Raymond A. Jackson

Person

Dutchess County, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for removing interconnects to separate two parts of a wor...
- Patent number 7,882,623
- Issue date Feb 8, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework using a continuous belt furnace
- Patent number 7,452,215
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework using a continuous belt furnace
- Patent number 7,299,530
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rework methods for lead BGA/CGA
- Patent number 6,719,188
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy-siloxanes based electrically conductive adhesives for semicon...
- Patent number 6,548,175
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Single-melt enhanced reliability solder element interconnect
- Patent number 6,541,305
- Issue date Apr 1, 2003
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of conductive adhesive to form temporary electrical connections...
- Patent number 6,528,352
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Raymond A. Jackson
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for removing interconnections
- Patent number 6,497,357
- Issue date Dec 24, 2002
- International Business Machines Corporation
- Raymond A. Jackson
- B08 - CLEANING
Information Patent Grant
Conductive adhesive interconnection with insulating polymer carrier
- Patent number 6,458,623
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,360,938
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Baseplate for chip burn-in and/of testing, and method thereof
- Patent number 6,335,210
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Mukta S. Farooq
- G01 - MEASURING TESTING
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder disc connection
- Patent number 6,278,184
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer enhanced column grid array
- Patent number 6,259,155
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Mario John Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,253,986
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkability method for wirebond chips using high performance capa...
- Patent number 6,226,863
- Issue date May 8, 2001
- International Business Machines Corporation
- Mukta Shaji Farooq
- G01 - MEASURING TESTING
Information Patent Grant
Process and apparatus to remove closely spaced chips on a multi-chi...
- Patent number 6,216,937
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Stephen A. DeLaurentis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 6,070,782
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder disc connection
- Patent number 6,070,321
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkability solution for wirebound chips using high performance c...
- Patent number 6,015,955
- Issue date Jan 18, 2000
- International Business Machines Corporation
- Mukta Shaji Farooq
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic ball grid array using in-situ solder stretch
- Patent number 5,975,409
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,968,670
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced ceramic ball grid array using in-situ solder stretch with...
- Patent number 5,964,396
- Issue date Oct 12, 1999
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 5,868,304
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Peter Jeffrey Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ device removal for multi-chip modules
- Patent number 5,779,133
- Issue date Jul 14, 1998
- International Business Machines Corporation
- Raymond Alan Jackson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hot vacuum device removal process and apparatus
- Patent number 5,605,277
- Issue date Feb 25, 1997
- International Business Machines Corporation
- Raymond A. Jackson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-situ device removal for multi-chip modules
- Patent number 5,553,766
- Issue date Sep 10, 1996
- International Business Machines Corporation
- Raymond A. Jackson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for repairing electrical lines
- Patent number 5,543,584
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Edward F. Handford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
- Publication number 20080271312
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE
- Publication number 20070271775
- Publication date Nov 29, 2007
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball grid array rework using a continuous belt furnace
- Publication number 20050071993
- Publication date Apr 7, 2005
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rework methods for lead BGA/CGA
- Publication number 20030019918
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Mukta G. Farooq
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SINGLE-MELT ENHANCED RELIABILITY SOLDER ELEMENT INTERCONNECT
- Publication number 20030003624
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING INTERCONNECTIONS
- Publication number 20020162880
- Publication date Nov 7, 2002
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy-siloxanes based electrically conductive adhesives for semicon...
- Publication number 20020127406
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Krishna G. Sachdev
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive interconnection with insulating polymer carrier
- Publication number 20020093104
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Lewis S. Goldmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus to remove closely spaced chips on a multi-chi...
- Publication number 20010006188
- Publication date Jul 5, 2001
- Stephen A. DeLaurentis
- H01 - BASIC ELECTRIC ELEMENTS

Raymond A. Jackson

Person

Patents Grantslast 30 patents

Apparatus for removing interconnects to separate two parts of a wor...

Ball grid array rework using a continuous belt furnace

Ball grid array rework using a continuous belt furnace

Rework methods for lead BGA/CGA

Epoxy-siloxanes based electrically conductive adhesives for semicon...

Single-melt enhanced reliability solder element interconnect

Use of conductive adhesive to form temporary electrical connections...

Apparatus and method for removing interconnections

Conductive adhesive interconnection with insulating polymer carrier

Process and apparatus to remove closely spaced chips on a multi-chi...

Baseplate for chip burn-in and/of testing, and method thereof

Electrical interconnection package and method thereof

Method for enhancing fatigue life of ball grid arrays

Solder disc connection

Polymer enhanced column grid array

Solder disc connection

Reworkability method for wirebond chips using high performance capa...

Process and apparatus to remove closely spaced chips on a multi-chi...

Method for enhancing fatigue life of ball grid arrays

Socketable bump grid array shaped-solder on copper spheres

Solder disc connection

Reworkability solution for wirebound chips using high performance c...

Ceramic ball grid array using in-situ solder stretch

Enhanced ceramic ball grid array using in-situ solder stretch with...

Enhanced ceramic ball grid array using in-situ solder stretch with...

Socketable bump grid array shaped-solder on copper spheres

In-situ device removal for multi-chip modules

Hot vacuum device removal process and apparatus

In-situ device removal for multi-chip modules

Structure for repairing electrical lines

Patents Applicationslast 30 patents

BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE

BALL GRID ARRAY REWORK USING A CONTINUOUS BELT FURNACE

Ball grid array rework using a continuous belt furnace

Rework methods for lead BGA/CGA

SINGLE-MELT ENHANCED RELIABILITY SOLDER ELEMENT INTERCONNECT

APPARATUS AND METHOD FOR REMOVING INTERCONNECTIONS

Epoxy-siloxanes based electrically conductive adhesives for semicon...

Conductive adhesive interconnection with insulating polymer carrier

Process and apparatus to remove closely spaced chips on a multi-chi...