Ray Chuang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for preventing copper peeling in ECP
- Patent number 7,667,835
- Issue date Feb 23, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Post ECP multi-step anneal/H2 treatment to reduce film impurity
- Patent number 7,432,192
- Issue date Oct 7, 2008
- Taiwan Semiconductor Manufacturing Company
- Hsien-Ping Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce Rs pattern dependence effect
- Patent number 7,208,404
- Issue date Apr 24, 2007
- Taiwan Semiconductor Manufacturing Company
- Jung-Chih Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing the pattern effect in the CMP process
- Patent number 7,183,199
- Issue date Feb 27, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly having disassembling device
- Patent number 7,102,871
- Issue date Sep 5, 2006
- Taiwan Semiconductor Manufacturing Co,, Ltd.
- Cheng-Liang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post ECP multi-step anneal/H2 treatment to reduce film impurity
- Patent number 7,030,016
- Issue date Apr 18, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ping Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of reducing oxygen content in ECP solution
- Publication number 20080067076
- Publication date Mar 20, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Yuan Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for preventing copper peeling in ECP
- Publication number 20080047827
- Publication date Feb 28, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Systems and methods for wafer cleaning
- Publication number 20070006405
- Publication date Jan 11, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ping Feng
- B08 - CLEANING
Information Patent Application
Method for fabricating metal layer
- Publication number 20060219566
- Publication date Oct 5, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electrochemical plating on semiconductor wafers
- Publication number 20060213778
- Publication date Sep 28, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Post ECP multi-step anneal/H2 treatment to reduce film impurity
- Publication number 20060216930
- Publication date Sep 28, 2006
- Hsien-Ping Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization target optimization method providing enhanced metalli...
- Publication number 20060196765
- Publication date Sep 7, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Post ECP multi-step anneal/H2 treatment to reduce film impurity
- Publication number 20050227479
- Publication date Oct 13, 2005
- Taiwan Semiconductor Manufacturing Co.
- Hsien-Ping Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thrust pad assembly for ECP system
- Publication number 20050121329
- Publication date Jun 9, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Chih Tsao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of reducing the pattern effect in the CMP process
- Publication number 20050118808
- Publication date Jun 2, 2005
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic chuck assembly having disassembling device
- Publication number 20050094349
- Publication date May 5, 2005
- Cheng-Liang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel method to reduce Rs pattern dependence effect
- Publication number 20050085066
- Publication date Apr 21, 2005
- Taiwan Semicondutor Manufacturing Co.
- Jung-Chih Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus and method for preventing copper peeling in ECP

Post ECP multi-step anneal/H2 treatment to reduce film impurity

Method to reduce Rs pattern dependence effect

Method of reducing the pattern effect in the CMP process

Electrostatic chuck assembly having disassembling device

Post ECP multi-step anneal/H2 treatment to reduce film impurity

Patents Applicationslast 30 patents

Method of reducing oxygen content in ECP solution

Apparatus and method for preventing copper peeling in ECP

Systems and methods for wafer cleaning

Method for fabricating metal layer

Method for electrochemical plating on semiconductor wafers

Post ECP multi-step anneal/H2 treatment to reduce film impurity

Metallization target optimization method providing enhanced metalli...

Post ECP multi-step anneal/H2 treatment to reduce film impurity

Thrust pad assembly for ECP system

Method of reducing the pattern effect in the CMP process

Electrostatic chuck assembly having disassembling device

Novel method to reduce Rs pattern dependence effect