERATING INDUCTOR
- Publication number 20220223330
- Publication date Jul 14, 2022
- Long Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR ARRAY AND SUPPORT
- Publication number 20220078913
- Publication date Mar 10, 2022
- Intel Corporation
- Jackson Chung Peng KONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR SHIELDING AN INDUCTOR ON A CIRCUIT BOARD
- Publication number 20220015246
- Publication date Jan 13, 2022
- Intel Corporation
- Ranjul Balakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWISTED DIFFERENTIAL COMPENSATION FOR ROUTING HIGH-SPEED SIGNALS NE...
- Publication number 20210392743
- Publication date Dec 16, 2021
- Intel Corporation
- Long WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW PROFILE SODIMM (SMALL OUTLINE DUAL INLINE MEMORY MODULE)
- Publication number 20210321516
- Publication date Oct 14, 2021
- Intel Corporation
- Raghavendra RAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTIVE COUPLING STRUCTURES FOR REDUCING CROSS TALK EFFECTS IN PA...
- Publication number 20210315097
- Publication date Oct 7, 2021
- Intel Corporation
- Ranjul Balakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR WITH METAL SHIELD
- Publication number 20200373081
- Publication date Nov 26, 2020
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH STAGGERED PIN PATTERN
- Publication number 20200273765
- Publication date Aug 27, 2020
- Intel Corporation
- Yogasundaram Chandiran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190206839
- Publication date Jul 4, 2019
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE
- Publication number 20190109115
- Publication date Apr 11, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20190074281
- Publication date Mar 7, 2019
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE WIRE COMMUNICATION CABLE ASSEMBLY
- Publication number 20180241113
- Publication date Aug 23, 2018
- Intel Corporation
- Arvind Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...
- Publication number 20180182734
- Publication date Jun 28, 2018
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE
- Publication number 20180076171
- Publication date Mar 15, 2018
- Intel Corporation
- Navneet K. Singh
- H01 - BASIC ELECTRIC ELEMENTS

Ranjul Balakrishnan

Person

Patents Grantslast 30 patents

Chip package with staggered pin pattern

Inductor array and support

Methods of forming package structures for enhanced memory capacity...

Microelectronic interposer for a microelectronic package

Cable assembly comprising a single wire coupled to a signal launche...

Microelectronic interposer for a microelectronic package

Methods of forming package structures for enhanced memory capacity...

Patents Applicationslast 30 patents

CONNECTOR-LESS M.2 MODULE

HIGH SPEED GRID ARRAY MODULE

TECHNOLOGIES FOR A LOW-NOISE-GENERATING INDUCTOR

INDUCTOR ARRAY AND SUPPORT

TECHNOLOGIES FOR SHIELDING AN INDUCTOR ON A CIRCUIT BOARD

TWISTED DIFFERENTIAL COMPENSATION FOR ROUTING HIGH-SPEED SIGNALS NE...

LOW PROFILE SODIMM (SMALL OUTLINE DUAL INLINE MEMORY MODULE)

INDUCTIVE COUPLING STRUCTURES FOR REDUCING CROSS TALK EFFECTS IN PA...

INDUCTOR WITH METAL SHIELD

CHIP PACKAGE WITH STAGGERED PIN PATTERN

ELECTRONIC DEVICE PACKAGE

MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...

SINGLE WIRE COMMUNICATION CABLE ASSEMBLY

METHODS OF FORMING PACKAGE STRUCTURES FOR ENHANCED MEMORY CAPACITY...

MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE