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Reimar Heucher

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  • Pulheim, DE
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Patents Grantslast 30 patents

  • Information Patent Grant

    Debondable reactive hot melt adhesives
    • Patent number 10,800,956
    • Issue date Oct 13, 2020
    • Henkel AG & Co. KGaA
    • Reimar Heucher
    • C07 - ORGANIC CHEMISTRY
  • Information Patent Grant

    Electrical debonding of PU hot melt adhesives by use of conductive...
    • Patent number 10,590,310
    • Issue date Mar 17, 2020
    • Henkel AG & Co. KGaA
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Filling compound
    • Patent number 6,258,885
    • Issue date Jul 10, 2001
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Moisture curable hot melt adhesive and method for bonding substrate...
    • Patent number 6,221,978
    • Issue date Apr 24, 2001
    • Henkel Corporation
    • Yingjie Li
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Aqueous polyamide dispersion composition
    • Patent number 6,077,900
    • Issue date Jun 20, 2000
    • Cognis Corporation
    • Chase J. Boudreaux
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Filling compound
    • Patent number 5,902,849
    • Issue date May 11, 1999
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Polyamide hotmelt adhesive
    • Patent number 5,883,172
    • Issue date Mar 16, 1999
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Polyamide based on dimer fatty acid
    • Patent number 5,719,255
    • Issue date Feb 17, 1998
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Hotmelt adhesive
    • Patent number 5,548,027
    • Issue date Aug 20, 1996
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Moisture-curing polyamides
    • Patent number 5,519,109
    • Issue date May 21, 1996
    • Henkel Kommanditgesellschaft auf Aktien
    • Hans-Georg Kinzelmann
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Plug-type connector for coaxial cables
    • Patent number 5,510,405
    • Issue date Apr 23, 1996
    • Henkel Kommanditgesellschaft auf Aktien
    • Reimar Heucher
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lyo gel, its production and its use for sealing
    • Patent number 5,412,022
    • Issue date May 2, 1995
    • Henkel Kommanditgesellschaft auf Aktien
    • Johannes Andres
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

  • Information Patent Application

    Electrical Debonding of PU Hot Melt Adhesives By Use of Conductive...
    • Publication number 20180340097
    • Publication date Nov 29, 2018
    • Henkel AG & Co. KGaA
    • Reimar Heucher
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Debondable Reactive Hot Melt Adhesives
    • Publication number 20170355892
    • Publication date Dec 14, 2017
    • Henkel AG & Co. KGaA
    • Reimar Heucher
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Polyamide Hot Melt Coating
    • Publication number 20170158909
    • Publication date Jun 8, 2017
    • Henkel AG & Co. KGaA
    • Luca Marchese
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE
    • Publication number 20140374032
    • Publication date Dec 25, 2014
    • Reimar Heucher
    • B32 - LAYERED PRODUCTS