Reimund Engl

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a chip package with compounds to improve the dur...
- Patent number 10,672,678
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package comprising a chemical compound and a method of forming...
- Patent number 10,497,634
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 9,941,181
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,059,083
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection layers for conductive pads and methods of formation thereof
- Patent number 8,835,319
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,642,408
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method for the production thereof
- Patent number 8,330,252
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including isolation layer
- Patent number 8,110,906
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module comprising surfac...
- Patent number 7,955,901
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a metallic carrier and two semiconductor...
- Patent number 7,868,465
- Issue date Jan 11, 2011
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,705,441
- Issue date Apr 27, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with leadframe including a diffusion barrier
- Patent number 7,675,146
- Issue date Mar 9, 2010
- Infineon Technologies AG
- Reimund Engl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pentaarylcyclopentadienyl units as active units in resistive memory...
- Patent number 7,417,247
- Issue date Aug 26, 2008
- Infineon Technologies, AG
- Günter Schmid
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Memory cell, method for the production thereof and use of a composi...
- Patent number 7,238,964
- Issue date Jul 3, 2007
- Infineon Technologies AG
- Andreas Walter
- G11 - INFORMATION STORAGE
Information Patent Grant
Resistive memory for low-voltage applications
- Patent number 7,211,856
- Issue date May 1, 2007
- Infineon Technologies AG
- Recai Sezi
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
- Publication number 20200013749
- Publication date Jan 9, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A CHIP PACKAGE
- Publication number 20190287875
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338165
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20170338169
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20170338164
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Heinrich Koerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150279782
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20140319688
- Publication date Oct 30, 2014
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layers for Conductive Pads and Methods of Formation Thereof
- Publication number 20130228929
- Publication date Sep 5, 2013
- INFINEON TECHNOLOGIES AG
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110189821
- Publication date Aug 4, 2011
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...
- Publication number 20090093090
- Publication date Apr 9, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090072379
- Publication date Mar 19, 2009
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LEADERFRAME INCLUDING A DIFFUSION BARRIER
- Publication number 20090065914
- Publication date Mar 12, 2009
- INFINEON TECHNOLOGIES AG
- Reimund Engl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080296782
- Publication date Dec 4, 2008
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20080246137
- Publication date Oct 9, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20080220564
- Publication date Sep 11, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement Having a Resistive Memory
- Publication number 20080191197
- Publication date Aug 14, 2008
- QIMONDA AG
- Andreas Walter
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER
- Publication number 20080173992
- Publication date Jul 24, 2008
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Having Resistive Memory
- Publication number 20080142774
- Publication date Jun 19, 2008
- QIMONDA AG
- Andreas Walter
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Component Arrangement
- Publication number 20080061449
- Publication date Mar 13, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor arrangement with non-volatile memories
- Publication number 20070194301
- Publication date Aug 23, 2007
- Recai Sezi
- G11 - INFORMATION STORAGE
Information Patent Application
Method for Forming Memory Layers
- Publication number 20070164276
- Publication date Jul 19, 2007
- Qimonda AG
- Reimund Engl
- G11 - INFORMATION STORAGE
Information Patent Application
Material and cell structure for storage applications
- Publication number 20060237716
- Publication date Oct 26, 2006
- Recai Sezi
- B82 - NANO-TECHNOLOGY
Information Patent Application
Pentaarylcyclopentadienyl units as active units in resistive memory...
- Publication number 20050213413
- Publication date Sep 29, 2005
- Gunter Schmid
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resistive memory for low-voltage applications
- Publication number 20050186737
- Publication date Aug 25, 2005
- Recai Sezi
- G11 - INFORMATION STORAGE
Information Patent Application
Memory cell, method for the production thereof and use of a composi...
- Publication number 20050179033
- Publication date Aug 18, 2005
- Andreas Walter
- G11 - INFORMATION STORAGE

Reimund Engl

Person

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Method of forming an electrical contact and method of forming a chi...

Method for forming a chip package with compounds to improve the dur...

Chip package comprising a chemical compound and a method of forming...

Chip package and method of forming a chip package with a metal cont...

Chip package and method of forming a chip package

Semiconductor device

Protection layers for conductive pads and methods of formation thereof

Semiconductor device

Integrated circuit device and method for the production thereof

Semiconductor device including isolation layer

Method for producing a power semiconductor module comprising surfac...

Semiconductor device with a metallic carrier and two semiconductor...

Semiconductor module

Semiconductor device with leadframe including a diffusion barrier

Pentaarylcyclopentadienyl units as active units in resistive memory...

Memory cell, method for the production thereof and use of a composi...

Resistive memory for low-voltage applications

Patents Applicationslast 30 patents

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...

METHODS FOR FORMING A CHIP PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR DEVICE

Protection Layers for Conductive Pads and Methods of Formation Thereof

Protection Layers for Conductive Pads and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE COMPRISING SURFAC...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH LEADERFRAME INCLUDING A DIFFUSION BARRIER

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD FOR THE PRODUCTION THEREOF

Semiconductor module

Semiconductor Arrangement Having a Resistive Memory

SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER

Integrated Circuit Having Resistive Memory

Semiconductor Component Arrangement

Semiconductor arrangement with non-volatile memories

Method for Forming Memory Layers

Material and cell structure for storage applications

Pentaarylcyclopentadienyl units as active units in resistive memory...

Resistive memory for low-voltage applications

Memory cell, method for the production thereof and use of a composi...