Raschid Jose Bezama

Person

Mahopac, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid cooled compliant heat sink and related method
- Patent number 10,242,931
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooled compliant heat sink and related method
- Patent number 10,177,075
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Rinsing and drying for electrochemical processing
- Patent number 9,574,283
- Issue date Feb 21, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Rinsing and drying for electrochemical processing
- Patent number 9,222,194
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 9,035,459
- Issue date May 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 9,018,760
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Working electrode design for electrochemical processing of electron...
- Patent number 8,926,820
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 8,803,317
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Working electrode design for electrochemical processing of electron...
- Patent number 8,784,618
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package structures having liquid cooler integrated wi...
- Patent number 8,772,927
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 8,637,392
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,623,194
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,551,303
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structure and apparatus for cooling integrated circuits using coppe...
- Patent number 8,505,617
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Current spreading in organic substrates
- Patent number 8,450,619
- Issue date May 28, 2013
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked and redundant chip coolers
- Patent number 8,418,751
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structure and apparatus for cooling integrated circuits using coope...
- Patent number 8,210,243
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multi-anode system for uniform plating of alloys
- Patent number 8,177,945
- Issue date May 15, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package structures having liquid coolers integrated w...
- Patent number 8,115,303
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to control thermal gradients in semiconductor...
- Patent number 8,107,800
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microjet module assembly
- Patent number 7,992,627
- Issue date Aug 9, 2011
- International Business Machines Corporation
- Raschid J. Bezama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reducing contamination in immersion lithography
- Patent number 7,869,002
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Dmitriy Shneyder
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High power microjet cooler
- Patent number 7,802,442
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus and method for reducing contamination in immersion lithog...
- Patent number 7,787,101
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Raschid J. Bezama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Reducing contamination in immersion lithography
- Patent number 7,782,445
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Dmitriy Shneyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot pressing ceramic distortion control
- Patent number 7,708,856
- Issue date May 4, 2010
- International Business Machines Corporation
- Govindarajan Natarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for cooling an electronic device
- Patent number 7,684,194
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power microjet cooler
- Patent number 7,536,870
- Issue date May 26, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
- Publication number 20160300780
- Publication date Oct 13, 2016
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RINSING AND DRYING FOR ELECTROCHEMICAL PROCESSING
- Publication number 20160076165
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RINSING AND DRYING FOR ELECTROCHEMICAL PROCESSING
- Publication number 20160076167
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
- Publication number 20160064306
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...
- Publication number 20140077367
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRON...
- Publication number 20130062209
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS
- Publication number 20120325667
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20120187558
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure and Apparatus for Cooling Integrated Circuits Using Coppe...
- Publication number 20120175100
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS
- Publication number 20120152750
- Publication date Jun 21, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Package Structures Having Liquid Cooler Integrated wi...
- Publication number 20120049341
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Working electrode design for electrochemical processing of electron...
- Publication number 20120043216
- Publication date Feb 23, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rinsing and drying for electrochemical processing
- Publication number 20120043217
- Publication date Feb 23, 2012
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...
- Publication number 20110193218
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SPREADING IN ORGANIC SUBSTRATES
- Publication number 20110162876
- Publication date Jul 7, 2011
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...
- Publication number 20100258335
- Publication date Oct 14, 2010
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD
- Publication number 20100200197
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS
- Publication number 20100117209
- Publication date May 13, 2010
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Structure and Apparatus for Cooling Integrated Circuits Using Coope...
- Publication number 20100012294
- Publication date Jan 21, 2010
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE
- Publication number 20090303684
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Coolers Integrated w...
- Publication number 20090283902
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked and Redundant Chip Coolers
- Publication number 20090283244
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR...
- Publication number 20090175606
- Publication date Jul 9, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Cooling System with Convex Portion
- Publication number 20090109628
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROJET MODULE ASSEMBLY
- Publication number 20090095444
- Publication date Apr 16, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Solder Mold with Venting Channels and Method f...
- Publication number 20090039142
- Publication date Feb 12, 2009
- Raschid Jose Bezama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Mold With Venting Channels
- Publication number 20090039140
- Publication date Feb 12, 2009
- Raschid Jose Bezama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCING CONTAMINATION IN IMMERSION LITHOGRAPHY
- Publication number 20080284993
- Publication date Nov 20, 2008
- International Business Machines Corporation
- Dmitriy Shneyder
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Raschid Jose Bezama

Person

Patents Grantslast 30 patents

Liquid cooled compliant heat sink and related method

Liquid cooled compliant heat sink and related method

Rinsing and drying for electrochemical processing

Rinsing and drying for electrochemical processing

Structures for improving current carrying capability of interconnec...

Solder interconnect with non-wettable sidewall pillars and methods...

Working electrode design for electrochemical processing of electron...

Structures for improving current carrying capability of interconnec...

Working electrode design for electrochemical processing of electron...

Semiconductor package structures having liquid cooler integrated wi...

Structures and methods to reduce maximum current density in a solde...

Solder interconnect with non-wettable sidewall pillars and methods...

Multi-anode system for uniform plating of alloys

Multi-anode system for uniform plating of alloys

Structure and apparatus for cooling integrated circuits using coppe...

Current spreading in organic substrates

Structures and methods to reduce maximum current density in a solde...

Stacked and redundant chip coolers

Structure and apparatus for cooling integrated circuits using coope...

Multi-anode system for uniform plating of alloys

Semiconductor package structures having liquid coolers integrated w...

Method and structure to control thermal gradients in semiconductor...

Microjet module assembly

Reducing contamination in immersion lithography

High power microjet cooler

Apparatus and method for reducing contamination in immersion lithog...

Reducing contamination in immersion lithography

Hot pressing ceramic distortion control

Systems and methods for cooling an electronic device

High power microjet cooler

Patents Applicationslast 30 patents

LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD

RINSING AND DRYING FOR ELECTROCHEMICAL PROCESSING

RINSING AND DRYING FOR ELECTROCHEMICAL PROCESSING

LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD

SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRON...

MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

Structure and Apparatus for Cooling Integrated Circuits Using Coppe...

MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS

Semiconductor Package Structures Having Liquid Cooler Integrated wi...

Working electrode design for electrochemical processing of electron...

Rinsing and drying for electrochemical processing

Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...

CURRENT SPREADING IN ORGANIC SUBSTRATES

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

STRUCTURES FOR IMPROVING CURRENT CARRYING CAPABILITY OF INTERCONNEC...

LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD

MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS

Structure and Apparatus for Cooling Integrated Circuits Using Coope...

SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE

Semiconductor Package Structures Having Liquid Coolers Integrated w...

Stacked and Redundant Chip Coolers

METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR...

Chip Cooling System with Convex Portion

MICROJET MODULE ASSEMBLY

Method for Forming a Solder Mold with Venting Channels and Method f...

Solder Mold With Venting Channels

REDUCING CONTAMINATION IN IMMERSION LITHOGRAPHY